NOR Gate, LS Series, 4-Func, 2-Input, TTL, CQCC20, CERAMIC, LCC-20
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | QLCC |
包装说明 | QCCN, LCC20,.35SQ |
针数 | 20 |
Reach Compliance Code | unknown |
系列 | LS |
JESD-30 代码 | S-CQCC-N20 |
JESD-609代码 | e0 |
长度 | 8.89 mm |
逻辑集成电路类型 | NOR GATE |
最大I(ol) | 0.004 A |
功能数量 | 4 |
输入次数 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCN |
封装等效代码 | LCC20,.35SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5 V |
最大电源电流(ICC) | 5.4 mA |
Prop。Delay @ Nom-Sup | 18 ns |
传播延迟(tpd) | 18 ns |
认证状态 | Not Qualified |
施密特触发器 | NO |
筛选级别 | MIL-STD-883 Class B |
座面最大高度 | 1.905 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | TTL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 8.89 mm |
Base Number Matches | 1 |
54LS02LMQB | 54LS02DMQB | 54LS02FMQB | DM54LS02W | DM54LS02J | |
---|---|---|---|---|---|
描述 | NOR Gate, LS Series, 4-Func, 2-Input, TTL, CQCC20, CERAMIC, LCC-20 | NOR Gate, LS Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14 | NOR Gate, LS Series, 4-Func, 2-Input, TTL, CDFP14, CERAMIC, FP-14 | NOR Gate, LS Series, 4-Func, 2-Input, TTL, CDFP14, CERAMIC, FP-14 | NOR Gate, LS Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | QLCC | DIP | DFP | DFP | DIP |
包装说明 | QCCN, LCC20,.35SQ | CERAMIC, DIP-14 | DFP, FL14,.3 | CERAMIC, FP-14 | CERAMIC, DIP-14 |
针数 | 20 | 14 | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
系列 | LS | LS | LS | LS | LS |
JESD-30 代码 | S-CQCC-N20 | R-GDIP-T14 | R-GDFP-F14 | R-GDFP-F14 | R-GDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | NOR GATE | NOR GATE | NOR GATE | NOR GATE | NOR GATE |
最大I(ol) | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
功能数量 | 4 | 4 | 4 | 4 | 4 |
输入次数 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 14 | 14 | 14 | 14 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | QCCN | DIP | DFP | DFP | DIP |
封装等效代码 | LCC20,.35SQ | DIP14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | FLATPACK | FLATPACK | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
最大电源电流(ICC) | 5.4 mA | 5.4 mA | 5.4 mA | 5.4 mA | 5.4 mA |
Prop。Delay @ Nom-Sup | 18 ns | 18 ns | 18 ns | 18 ns | 18 ns |
传播延迟(tpd) | 18 ns | 18 ns | 18 ns | 18 ns | 18 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
施密特触发器 | NO | NO | NO | NO | NO |
座面最大高度 | 1.905 mm | 5.08 mm | 2.032 mm | 2.032 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | NO | YES | YES | NO |
技术 | TTL | TTL | TTL | TTL | TTL |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | QUAD | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 8.89 mm | 7.62 mm | 6.2865 mm | 6.2865 mm | 7.62 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
长度 | 8.89 mm | 19.43 mm | - | - | 19.43 mm |
筛选级别 | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | - | - |
厂商名称 | - | Fairchild | - | Fairchild | Fairchild |
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