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MAX4684EBC

产品描述DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PBGA12
产品类别模拟混合信号IC    信号电路   
文件大小152KB,共10页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
相似器件已查找到5个与MAX4684EBC功能相似器件
下载文档 详细参数 选型对比 全文预览 文档解析

MAX4684EBC概述

DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PBGA12

双 1通道, SGL单刀双掷开关, PBGA12

MAX4684EBC规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Maxim(美信半导体)
零件包装代码BGA
包装说明0.50 MM PITCH, UCSP-12
针数12
Reach Compliance Code_compli
模拟集成电路 - 其他类型SPDT
JESD-30 代码R-PBGA-B12
JESD-609代码e0
长度2.02 mm
湿度敏感等级1
信道数量1
功能数量2
端子数量12
标称断态隔离度64 dB
通态电阻匹配规范0.06 Ω
最大通态电阻 (Ron)0.8 Ω
最高工作温度85 °C
最低工作温度-40 °C
输出SEPARATE OUTPUT
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装等效代码BGA12,3X4,20
封装形状RECTANGULAR
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)240
电源3 V
认证状态Not Qualified
座面最大高度0.67 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.8 V
标称供电电压 (Vsup)3 V
表面贴装YES
最长断开时间30 ns
最长接通时间50 ns
切换BREAK-BEFORE-MAKE
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度1.54 mm

文档解析

MAX4684/MAX4685 是双 SPDT 低导通电阻模拟开关,设计用于 +1.8V 至 +5.5V 单电源系统,采用 UCSP 封装。MAX4684 提供差异化导通电阻,NC 开关最大 0.5Ω、NO 开关最大 0.8Ω(+2.7V 下);MAX4685 实现均一性能,NO 和 NC 开关最大导通电阻均 0.8Ω(+2.7V 下)。产品支持快速开关和低功耗,适用于音频视频信号路由和便携式电子产品。 核心特性包括开关时间 tON=50ns(最大值)、tOFF=40ns(最大值)在 +3V 下,导通电阻匹配度 0.06Ω(最大值),平坦度最大 0.35Ω。逻辑输入兼容 1.8V 电压,信号处理覆盖轨到轨范围。性能指标如串扰 -68dB(100kHz)、关断隔离 -64dB(100kHz)、THD 0.03%,泄漏电流最大 1nA(25°C),电源电流最大 50nA(+25°C),确保低失真操作。 应用场景涵盖调制解调器、电池设备和功率管理。UCSP 封装优化空间效率,尺寸 2.0mm × 1.50mm,焊球间距 0.5mm。封装选项包括 UCSP、TDFN-EP 和 µMAX,工作温度 -40°C 至 +85°C,提供可靠的热性能,适合紧凑型设计和高速通信系统。

文档预览

下载PDF文档
19-1977; Rev 4; 1/09
0.5
Ω
/0.8
Ω
Low-Voltage, Dual SPDT
Analog Switches in UCSP
General Description
The MAX4684/MAX4685 low on-resistance (R
ON
), low-
voltage, dual single-pole/double-throw (SPDT) analog
switches operate from a single +1.8V to +5.5V supply.
The MAX4684 features a 0.5Ω (max) R
ON
for its NC
switch and a 0.8Ω (max) R
ON
for its NO switch at a
+2.7V supply. The MAX4685 features a 0.8Ω max on-
resistance for both NO and NC switches at a +2.7V
supply.
Both parts feature break-before-make switching action
(2ns) with t
ON
= 50ns and t
OFF
= 40ns at +3V. The digi-
tal logic inputs are 1.8V logic-compatible with a +2.7V to
+3.3V supply.
The MAX4684/MAX4685 are packaged in the chipscale
package (UCSP)™, significantly reducing the required
PC board area. The chip occupies only a 2.0mm
1.50mm area. The 4
3 array of solder bumps are
spaced with a 0.5mm bump pitch.
Features
12-Bump, 0.5mm-Pitch UCSP
NC Switch R
ON
0.5Ω max (+2.7V Supply) (MAX4684)
0.8Ω max (+2.7V Supply) (MAX4685)
NO Switch R
ON
0.8Ω max (+2.7V Supply)
R
ON
Match Between Channels
0.06Ω (max)
R
ON
Flatness Over Signal Range
0.15Ω (max)
+1.8V to +5.5V Single-Supply Operation
Rail-to-Rail Signal Handling
1.8V Logic Compatibility
Low Crosstalk: -68dB (100kHz)
High Off-Isolation: -64dB (100kHz)
THD: 0.03%
50nA (max) Supply Current
Low Leakage Currents
1nA (max) at T
A
= +25°C
MAX4684/MAX4685
________________________Applications
Speaker Headset Switching
MP3 Players
Power Routing
Battery-Operated Equipment
Relay Replacement
Audio and Video Signal Routing
Communications Circuits
PCMCIA Cards
Cellular Phones
Modems
UCSP is a trademark of Maxim Integrated Products, Inc.
µMAX is a registered trademark of Maxim Integrated Products,
Inc.
PART
MAX4684
EBC+T
MAX4684ETB+T
MAX4684EUB+T
MAX4685
EBC+T
MAX4685ETB+T
MAX4685EUB+T
Ordering Information
TEMP RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
PIN/BUMP-
PACKAGE
12 UCSP*
10 TDFN-EP**
10 µMAX
®
12 UCSP*
10 TDFN-EP**
10 µMAX
TOP
MARK
AAF
AAG
AAG
AAH
+Denotes
a lead(Pb)-free/RoHS-compliant package.
Note:
Requires special solder temperature profile described in
the Absolute Maximum Ratings section.
*UCSP
reliability is integrally linked to the user’s assembly
methods, circuit board material, and environment. Refer to the
UCSP Reliability Notice in the UCSP Reliability section of this
data sheet for more information.
**EP
= Exposed Pad
T = Tape and reel.
Pin Configurations/Functional Diagrams/Truth Table
TOP VIEW
MAX4684/MAX4685
GND
NC1
IN1
COM1
NO1
C1
C2
C3
B1
A1
A2
A3
NC2
IN2
MAX4684/MAX4685
COM2
NO2
IN_
0
C4
B4
V+
UCSP
A4
1
NO_
OFF
ON
NC_
ON
OFF
IN1 4
NC1 5
µMAX
7
6
NC2
GND
V+ 1
NO1 2
COM1 3
MAX4684/MAX4685
10 NO2
9
8
COM2
IN2
SWITCHES SHOWN FOR LOGIC "0" INPUT
Continued at end of data sheet.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.

MAX4684EBC相似产品对比

MAX4684EBC MAX4684-MAX4685 MAX4685ETB MAX4685EBC MAX4684ETB
描述 DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PBGA12 DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO10 DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO10 DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO10 DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PDSO10
功能数量 2 2 2 2 2
端子数量 12 10 10 12 10
表面贴装 YES Yes YES YES YES
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL NO LEAD NO LEAD BALL NO LEAD
端子位置 BOTTOM DUAL DUAL BOTTOM DUAL
是否无铅 含铅 - 含铅 含铅 含铅
是否Rohs认证 不符合 - 不符合 不符合 不符合
厂商名称 Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
零件包装代码 BGA - QFN BGA QFN
包装说明 0.50 MM PITCH, UCSP-12 - VSON, SOLCC10,.12,20 0.50 MM PITCH, UCSP-12 VSON, SOLCC10,.12,20
针数 12 - 10 12 10
Reach Compliance Code _compli - _compli _compli _compli
模拟集成电路 - 其他类型 SPDT - SPDT SPDT SPDT
JESD-30 代码 R-PBGA-B12 - S-PDSO-N10 R-PBGA-B12 S-PDSO-N10
JESD-609代码 e0 - e0 e0 e0
长度 2.02 mm - 3 mm 2.02 mm 3 mm
湿度敏感等级 1 - 1 1 1
信道数量 1 - 1 1 1
标称断态隔离度 64 dB - 64 dB 64 dB 64 dB
通态电阻匹配规范 0.06 Ω - 0.06 Ω 0.06 Ω 0.06 Ω
最大通态电阻 (Ron) 0.8 Ω - 0.8 Ω 0.8 Ω 0.8 Ω
最高工作温度 85 °C - 85 °C 85 °C 85 °C
最低工作温度 -40 °C - -40 °C -40 °C -40 °C
输出 SEPARATE OUTPUT - SEPARATE OUTPUT SEPARATE OUTPUT SEPARATE OUTPUT
封装主体材料 PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA - VSON VFBGA VSON
封装等效代码 BGA12,3X4,20 - SOLCC10,.12,20 BGA12,3X4,20 SOLCC10,.12,20
封装形状 RECTANGULAR - SQUARE RECTANGULAR SQUARE
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH - SMALL OUTLINE, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, VERY THIN PROFILE
峰值回流温度(摄氏度) 240 - 245 240 240
电源 3 V - 3 V 3 V 3 V
认证状态 Not Qualified - Not Qualified Not Qualified Not Qualified
座面最大高度 0.67 mm - 0.8 mm 0.67 mm 0.8 mm
最大供电电压 (Vsup) 5.5 V - 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 1.8 V - 1.8 V 1.8 V 1.8 V
标称供电电压 (Vsup) 3 V - 3 V 3 V 3 V
最长断开时间 30 ns - 30 ns 30 ns 30 ns
最长接通时间 50 ns - 50 ns 50 ns 50 ns
切换 BREAK-BEFORE-MAKE - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
端子面层 Tin/Lead (Sn/Pb) - Tin/Lead (Sn85Pb15) Tin/Lead (Sn/Pb) Tin/Lead (Sn85Pb15)
端子节距 0.5 mm - 0.5 mm 0.5 mm 0.5 mm
处于峰值回流温度下的最长时间 20 - NOT SPECIFIED 20 20
宽度 1.54 mm - 3 mm 1.54 mm 3 mm

与MAX4684EBC功能相似器件

器件名 厂商 描述
MAX4684EBC Rochester Electronics DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PBGA12, 0.50 MM PITCH, UCSP-12
MAX4684EBC+ Maxim(美信半导体) SPDT, 2 Func, 1 Channel, PBGA12, 0.50 MM PITCH, UCSP-12
MAX4684EBC+T Maxim(美信半导体)
MAX4684EBC-T Maxim(美信半导体) Analog Switch ICs 0.5Ohm/0.8Ohm Low-Voltage, Dual SPDT Analog Switches in UCSP
MAX4684EBC-T Rochester Electronics DUAL 1-CHANNEL, SGL POLE DOUBLE THROW SWITCH, PBGA12, 0.50 MM PITCH, UCSP-12

 
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