Complete, +5V-Powered, Isolated, Dual RS-232 Transceiver Module
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | PLASTIC, MODULE, DIP-40 |
| 针数 | 40 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 其他特性 | ISOLATED DATA INTERFACE; INTENDED FOR LESS STRINGENT APPLICATIONS |
| 差分输出 | NO |
| 驱动器位数 | 2 |
| 输入特性 | SCHMITT TRIGGER |
| 接口集成电路类型 | LINE TRANSCEIVER |
| 接口标准 | EIA-232-D; V.28 |
| JESD-30 代码 | R-PDIP-T40 |
| JESD-609代码 | e0 |
| 长度 | 52.075 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 40 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最小输出摆幅 | 10 V |
| 输出特性 | 3-STATE |
| 最大输出低电流 | 0.0032 A |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP40,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大接收延迟 | |
| 接收器位数 | 2 |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 90 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 15.24 mm |
| MAX252BEHL | MAX252 | MAX252BCHL | MAX252AEHG | MAX252ACHL | |
|---|---|---|---|---|---|
| 描述 | Complete, +5V-Powered, Isolated, Dual RS-232 Transceiver Module | Complete, +5V-Powered, Isolated, Dual RS-232 Transceiver Module | Complete, +5V-Powered, Isolated, Dual RS-232 Transceiver Module | Complete, +5V-Powered, Isolated, Dual RS-232 Transceiver Module | Complete, +5V-Powered, Isolated, Dual RS-232 Transceiver Module |
| 是否无铅 | 含铅 | - | 含铅 | - | 含铅 |
| 是否Rohs认证 | 不符合 | - | 不符合 | - | 不符合 |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | - | Maxim(美信半导体) |
| 零件包装代码 | DIP | - | DIP | - | DIP |
| 包装说明 | PLASTIC, MODULE, DIP-40 | - | PLASTIC, MODULE, DIP-40 | - | PLASTIC, MODULE, DIP-40 |
| 针数 | 40 | - | 40 | - | 40 |
| Reach Compliance Code | _compli | - | _compli | - | _compli |
| ECCN代码 | EAR99 | - | EAR99 | - | EAR99 |
| 其他特性 | ISOLATED DATA INTERFACE; INTENDED FOR LESS STRINGENT APPLICATIONS | - | ISOLATED DATA INTERFACE; INTENDED FOR LESS STRINGENT APPLICATIONS | - | ISOLATED DATA INTERFACE |
| 差分输出 | NO | - | NO | - | NO |
| 驱动器位数 | 2 | - | 2 | - | 2 |
| 输入特性 | SCHMITT TRIGGER | - | SCHMITT TRIGGER | - | SCHMITT TRIGGER |
| 接口集成电路类型 | LINE TRANSCEIVER | - | LINE TRANSCEIVER | - | LINE TRANSCEIVER |
| 接口标准 | EIA-232-D; V.28 | - | EIA-232-D; V.28 | - | EIA-232-D; V.28 |
| JESD-30 代码 | R-PDIP-T40 | - | R-PDIP-T40 | - | R-PDIP-T40 |
| JESD-609代码 | e0 | - | e0 | - | e0 |
| 长度 | 52.075 mm | - | 52.075 mm | - | 52.075 mm |
| 湿度敏感等级 | 1 | - | 1 | - | 1 |
| 功能数量 | 1 | - | 1 | - | 1 |
| 端子数量 | 40 | - | 40 | - | 40 |
| 最高工作温度 | 85 °C | - | 70 °C | - | 70 °C |
| 最小输出摆幅 | 10 V | - | 10 V | - | 10 V |
| 输出特性 | 3-STATE | - | 3-STATE | - | 3-STATE |
| 最大输出低电流 | 0.0032 A | - | 0.0032 A | - | 0.0032 A |
| 输出极性 | INVERTED | - | INVERTED | - | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | - | DIP | - | DIP |
| 封装等效代码 | DIP40,.6 | - | DIP40,.6 | - | DIP40,.6 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | - | IN-LINE |
| 峰值回流温度（摄氏度） | 240 | - | 240 | - | 240 |
| 电源 | 5 V | - | 5 V | - | 5 V |
| 认证状态 | Not Qualified | - | Not Qualified | - | Not Qualified |
| 接收器位数 | 2 | - | 2 | - | 2 |
| 座面最大高度 | 5.08 mm | - | 5.08 mm | - | 5.08 mm |
| 最大压摆率 | 90 mA | - | 90 mA | - | 90 mA |
| 最大供电电压 | 5.5 V | - | 5.5 V | - | 5.5 V |
| 最小供电电压 | 4.5 V | - | 4.5 V | - | 4.5 V |
| 标称供电电压 | 5 V | - | 5 V | - | 5 V |
| 表面贴装 | NO | - | NO | - | NO |
| 技术 | CMOS | - | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | - | COMMERCIAL | - | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | - | THROUGH-HOLE |
| 端子节距 | 2.54 mm | - | 2.54 mm | - | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | - | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | - | 20 | - | 20 |
| 宽度 | 15.24 mm | - | 15.24 mm | - | 15.24 mm |
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