16-BIT, 20.5MHz, OTHER DSP, CPGA68, CERAMIC, PGA-68
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | PGA |
| 包装说明 | PGA, PGA68,11X11 |
| 针数 | 68 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A001.A.2.C |
| 地址总线宽度 | 12 |
| 桶式移位器 | YES |
| 位大小 | 16 |
| 边界扫描 | NO |
| 最大时钟频率 | 20.5 MHz |
| 外部数据总线宽度 | 16 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-CPGA-P68 |
| 低功率模式 | NO |
| 端子数量 | 68 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA |
| 封装等效代码 | PGA68,11X11 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| RAM（字数） | 256 |
| 筛选级别 | MIL-STD-883 |
| 最大压摆率 | 90 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
| 5962-9300601MXA | 5962-9300601MYA | SM320E14GBM | SMJ320E14FJM | SMJ320E14GBM | SM320E14FJM | |
|---|---|---|---|---|---|---|
| 描述 | 16-BIT, 20.5MHz, OTHER DSP, CPGA68, CERAMIC, PGA-68 | 16-BIT, 20.5MHz, OTHER DSP, CQCC68, CERAMIC, CC-68 | 16-BIT, 20.5MHz, OTHER DSP, CPGA68, CERAMIC, PGA-68 | 16-BIT, 20.5MHz, OTHER DSP, CQCC68, CERAMIC, CC-68 | 16-BIT, 20.5MHz, OTHER DSP, CPGA68, CERAMIC, PGA-68 | 16-BIT, 20.5MHz, OTHER DSP, CQCC68, CERAMIC, CC-68 |
| 零件包装代码 | PGA | QFN | PGA | QFN | PGA | QFN |
| 包装说明 | PGA, PGA68,11X11 | QCCJ, LDCC68,1.0SQ | PGA, | QCCJ, | PGA, | QCCJ, |
| 针数 | 68 | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | not_compliant | _compli | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 地址总线宽度 | 12 | 12 | 12 | 12 | 12 | 12 |
| 桶式移位器 | YES | YES | YES | YES | YES | YES |
| 边界扫描 | NO | NO | NO | NO | NO | NO |
| 最大时钟频率 | 20.5 MHz | 20.5 MHz | 20.5 MHz | 20.5 MHz | 20.5 MHz | 20.5 MHz |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 格式 | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-CPGA-P68 | S-CQCC-J68 | S-CPGA-P68 | S-CQCC-J68 | S-CPGA-P68 | S-CQCC-J68 |
| 低功率模式 | NO | NO | NO | NO | NO | NO |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA | QCCJ | PGA | QCCJ | PGA | QCCJ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | CHIP CARRIER | GRID ARRAY | CHIP CARRIER | GRID ARRAY | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | PIN/PEG | J BEND | PIN/PEG | J BEND | PIN/PEG | J BEND |
| 端子位置 | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | - | MIL-PRF-38535 | MIL-PRF-38535 | - |
| 端子节距 | 2.54 mm | 1.27 mm | - | 1.27 mm | - | 1.27 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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