Ordering Information .................................................................................................................................................................... 2
7.1. User Programming Interface ..................................................................................................................................... 18
7.2. Start-up output frequency and signaling types .......................................................................................................... 18
8.1. Any-frequency function ............................................................................................................................................. 19
C/SPI Control Registers...................................................................................................................................................... 29
9.1. Register Address: 0x00. DCO Frequency Control Least Significant Word (LSW) .................................................... 29
9.2. Register Address: 0x01. OE Control, DCO Frequency Control Most Significant Word (MSW) ................................. 30
9.3. Register Address: 0x02. DCO PULL RANGE CONTROL ........................................................................................ 30
9.4. Register Address: 0x03. Frac-N PLL Feedback Divider Integer Value and Frac-N PLL Feedback Divider Fraction
Value MSW ............................................................................................................................................................... 31
9.6. Register Address: 0x05. Forward Divider, Driver Control ......................................................................................... 31
9.7. Register Address: 0x06. Driver Divider, Driver Control ............................................................................................. 32
2
C Operation ........................................................................................................................................................................ 33
10 I
10.1. I
2
C protocol ............................................................................................................................................................... 33
10.2. I
2
C Timing Specification ............................................................................................................................................ 36
10.3. I
2
C Device Address Modes ....................................................................................................................................... 37
Dimensions and Patterns ........................................................................................................................................................... 44
Additional Information ................................................................................................................................................................ 45
Revision History ......................................................................................................................................................................... 46
Rev 1.01
Page 3 of 46
www.sitime.com
SiT3522
340 to 725 MHz Elite Platform I2C/SPI Programmable Oscillator
1 Electrical Characteristics
All Min and Max limits in the Electrical Characteristics tables are specified over temperature and rated operating voltage with
standard output terminations shown in the termination diagrams. Typical values are at 25°C and nominal supply voltage.
Table 1. Electrical Characteristics – Common to LVPECL, LVDS and HCSL
Parameter
Output Frequency Range
Symbol
f
Min.
340.000001
340.000001
Typ.
–
–
Max.
725.000000
500.000000
Unit
MHz
MHz
Condition
LVDS and LVPECL output driver, factory or user
programmable, accurate to 6 decimal places
HCSL output driver, factory or user programmable, accurate to
6 decimal places
Inclusive of initial tolerance, operating temperature, rated
power supply voltage and load variations
Frequency Range
Frequency Stability
Frequency Stability
F_stab
-20
-20
-25
-50
First Year Aging
F_1y
–
–
–
–
–
±1
–
–
–
+20
+20
+25
+50
–
ppm
ppm
ppm
ppm
ppm
°C
°C
°C
1
st
-year aging at 25°C
Temperature Range
Operating Temperature Range
T_use
-20
-40
-40
+70
+85
+105
Supply Voltage
Supply Voltage
Vdd
2.97
2.7
2.52
2.25
3.3
3.0
2.8
2.5
–
–
100
–
–
–
3.63
3.3
3.08
2.75
–
30%
–
V
V
V
V
Extended Commercial
Industrial
Extended Industrial. Available only for I
2
C operation, not SPI.
Input Characteristics – OE Pin
Input Voltage High
Input Voltage Low
Input Pull-up Impedance
VIH
VIL
Z_in
70%
–
–
Vdd
Vdd
kΩ
OE pin
OE pin
OE pin, logic high or logic low
Output Characteristics
Duty Cycle
DC
45
–
–
55
%
Startup and Output Enable/Disable Timing
Start-up Time
Output Enable/Disable Time –
Hardware control via OE pin
Output Enable/Disable Time –
Software control via I
2
C/SPI
T_start
T_oe_hw
3.0
9.1
ms
µs
Measured from the time Vdd reaches its rated minimum value
Measured from the time OE pin reaches rated VIH and VIL to
the time clock pins reach 90% of swing and high-Z.
See
Figure 9
and
Figure 10
Measured from the time the last byte of command is
transmitted via I
2
C/SPI (reg1) to the time clock pins reach 90%
of swing and high-Z. See
Figure 30
and
Figure 31
T_oe_sw
–
–
11.8
µs
Rev 1.01
Page 4 of 46
www.sitime.com
SiT3522
340 to 725 MHz Elite Platform I2C/SPI Programmable Oscillator
Table 2. Electrical Characteristics – LVPECL Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Maximum Output Current
Idd
I_OE
I_leak
I_driver
–
–
–
–
–
–
0.10
–
94
63
–
30
mA
mA
A
mA
Excluding Load Termination Current, Vdd = 3.3 V or 2.5 V
OE = Low
OE = Low
Maximum average current drawn from OUT+ or OUT-
Output Characteristics
Output High Voltage
Output Low Voltage
Output Differential Voltage Swing
Rise/Fall Time
VOH
VOL
V_Swing
Tr, Tf
Vdd - 1.1V
Vdd - 1.9V
1.2
–
–
–
1.6
225
Vdd - 0.7V
Vdd - 1.5V
2.0
290
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[3]
Note:
3. Measured according to JESD65B
T_jitt
–
0.22
0.075
0.23
0.09
1
0.260
0.085
0.325
0.095
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08, IEEE802.3-2005 10 GbE jitter mask integration
bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3 V or 2.5 V
V
V
V
ps
See
Figure 5
See
Figure 5
See
Figure 6
20% to 80%, see
Figure 6
Table 3. Electrical Characteristics – LVDS Specific
Parameter
Symbol
Min.
Typ.
Max.
Unit
Condition
Current Consumption
Current Consumption
OE Disable Supply Current
Output Disable Leakage Current
Idd
I_OE
I_leak
–
–
–
–
–
0.15
89
67
–
mA
mA
A
Excluding Load Termination Current, Vdd = 3.3 V or 2.5 V
OE = Low
OE = Low
Output Characteristics
Differential Output Voltage
Delta VOD
Offset Voltage
Delta VOS
Rise/Fall Time
VOD
ΔVOD
VOS
ΔVOS
Tr, Tf
250
–
1.125
–
–
–
–
–
–
340
530
50
1.375
50
460
Jitter
RMS Phase Jitter (random) –
DCO Mode Only
T_phj
–
–
RMS Phase Jitter (random) –
Any-frequency Mode Only
T_phj
–
–
RMS Period Jitter
[4]
Note:
4. Measured according to JESD65B.
T_jitt
–
0.21
0.060
0.21
0.070
1
0.255
0.070
0.320
0.80
1.6
ps
ps
ps
ps
ps
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08 MHz, IEEE802.3-2005 10 GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Integration bandwidth = 12 kHz to 20 MHz,
all Vdd levels
f = 622.08 MHz, IEEE802.3-2005 10 GbE jitter mask
integration bandwidth = 1.875 MHz to 20 MHz, all Vdd levels
f = 622.08 MHz, Vdd = 3.3 V or 2.5 V
mV
mV
V
mV
ps
f = 622.08 MHz. See
Figure 7
See
Figure 7
See
Figure 7
See
Figure 7
Measured with 2 pF capacitive loading to GND, 20% to 80%,
//声程处理
void rangeprocess(long int nMyRange,long int nMyPDelay)
{
//float screenvalue;
long int nTotal;
long int nDiv;
long int nAverage,nResidual,temp;
int i,j; ......
2008年7月9日, CombOLED 研究项目的工作重点是开发出高性价比的生产工艺，以实现有机发光二极管 (OLED) 的量产。欧司朗光电半导体公司固态照明部主管 Bernhard Stapp 表示：“该项目由欧盟提供资金支持，欧司朗负责协调运作，旨在为推行新型照明光源应用创造必要的条件。”这包括采用性价比卓越的方法构建新型元件架构，从而生产出大幅面透明光源。作为 LED 市场的创新推...[详细]
UHF和HF都是一般的技术分类，不过每一类都有独立的支持协议。HF在13.56MHz频段更具有一致性，虽然国际业内行业标准很多。UHF RFID在858-960MHz频段已商业化。同时也有多种国际标准支持，包括EPC global Gen 2。 标签与读写器通过无线链接交换数据。链接可以通过适合任何频段的、具有不同读取范围和抗干扰性的EMF或RF场实现。HF RFID技术主要通过电磁场传送信...[详细]
TI技术论坛
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
