Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, 0.540 X 0.300 INCH, 0.100 INCH HEIGHT, FP-20
| 参数名称 | 属性值 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 其他特性 | BROADSIDE VERSION OF 374; IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V |
| 系列 | FCT |
| JESD-30 代码 | R-XDFP-F20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 传播延迟（tpd） | 7.2 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 2.3368 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.9215 mm |
| Base Number Matches | 1 |
| 5962-8951302SX | 5962-89513022X | 5962-8951302RX | |
|---|---|---|---|
| 描述 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, 0.540 X 0.300 INCH, 0.100 INCH HEIGHT, FP-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, 0.358 X 0.358 INCH, 0.100 INCH HEIGHT, LCC-20 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, 1.060 X 0.310 INCH, 0.200 INCH HEIGHT, DIP-20 |
| 零件包装代码 | DFP | QLCC | DIP |
| 包装说明 | DFP, | QCCN, | DIP, |
| 针数 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown |
| 其他特性 | BROADSIDE VERSION OF 374; IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V | BROADSIDE VERSION OF 374; IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V | BROADSIDE VERSION OF 374; IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V |
| 系列 | FCT | FCT | FCT |
| JESD-30 代码 | R-XDFP-F20 | S-XQCC-N20 | R-XDIP-T20 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | DFP | QCCN | DIP |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | CHIP CARRIER | IN-LINE |
| 传播延迟（tpd） | 7.2 ns | 7.2 ns | 7.2 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 2.3368 mm | 2.54 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | NO LEAD | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | DUAL |
| 宽度 | 6.9215 mm | 8.89 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 |
| 长度 | - | 8.89 mm | 25.3365 mm |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED |
Microchip MCU
无线连接
LED专区
模拟与混合信号
PCB设计
聊聊、笑笑、闹闹
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
