Configuration Memory, 1MX1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | SOIC |
| 包装说明 | SON, SOLCC8,.25 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大时钟频率 (fCLK) | 15 MHz |
| JESD-30 代码 | S-XDSO-N8 |
| JESD-609代码 | e0 |
| 长度 | 6 mm |
| 内存密度 | 1048576 bit |
| 内存集成电路类型 | CONFIGURATION MEMORY |
| 内存宽度 | 1 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX1 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | SON |
| 封装等效代码 | SOLCC8,.25 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.14 mm |
| 最大压摆率 | 0.01 mA |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6 mm |
| 写保护 | HARDWARE |
| Base Number Matches | 1 |
| AT17C010-10CC | AT17C010-10CI | TW-36-09-L-S-388-SM-LC | AT17C512-10PI | AT17C010-10PC | AT17C512-10PC | AT17C512-10CC | AT17C512-10CI | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Configuration Memory, 1MX1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 1MX1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Board Connector, 36 Contact(s), 1 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount Terminal, Black Insulator | Configuration Memory, 512KX1, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | Configuration Memory, 1MX1, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | Configuration Memory, 512KX1, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | Configuration Memory, 512KX1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 | Configuration Memory, 512KX1, Serial, CMOS, 6 X 6 MM, 1.04 MM HEIGHT, 1.27 MM PITCH, LAP-8 |
| Reach Compliance Code | unknown | unknow | compliant | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最高工作温度 | 70 °C | 85 °C | 125 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 端子节距 | 1.27 mm | 1.27 mm | 2 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | SOIC | SOIC | - | DIP | DIP | DIP | SOIC | SOIC |
| 包装说明 | SON, SOLCC8,.25 | SON, SOLCC8,.25 | - | DIP, DIP8,.3 | DIP, DIP8,.3 | DIP, DIP8,.3 | SON, SOLCC8,.25 | SON, SOLCC8,.25 |
| 针数 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
| 最大时钟频率 (fCLK) | 15 MHz | 15 MHz | - | - | 15 MHz | 15 MHz | 15 MHz | 15 MHz |
| JESD-30 代码 | S-XDSO-N8 | S-XDSO-N8 | - | R-PDIP-T8 | R-PDIP-T8 | R-PDIP-T8 | S-XDSO-N8 | S-XDSO-N8 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 | e0 |
| 长度 | 6 mm | 6 mm | - | 9.398 mm | 9.398 mm | 9.398 mm | 6 mm | 6 mm |
| 内存密度 | 1048576 bit | 1048576 bi | - | 524288 bit | 1048576 bit | 524288 bit | 524288 bit | 524288 bit |
| 内存集成电路类型 | CONFIGURATION MEMORY | CONFIGURATION MEMORY | - | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY | CONFIGURATION MEMORY |
| 内存宽度 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | - | 8 | 8 | 8 | 8 | 8 |
| 字数 | 1048576 words | 1048576 words | - | 524288 words | 1048576 words | 524288 words | 524288 words | 524288 words |
| 字数代码 | 1000000 | 1000000 | - | 512000 | 1000000 | 512000 | 512000 | 512000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 组织 | 1MX1 | 1MX1 | - | 512KX1 | 1MX1 | 512KX1 | 512KX1 | 512KX1 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | SON | SON | - | DIP | DIP | DIP | SON | SON |
| 封装等效代码 | SOLCC8,.25 | SOLCC8,.25 | - | DIP8,.3 | DIP8,.3 | DIP8,.3 | SOLCC8,.25 | SOLCC8,.25 |
| 封装形状 | SQUARE | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | SERIAL | SERIAL | - | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 240 | 240 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 240 | 240 |
| 电源 | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.14 mm | 1.14 mm | - | 4.318 mm | 4.318 mm | 4.318 mm | 1.14 mm | 1.14 mm |
| 最大压摆率 | 0.01 mA | 0.01 mA | - | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA |
| 最大供电电压 (Vsup) | 5.25 V | 5.5 V | - | 5.5 V | 5.25 V | 5.25 V | 5.25 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.5 V | - | 4.5 V | 4.75 V | 4.75 V | 4.75 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | - | NO | NO | NO | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | NO LEAD | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 6 mm | 6 mm | - | 7.62 mm | 7.62 mm | 7.62 mm | 6 mm | 6 mm |
| 写保护 | HARDWARE | HARDWARE | - | HARDWARE | HARDWARE | HARDWARE | HARDWARE | HARDWARE |
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