SERIAL INPUT LOADING, 16 us SETTLING TIME, 13-BIT DAC, PDSO8
串行输入负载, 16 us 稳定 时间, 13位 数模转换器, PDSO8
| 参数名称 | 属性值 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最大工作温度 | 70 Cel |
| 最小工作温度 | 0.0 Cel |
| 额定供电电压 | 5 V |
| 最大线性误差 | 0.0061 % |
| 加工封装描述 | UMAX-8 |
| 状态 | ACTIVE |
| 工艺 | CMOS |
| 包装形状 | SQUARE |
| 包装尺寸 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 表面贴装 | Yes |
| 端子形式 | GULL WING |
| 端子间距 | 0.6500 mm |
| 端子涂层 | TIN LEAD |
| 端子位置 | DUAL |
| 包装材料 | PLASTIC/EPOXY |
| 温度等级 | COMMERCIAL |
| 输入格式 | SERIAL |
| 转换器的类型 | 13-BIT DAC |
| 输入位编码 | BINARY |
| 额定建立时间 | 16 us |
| 最大模拟输出电压 | 5 V |
| 最小模拟输出电压 | 0.0 V |
| MAX535BC/D | MAX535BMJA | MAX5351BMJA | MAX5351BEPA | MAX5351BC/D | MAX5351ACPA | MAX535 | MAX5351ACUA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | SERIAL INPUT LOADING, 16 us SETTLING TIME, 13-BIT DAC, PDSO8 | SERIAL INPUT LOADING, 16 us SETTLING TIME, 13-BIT DAC, PDSO8 | SERIAL INPUT LOADING, 16 us SETTLING TIME, 13-BIT DAC, PDSO8 | SERIAL INPUT LOADING, 16 us SETTLING TIME, 13-BIT DAC, PDSO8 | SERIAL INPUT LOADING, 16 us SETTLING TIME, 13-BIT DAC, PDSO8 | SERIAL INPUT LOADING, 16 us SETTLING TIME, 13-BIT DAC, PDSO8 | SERIAL INPUT LOADING, 16 us SETTLING TIME, 13-BIT DAC, PDSO8 | SERIAL INPUT LOADING, 16 us SETTLING TIME, 13-BIT DAC, PDSO8 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
| 表面贴装 | Yes | NO | - | NO | YES | NO | Yes | YES |
| 端子形式 | GULL WING | THROUGH-HOLE | - | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | GULL WING | GULL WING |
| 端子位置 | DUAL | DUAL | - | DUAL | UPPER | DUAL | DUAL | DUAL |
| 温度等级 | COMMERCIAL | MILITARY | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 输入格式 | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 最大模拟输出电压 | 5 V | 5 V | - | 3.3 V | 3.3 V | 3.3 V | 5 V | 3.3 V |
| 是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 |
| 厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) |
| 零件包装代码 | - | DIP | DIP | DIP | DIE | DIP | - | SOIC |
| 包装说明 | - | DIP, DIP8,.3 | 0.300 INCH, CERDIP-8 | DIP, DIP8,.3 | DIE, | DIP, DIP8,.3 | - | TSSOP, TSSOP8,.19 |
| 针数 | - | 8 | 8 | 8 | 8 | 8 | - | 8 |
| Reach Compliance Code | - | not_compliant | _compli | _compli | compli | _compli | - | _compli |
| 转换器类型 | - | D/A CONVERTER | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | - | D/A CONVERTER |
| 输入位码 | - | BINARY | - | BINARY | BINARY | BINARY | - | BINARY |
| JESD-30 代码 | - | R-GDIP-T8 | - | R-PDIP-T8 | R-XUUC-N8 | R-PDIP-T8 | - | S-PDSO-G8 |
| JESD-609代码 | - | e0 | - | e0 | e0 | e0 | - | e0 |
| 最大线性误差 (EL) | - | 0.0244% | - | 0.0244% | 0.0244% | 0.0122% | - | 0.0122% |
| 位数 | - | 13 | - | 13 | 13 | 13 | - | 13 |
| 最高工作温度 | - | 125 °C | - | 85 °C | 70 °C | 70 °C | - | 70 °C |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | - | DIP | - | DIP | DIE | DIP | - | TSSOP |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | SQUARE |
| 封装形式 | - | IN-LINE | - | IN-LINE | UNCASED CHIP | IN-LINE | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | - | 245 | NOT SPECIFIED | 245 | - | 245 |
| 认证状态 | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
| 标称安定时间 (tstl) | - | 16 µs | - | 16 µs | 16 µs | 16 µs | - | 16 µs |
| 标称供电电压 | - | 5 V | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
| 技术 | - | CMOS | - | CMOS | CMOS | CMOS | - | CMOS |
| 端子面层 | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn85Pb15) | TIN LEAD | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn85Pb15) |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
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