Dual-Supply, Low-On-Resistance, SPST, CMOS Analog Switches
| MAX4516 | MAX4517EUK | MAX4517CUK | MAX4517C/D | MAX4516EUK | MAX4516CUK | |
|---|---|---|---|---|---|---|
| 描述 | Dual-Supply, Low-On-Resistance, SPST, CMOS Analog Switches | Dual-Supply, Low-On-Resistance, SPST, CMOS Analog Switches | Dual-Supply, Low-On-Resistance, SPST, CMOS Analog Switches | Dual-Supply, Low-On-Resistance, SPST, CMOS Analog Switches | Dual-Supply, Low-On-Resistance, SPST, CMOS Analog Switches | Dual-Supply, Low-On-Resistance, SPST, CMOS Analog Switches |
| 是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | - | SOT-23 | SOT-23 | DIE | SOT-23 | SOT-23 |
| 包装说明 | - | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | DIE-5 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 |
| 针数 | - | 5 | 5 | 5 | 5 | 5 |
| Reach Compliance Code | - | _compli | _compli | _compli | _compli | _compli |
| 模拟集成电路 - 其他类型 | - | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | - | R-PDSO-G5 | R-PDSO-G5 | R-XUUC-N5 | R-PDSO-G5 | R-PDSO-G5 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 |
| 长度 | - | 2.9 mm | 2.9 mm | - | 2.9 mm | 2.9 mm |
| 湿度敏感等级 | - | 1 | 1 | 1 | 1 | 1 |
| 标称负供电电压 (Vsup) | - | -5 V | -5 V | -5 V | -5 V | -5 V |
| 正常位置 | - | NC | NC | - | NO | NO |
| 信道数量 | - | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | - | 5 | 5 | 5 | 5 | 5 |
| 标称断态隔离度 | - | 86 dB | 86 dB | 86 dB | 86 dB | 86 dB |
| 最大通态电阻 (Ron) | - | 20 Ω | 20 Ω | 20 Ω | 20 Ω | 20 Ω |
| 最高工作温度 | - | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | LSSOP | LSSOP | DIE | LSSOP | LSSOP |
| 封装等效代码 | - | TSOP5/6,.11,37 | TSOP5/6,.11,37 | - | TSOP5/6,.11,37 | TSOP5/6,.11,37 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | UNCASED CHIP | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | 240 | 240 | 240 | 240 | 240 |
| 电源 | - | +-5 V | +-5 V | - | +-5 V | +-5 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 1.45 mm | 1.45 mm | - | 1.45 mm | 1.45 mm |
| 最大供电电流 (Isup) | - | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA | 0.2 mA |
| 最大供电电压 (Vsup) | - | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | - | 1 V | 1 V | 1 V | 1 V | 1 V |
| 标称供电电压 (Vsup) | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | - | YES | YES | YES | YES | YES |
| 最长断开时间 | - | 75 ns | 75 ns | 75 ns | 75 ns | 75 ns |
| 最长接通时间 | - | 100 ns | 100 ns | 100 ns | 100 ns | 100 ns |
| 切换 | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | - | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | TIN LEAD | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | - | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING |
| 端子节距 | - | 0.95 mm | 0.95 mm | - | 0.95 mm | 0.95 mm |
| 端子位置 | - | DUAL | DUAL | UPPER | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | 20 | 20 | NOT SPECIFIED | 20 | 20 |
| 宽度 | - | 1.625 mm | 1.625 mm | - | 1.625 mm | 1.625 mm |
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