RF2 and RF3 are standard units. RF4 only on request.
Terminal Material: 97Sn/2.5Cu/0.5Ag
Operating Temperature Range: 0 °C to +70 °C
Storage Temperature Range: -40 °C to +85 °C
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
RF2, RF3, RF4 Series - Wideband Transformers
Packaging Dimensions
330
DIA.
(12.99)
2.0
±
0.5
(.079
±
.020)
28.4
(1.12)
13.0
±
0.5
(.512
±
.020)
DIA.
50.0
(1.969)
13.0
±
0.5
DIA.
(.512
±
.020)
24
(0.95)
EMBOSSED
CARRIER
THICKNESS
0.10
(.004)
MAX.
EMBOSSED
CAVITY
21.0
±
0.8
(.827
±
.031)
Tape Dimensions for “W” Type
7.50
(.295)
1.75
(.069)
7.1
(.280)
6.7
(.264)
4.9
(.193)
2.00
(.079)
4.00
(.157)
12.00
(.472)
1.50
DIA.
(.059)
16.00 ± 0.30
(.630 ± .012)
5°
8.2
(.323)
1.50
DIA. MIN.
(.059)
11.2
(.441)
Tape Dimensions for “J” Type
7.50
(.295)
1.75
(.069)
2.00
(.079)
4.00
(.157)
12.00
(.472)
1.50
DIA.
(.059)
7.9
(.311)
16.00 ± 0.30
(.630 ± .012)
5°
8.9
(.350)
4.9
(.193)
1.50
DIA. MIN.
(.059)
DIMENSIONS:
6.1
(.240)
6.6
(.260)
MM
(INCHES)
REV. 02/14
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
FPGA/CPLD
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