MAX4007EUT
Rev. A
RELIABILITY REPORT
FOR
MAX4007EUT
PLASTIC ENCAPSULATED DEVICES
April 28, 2003
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX4007 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX4007 precision, high-side, current monitor is specifically designed for monitoring photodiode current in fiber
applications. It offers a connection point for the reference current and a monitor output that produces a signal
proportional to the reference current. The monitor output of the MAX4007 is a current proportional to the reference
current. The current monitor has six decades of dynamic range and monitor reference current of 250nA to 2.5mA
with better than 5% accuracy. The photodiode current can be monitored from 10nA to 10mA with reduced accuracy.
The MAX4007 accepta a supply voltage of +2.7V to +76V, suitable for APD or PIN photodiode applications. Internal
current limiting (20mA, typ) protects the device against short circuit to ground. A clamp diode protects the monitor
output from overvoltage. Additionally, thia devices feature thermal shutdown if the die temperature reaches +150°C.
The MAX4007 is available in tiny, space-saving 6-pin SOT23 packages, and operates over the extended temperature
range of -40°C to +85°C.
B. Absolute Maximum Ratings
Item
CLAMP to GND
BIAS, REF to GND
OUT to GND
Short-Circuit, REF to GND
Current into any Pin
Operating Temperature Range
Junction Temperature
Storage Temperature Range
Lead Temperature (soldering, 10s)
Continuous Power Dissipation (TA = +70C)
6-PIN SOT23
Derates above +70°C
6-PIN SOT23
Rating
-0.3V to +80V
-0.3V to +80V
-0.3V to (VCLAMP + 0.6V)
Continuous
±30mA
-40°C to +85°C
+150°C
-65°C to +150°C
+300°C
696mW
8.7mW/°C
II. Manufacturing Information
A. Description/Function:
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
High-Accuracy, 76V, High-Side=Current Monitors in SOT23
BCD80
195
Oregon, USA
Thailand, Malaysia, USA
January, 2003
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112:
6-Pin SOT
Copper
Solder Plate
Non-Conductive Epoxy
Gold (1 mil dia.)
Epoxy with silica filler
# 05-9000-0357
Class UL94-V0
Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
60 X 41 mils
Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
Aluminum/Si (Si = 1%)
None
3 microns (as drawn)
3 microns (as drawn)
5 mil. Sq.
SiO
2
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
Jim Pedicord (Reliability Lab Manager)
Bryan Preeshl (Executive Director)
Kenneth Huening (Vice President)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
B. Outgoing Inspection Level:
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in
Table 1.
Using these results, the Failure
Rate (λ) is calculated as follows:
λ
=
1
=
MTTF
1.83
192 x 4389 x 48 x 2
(Chi square value for MTTF upper limit)
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ
= 22.62 x 10
-9
λ
= 22.62 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-6107) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The OY13 die type has been found to have all pins able to withstand a transient pulse of
±2500V,
per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of
±250mA.
Table 1
Reliability Evaluation Test Results
MAX4007EUT
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
SAMPLE
SIZE
NUMBER OF
FAILURES
PACKAGE
Static Life Test
(Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing
(Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
45
0
DC Parameters
& functionality
SOT
77
0
85/85
DC Parameters
& functionality
77
0
Mechanical Stress
(Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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