19-1624; Rev 0; 3/00
UAL
IT MAN
TION K
A
SHEET
EVALU
S DATA
W
FOLLO
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
MAX2240
Features
o
2.4GHz to 2.5GHz Frequency Range
o
High +20dBm Output Power
o
2-Bit Digital Power Control: 4 Output Levels
o
Integrated Input Match to 50Ω
o
Low 105mA Operating Current
o
0.5µA Low-Power Shutdown Mode Current
o
+2.7V to +5V Single-Supply Operation
o
Ultra-Chipscale Package
(1.56mm x 1.56mm)
General Description
The MAX2240 single-supply, low-voltage power amplifi-
er (PA) IC is designed specifically for applications in
the 2.4GHz to 2.5GHz frequency band. The PA is com-
pliant with Bluetooth, HomeRF, and 802.11 standards,
as well as other FSK modulation systems. The PA pro-
vides a nominal +20dBm (100mW) output power in the
highest power mode.
The PA includes a digital power control circuit to greatly
simplify control of the output power. Four digitally con-
trolled output power levels are provided: from +3dBm
to +20dBm. A digital input controls the active or shut-
down operating modes of the PA. In the shutdown
mode, the current reduces to 0.5µA.
The IC integrates the RF input and interstage matching
to simplify application of the IC. Temperature and sup-
ply-independent biasing are also included to provide
stable performance under all operating conditions.
The IC operates from a +2.7V to +5V single-supply volt-
age. No negative bias voltage is required. Current con-
sumption is a modest 105mA at the highest power
level.
The part is packaged in the ultra-chipscale package
(UCSP), significantly reducing the required PC board
area. The chip occupies only a 1.56mm x 1.56mm area.
The 3 x 3 array of solder bumps are spaced with a
0.5mm bump pitch.
Ordering Information
PART
MAX2240EBL
TEMP. RANGE
-40°C to +85°C
PIN-PACKAGE
9 UCSP*
*UCSP reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. Refer to the
UCSP Reliability Notice in the UCSP Reliability section of this
data sheet for more information.
Pin Configuration appears at end of data sheet.
________________________Applications
Bluetooth
HomeRF
802.11 FHSS WLAN
2.4GHz ISM Proprietary Radios
Typical Application Circuit/Functional Diagram
V
CC
220 pF
1.2nH* (BOARD TRACE)
BIAS
LOGIC INPUTS
D0
D1
SHDN
RFIN
BIAS &
POWER
CONTROL
MATCH
RFOUT
GND1
*INDUCTANCE CREATED WITH PC BOARD TRANSMISSION LINE
(SEE
APPLICATIONS
SECTION).
GND2
65Ω
θ
= 41°
10pF
V
CC
22nH
V
CC
18pF
V
CC
75Ω
θ
= 26°
RFOUT
________________________________________________________________
Maxim Integrated Products
1
For free samples and the latest literature, visit www.maxim-ic.com or phone 1-800-998-8800.
For small orders, phone 1-800-835-8769.
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
MAX2240
ABSOLUTE MAXIMUM RATINGS
BIAS, V
CC
, RFOUT to GND ......................................-0.3V to +6V
Input Voltages
(SHDN, D0, D1, to GND).......................-0.3V to (V
BIAS
+ 0.3V)
(RFIN to GND) ....................................................-0.7V to +0.7V
Input Current (SHDN, D0, D1) ..........................................±10mA
RF Input Power (RFIN)....................................................+10dBm
Continuous Power Dissipation (T
A
= +85°C)
9-Pin UCSP...................................................................810mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-65°C to +150°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(Using
Typical Application Circuit,
V
CC
= +2.7V to +5V, P
RFIN
= 0dBm to +4dBm, f
RFIN
= 2.4GHz to 2.5GHz,
SHDN
= V
CC
,
T
A
= -40°C to +85°C. Typical values measured at V
CC
= +3.2V, P
RFIN
= +3dBm, f
RFIN
= 2.45GHz, T
A
= +25°C, unless otherwise
noted.) (Note 1)
PARAMETER
CONDITIONS
V
DI
≤
0.8V, V
DO
≤
0.8V, T
A
= +25°C, P
RFIN
= +3dBm,
V
CC
= 3.2V, f
RFIN
= 2.45GHz (Note 3)
V
DI
≤
0.8V, V
DO
≤
0.8V
V
DI
≤
0.8V, V
DO
≥
2.0V, T
A
= +25°C, P
RFIN
= +3dBm,
V
CC
= 3.2V, f
RFIN
= 2.45GHz (Note 3)
MIN
TYP
65
MAX
80
110
UNITS
68
85
111
mA
Supply Current
(Note 2)
V
DI
≤
0.8V, V
DO
≥
2.0V
V
DI
≥
2.0V, V
DO
≤
0.8V, T
A
= +25°C, P
RFIN
= +3dBm,
V
CC
= 3.2V, f
RFIN
= 2.45GHz (Note 3)
V
DI
≥
2.0V, V
DO
≤
0.8V
V
DI
≥
2.0V, V
DO
≥
2.0V, T
A
= +25°C, P
RFIN
= +3dBm,
V
CC
= 3.2V, f
RFIN
= 2.45GHz (Note 3)
V
DI
≥
2.0V, V
DO
≥
2.0V
105
75
90
115
125
155
Shutdown Supply Current
Input Logic Voltage High
Input Logic Voltage Low
Input Current
SHDN
≤
0.8V, VD0
≤
0.8V, VD1
≤
0.8V, no input signal
2
0.5
10.0
µA
V
DIGITAL CONTROL INPUT (D0, D1, AND SHDN)
0.8
GND
≤
V
IN
≤
V
BIAS
1
1
V
µA
2
_______________________________________________________________________________________
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
AC ELECTRICAL CHARACTERISTICS
(MAX2240 EV kit, V
CC
= +2.7V to +5V, P
RFIN
= 0dBm to +4dBm, f
RFIN
= 2.4GHz to 2.5GHz,
SHDN
= V
CC
, T
A
= +25°C. Typical values
measured at V
CC
= +3.2V, P
RFIN
= +3dBm, f
RFIN
= 2.45GHz, unless otherwise noted.)
PARAMETERS
Frequency Range
Input Power Range
V
D1
≤
0.8V, V
D0
≤
0.8V
Output Power
V
D1
≤
0.8V, V
D0
≥
2V
V
D1
≥
2V, V
D0
≤
0.8V
V
D1
≥
2V, V
D0
≥
2V, T
A
= -40°C to +85°C (Note 1)
Power Control Steps
(Notes 4, 9)
Harmonic Output (Notes 3, 9)
Input VSWR (Note 9)
In-Band Spurious Noise
(Notes 5, 9)
Power Ramp Turn-On Time
(Notes 6, 9)
Power Ramp Turn-Off Time
(Notes 7, 9)
Nonharmonic Spurious Output
(Note 9)
Input to Output Isolation in
Shutdown
Maximum Output VSWR Without
Damage (Note 8)
All power levels set by D0, D1;
any load phase angle, any duration
R
S
= 50Ω, over full P
in
range
Frequency offset = ±550kHz
Frequency offset = ±1.5MHz
Frequency offset = ±2.5MHz
SHDN
= 0 to 1, D0 = D1 = logic low-to-high transition
SHDN
= 1 to 0, D0 = D1 = logic high-to-low transition
All power levels set by D0, D1; load VSWR
≤
3:1
45
6:1
V
CC
= 5.0V
V
CC
= 2.7V to 5.0V
15.3
2
2
-15
1.5:1
-21
-20
-40
2
2
-30
CONDITIONS
MIN
2400
0
3
8
12
19
6
24
8
8.6
-5
2:1
-20
dB
dBm
dBm
dBc
dBm
µs
µs
dBm
dB
dBm
TYP
MAX
2500
4
UNITS
MHz
dBm
MAX2240
Note 1:
Limits are 100% production tested at T
A
= +25°C. Limits over the entire operating temperature range are guaranteed by
design and characterization but are not production tested.
Note 2:
Supply current is measured with RF power applied to the input.
Note 3:
Measured with an output-matching network to minimize the 2nd and 3rd harmonics (see
Applications
section).
Note 4:
Power steps between adjacent power levels. All other operating conditions remain constant during power step change.
Note 5:
Output measured in 100kHz RBW. Test signal modulation shall comply with GFSK, BT = 0.5, 1-bit/symbol, 1Mbps, frequency
deviation = 175kHz.
Note 6:
The total turn-on time for the PA output power to settle within 1dB of the final value.
Note 7:
The total turn-off time for the PA output power to drop to -10dBm.
Note 8:
After removal of the load mismatch, the PA returns to operation under normal conditions.
Note 9:
Guaranteed by design and characterization.
_______________________________________________________________________________________
3
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
MAX2240
Typical Operating Characteristics
(MAX2240 EV kit, V
CC
= +3.2V, P
RFIN
= +3dBm, f
RFIN
= 2.45GHz,
SHDN
= V
CC
, T
A
= +25°C, unless otherwise noted. See Table 1
for power level settings P1, P2, P3, P4.)
OUTPUT POWER vs. FREQUENCY
MAX2240 toc05
OUTPUT POWER vs. TEMPERATURE
MAX2240 toc06
OUTPUT POWER vs. SUPPLY VOLTAGE
MAX2240 toc02
25
P4
25
25
P4
20
OUTPUT POWER (dBm)
20
OUTPUT POWER (dBm)
P4
20
OUTPUT POWER (dBm)
15
P3
P2
15
P3
10
P2
5
P1
15
P3
P2
10
10
5
P1
5
P1
0
2400
2420
2440
2460
2480
2500
FREQUENCY (MHz)
0
-40
-20
0
20
40
60
80
TEMPERATURE (°C)
0
2.5
3.0
3.5
4.0
4.5
5.0
SUPPLY VOLTAGE (V)
OUTPUT POWER vs. INPUT POWER
MAX2240 toc07
OUTPUT POWER vs.
PINC2 VOLTAGE
MAX2240 toc04
SUPPLY CURRENT vs. INPUT POWER
110
SUPPLY CURRENT (mA)
100
90
80
70
60
50
40
0
1
2
3
4
5
P1
P3
P2
P4
MAX2240 toc08
MAX2240 toc09
25
20
OUTPUT POWER (dBm)
15
10
5
P2
0
-5
-10
-15
-5
-3
-1
1
3
5
INPUT POWER (dBm)
P1
P3
P4
25
20
15
OUTPUT POWER (dBm)
10
5
0
-5
-10
-15
-20
1.0
1.5
2.0
2.5
V
PINC2
(V)
3.0
P3
P2
P1
P4
120
3.5
INPUT POWER (dBm)
SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX2240 toc08
SHUTDOWN SUPPLY CURRENT
vs. TEMPERATURE
90
80
SUPPLY CURRENT (nA)
70
60
50
40
30
20
10
V
CC
= 3.2V
V
CC
= 2.7V
-40
-20
0
20
40
60
80
100
V
CC
= 5.0V
SHDN = D0 = D1 = GND
MAX2240 toc01
FSK MODULATED OUTPUT SPECTRUM
30
20
10
OUTPUT POWER (dBm)
0
-10
-20
-30
-40
-50
-60
-70
PEAK DEV =
±175kHz
BT = 0.5
1Msps
CENTER = 2.45GHz
SPAN = 5MHz
120
100
SUPPLY CURRENT (mA)
80
60
40
20
0
2.5
3.0
3.5
4.0
4.5
P4
100
P3
P2
P1
0
5.0
SUPPLY VOLTAGE (V)
TEMPERATURE (°C)
4
_______________________________________________________________________________________
2.5GHz, +20dBm Power Amplifier IC
in UCSP Package
Typical Operating Characteristics (continued)
(MAX2240 EV kit, V
CC
= +3.2V, P
RFIN
= +3dBm, f
RFIN
= 2.45GHz,
SHDN
= V
CC
, T
A
= +25°C, unless otherwise noted. See Table 1
for power level settings P1, P2, P3, P4.)
S
11
MAX2240 toc11
MAX2240
HARMONIC OUTPUT SPECTRUM
MAX2240 toc10
POWER-ON/OFF CHARACTERISTICS
20
OUTPUT POWER (dBm)
10
0
-10
-20
-30
-40
-50
-60
MAX2240 toc12
30
20
10
OUTPUT POWER (dBm)
30
0
-10
-20
-30
-40
-50
-60
-70
START = 1.0GHz
STOP = 13.0GHz
START = 2400MHz
STOP = 2500MHz
5f
0
f
0
2f
0
3f
0
4f
0
-70
200ns/div
Pin Description
PIN
C3
C2
C1
B3
B2
B1
A3
A2
A1
NAME
RFIN
V
CC
GND2
GND1
SHDN
RFOUT
BIAS
D1
D0
FUNCTION
Power Amplifier RF Input. Internally DC blocked and matched to 50Ω.
DC Voltage Supply for 1st Stage. A 1.2nH series inductance required for optimum output power and effi-
ciency, followed by an external RF bypass capacitor to ground.
Ground Connection to the Amplifier 2nd Stage. Requires a low-inductance/low thermal resistance path to
the ground plane with multiple vias.
Ground Connection for Bias and 1st Stage. Requires a low-inductance/low thermal resistance path to the
ground plane with multiple vias.
Power Amplifier Shutdown Control Input. Drive
SHDN
low to enable low-power shutdown mode. Drive
SHDN
high for normal operation.
Power Amplifier RF Output. Open-collector output requires external pull-up inductor to V
CC
. Requires an
external matching network for optimum output power and efficiency.
DC Voltage Supply for Bias and Control Circuitry. An external RF bypass capacitor to ground is required.
Place capacitor as close to the pin as possible.
Digital Power Control Input (MSB) (Table 1)
Digital Power Control Input (LSB) (Table 1)
_______________Detailed Description
The MAX2240 PA is guaranteed to operate over a
2.4GHz to 2.5GHz frequency range with a +2.7V to
+5V single supply. The PA provides a nominal +20dBm
output power in the highest power mode setting (D0 =
D1 = 1). The signal path consists of two amplifier
stages: an input amplifier stage and a PA stage. A
matching circuit is provided between the two stages to
match the amplifiers’ impedance. The PA also contains
bias circuits that interface to external logic commands
(D0, D1, and
SHDN)
to control output power and
power-up/down of the amplifier.
The input amplifier is an AC-coupled variable gain
amplifier (VGA) with its input port internally matched to
50Ω. The amplifier is AC-coupled; hence, a DC block-
ing capacitor is not required at the RFIN port. The VGA
gain is varied by changing the bias current through a
current driver circuit. The current driver circuit provides
5
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