16KX1 STANDARD SRAM, 25ns, CDIP20, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | DIP |
| 包装说明 | 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 |
| 针数 | 20 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 25 ns |
| I/O 类型 | SEPARATE |
| JESD-30 代码 | R-CDIP-T20 |
| JESD-609代码 | e0 |
| 长度 | 25.4 mm |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 20 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16KX1 |
| 输出特性 | 3-STATE |
| 可输出 | NO |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.124 mm |
| 最小待机电流 | 4.5 V |
| 最大压摆率 | 0.075 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| IMS1403S-25 | IMS1403S-45 | IMS1403P-25 | IMS1403S-55 | IMS1403W-55 | IMS1403W-25 | IMS1403S-35 | IMS1403P-55 | IMS1403W-35 | IMS1403P-45 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 16KX1 STANDARD SRAM, 25ns, CDIP20, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 | 16KX1 STANDARD SRAM, 40ns, CDIP20, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 | 16KX1 STANDARD SRAM, 25ns, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | 16KX1 STANDARD SRAM, 50ns, CDIP20, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 | 16KX1 STANDARD SRAM, 50ns, CQCC20, CERAMIC, LCC-20 | 16KX1 STANDARD SRAM, 25ns, CQCC20, CERAMIC, LCC-20 | 16KX1 STANDARD SRAM, 35ns, CDIP20, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 | 16KX1 STANDARD SRAM, 50ns, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | 16KX1 STANDARD SRAM, 35ns, CQCC20, CERAMIC, LCC-20 | 16KX1 STANDARD SRAM, 40ns, PDIP20, 0.300 INCH, PLASTIC, DIP-20 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| 零件包装代码 | DIP | DIP | DIP | DIP | QLCC | QLCC | DIP | DIP | QLCC | DIP |
| 包装说明 | 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 | 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 | 0.300 INCH, PLASTIC, DIP-20 | 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 | CERAMIC, LCC-20 | CERAMIC, LCC-20 | 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-20 | 0.300 INCH, PLASTIC, DIP-20 | CERAMIC, LCC-20 | 0.300 INCH, PLASTIC, DIP-20 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 25 ns | 40 ns | 25 ns | 50 ns | 50 ns | 25 ns | 35 ns | 50 ns | 35 ns | 40 ns |
| I/O 类型 | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 代码 | R-CDIP-T20 | R-CDIP-T20 | R-PDIP-T20 | R-CDIP-T20 | R-CQCC-N20 | R-CQCC-N20 | R-CDIP-T20 | R-PDIP-T20 | R-CQCC-N20 | R-PDIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 25.4 mm | 25.4 mm | 26.289 mm | 25.4 mm | 10.795 mm | 10.795 mm | 25.4 mm | 26.289 mm | 10.795 mm | 26.289 mm |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bi |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 字数 | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words | 16384 words |
| 字数代码 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 | 16000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 16KX1 | 16KX1 | 16KX1 | 16KX1 | 16KX1 | 16KX1 | 16KX1 | 16KX1 | 16KX1 | 16KX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | QCCN | QCCN | DIP | DIP | QCCN | DIP |
| 封装等效代码 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | LCC20,.3X.43 | LCC20,.3X.43 | DIP20,.3 | DIP20,.3 | LCC20,.3X.43 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.124 mm | 3.124 mm | 4.455 mm | 3.124 mm | 1.981 mm | 1.981 mm | 3.124 mm | 4.455 mm | 1.981 mm | 4.455 mm |
| 最小待机电流 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 最大压摆率 | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA | 0.075 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | YES | YES | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.36 mm | 7.36 mm | 7.62 mm | 7.62 mm | 7.36 mm | 7.62 mm |
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