Serial I/O Controller, 2 Channel(s), 0.5125MBps, CMOS, CQCC44, CERAMIC, LCC-44
| 参数名称 | 属性值 |
| 零件包装代码 | LCC |
| 包装说明 | QCCN, LCC44,.65SQ |
| 针数 | 44 |
| Reach Compliance Code | compliant |
| 地址总线宽度 | |
| 边界扫描 | NO |
| 通信协议 | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC |
| 数据编码/解码方法 | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0) |
| 最大数据传输速率 | 0.5125 MBps |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | S-CQCC-N44 |
| JESD-609代码 | e0 |
| 低功率模式 | NO |
| 串行 I/O 数 | 2 |
| 端子数量 | 44 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC44,.65SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 最大压摆率 | 18 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 |
| 5962-8868907YA | 5962-8868901YA | 5962-8868908QA | 5962-8868902YA | 5962-8868908YA | 5962-8868909YA | 5962-8868910QA | 5962-8868910YA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Serial I/O Controller, 2 Channel(s), 0.5125MBps, CMOS, CQCC44, CERAMIC, LCC-44 | Serial I/O Controller, 2 Channel(s), 0.3125MBps, CMOS, CQCC44, CERAMIC, LCC-44 | Serial I/O Controller, 2 Channel(s), CMOS, CDIP40, CERAMIC, DIP-40 | Serial I/O Controller, 2 Channel(s), 0.3125MBps, CMOS, CQCC44, CERAMIC, LCC-44 | Serial I/O Controller, 2 Channel(s), CMOS, CQCC44, CERAMIC, LCC-44 | Serial I/O Controller, 2 Channel(s), CMOS, CQCC44, CERAMIC, LCC-44 | Serial I/O Controller, 2 Channel(s), CMOS, CDIP40, CERAMIC, DIP-40 | Serial I/O Controller, 2 Channel(s), CMOS, CQCC44, CERAMIC, LCC-44 |
| 零件包装代码 | LCC | LCC | DIP | LCC | LCC | LCC | DIP | LCC |
| 包装说明 | QCCN, LCC44,.65SQ | QCCN, LCC44,.65SQ | DIP, DIP40,.6 | QCCN, LCC44,.65SQ | QCCN, LCC44,.65SQ | QCCN, LCC44,.65SQ | DIP, DIP40,.6 | QCCN, LCC44,.65SQ |
| 针数 | 44 | 44 | 40 | 44 | 44 | 44 | 40 | 44 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO | NO |
| 通信协议 | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; X.25; BISYNC; EXT SYNC | ASYNC, BIT; SYNC, BYTE; EXT SYNC | ASYNC, BIT; SYNC, BYTE; EXT SYNC |
| 数据编码/解码方法 | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0) | NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) | NRZ; NRZI-SPACE; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER) |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | S-CQCC-N44 | S-CQCC-N44 | R-GDIP-T40 | S-CQCC-N44 | S-CQCC-N44 | S-CQCC-N44 | R-GDIP-T40 | S-CQCC-N44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 低功率模式 | NO | NO | NO | NO | NO | NO | NO | NO |
| 串行 I/O 数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 44 | 44 | 40 | 44 | 44 | 44 | 40 | 44 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN | QCCN | DIP | QCCN | QCCN | QCCN | DIP | QCCN |
| 封装等效代码 | LCC44,.65SQ | LCC44,.65SQ | DIP40,.6 | LCC44,.65SQ | LCC44,.65SQ | LCC44,.65SQ | DIP40,.6 | LCC44,.65SQ |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 最大压摆率 | 18 mA | 30 mA | 18 mA | 30 mA | 18 mA | 22 mA | 15 mA | 15 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | DUAL | QUAD | QUAD | QUAD | DUAL | QUAD |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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