Memory Stick
®
Connectors
CB1 Series
sOutline
Receptacle connectors for use with the new generation of digital media devices requiring “Memory Stick
®
” type of
consumer removable memory card.
Several variations are available: Miniature, Low Profile and with or without ejection mechanism.
Visual
Audio
Data
s
Features
<For all the CB1 Series>
1.Indication of incorrect card insertion
The connector will not allow the card to be complete
inserted from the wrong end or reversed.
The card will stop about 7mm before complete insertion
position, visually indicating incorrect insertion.
q
Low-Profile connector, Push insert/ Push eject
2. Protection of the contacts
Incorrect insertion of the card will not damage the
contacts. The card can be easily withdrawn and re-
inserted correctly.
q
Low-Profile connector, without card Ejection Function
<CB1E Series Low-Profile connector (Push insert/ Push eject) >
1. Low-Profile
With a protrusion above the mounting surface of only 3.5mm
the connector is ideally suited for miniature or thin devices.
2. Large ejection distance of 6.2mm allows
convenient handling of the card
3. Several variations
The metal cover configuration may be selected,
depending on the requirements of specific application:
• Card insertion verification window;
• Side card guides;
q
Connector, with card Ejection Function
Left button eject
Right button eject
<CB1D Series Low-Profile (Without card Ejection Function)>
1. 3.55mm protrusion above the mounting surface
2. Provided with the holes for M1.7 screw, if
additional hold to the board is required
*Memory
Stick is a registered trademark of the Sony Corporation.
C23
sProduct
Specifications
Current rating 0.5A
Rating
Voltage rating 125V AC
Operating temperature range
-20
ç
to +85
ç(Note)
-40
ç
to +85
ç
Operating humidity range
Relative humidity 96% max.
(No condensation)
Storage temperature range
Item
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Vibration
5. Humidity
Specification
1000 M ohms min.
No flashover or insulation breakdown
100 m ohms max.
No electrical discontinuity of 1
µs
or more
Contact resistance: 40 m ohms max. from initial value
Insulation resistance: 100 M ohms min.
Contact resistance: 40 m ohms max. from initial value
Insulation resistance: 100 M ohms min.
Contact resistance: 40m ohms max. from initial value
No deformation of components affecting performance.
500 V DC
Conditions
500 V AC / one minute
100mA DC
Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis
96 hours at temperature of 40ç±2ç and humidity
of 90% to 95%
Temperature: -55ç/+5ç to +35ç/+85ç/+5ç to +35ç
Duration: 30/5/30/5(Minutes)
5 cycles
12000 cycles at 400 to 600 cycles per hour
Reflow: At the recommended temperature profile
Manual soldering: 300ç for 3 seconds
6. Temperature cycle
7. Durability
(mating/unmating)
8. Resistance to
soldering heat
Note :Includes temperature rise caused by current flow.
sMaterials
Part
Insulator
Contacts
Metal hold down
Cover
Eject mechanism components
Material
Heat resistant glass reinforced
therm oplastic compound
Phosphor bronze
Phosphor bronze
Stainless steel
Stainless steel
Finish
Color: Black
Contact area: Gold plating
Termination area: Solder plating
Contact area: Nickel plating
Termination area: Solder plating
----------
----------
Remarks
UL94V-0
----------
CB1E Series is without the
termination area.
The CB1E Series has termination
area with solder plating.
----------
sOrdering
information
CB 1 E - 10 S - 1.5 H - PEJC
1
1
Series name
2
Series No.
3
Ejector type
2
: CB
:1
3
4
5
6
7
8
:E
With eject mechanism
C
D
Without eject mechanism
A
4
Number of contacts : 10
5
Connector type S : Receptacle
}
}
6
Contact pitch : 1.5 mm
7
Surface mount
8
Eject mechanism codes:
PEJC : Card Push insert/Push eject
EJL : Left button eject
EJR : Right button eject
C24
sLow-Profile
connector (Card Push insert-Push eject)
BPCB
mounting pattern
30.4
26.8
(5.525)
Memory Stick card outline
(3.25)
(13.3)
2.4±0.1
26.8±0.1
2.4±0.1
3.2
10.1
CB1EB-10S-1.5H-PEJC2
689-0026-9
0.6
P=1.5
13.5
CONTACT No.1
9.3
10.5±0.1
8.6±0.1
4±0.1
Part Number
CL No.
24±0.03
40.8
24
4±0.1
3.5
0.9±0.05
P=1.5±0.03
9.3±0.05
sLow-Profile
connector (Card Push insert-Push eject)
U-Shaped cut-out
BPCB
mounting pattern
30.4
26.8
13.4
(5.525)
Memory Stick card outline
8.85
3.85
(3.25)
(13.3)
2.4±0.1
26.8±0.1
2.4±0.1
15.1
3.2
Part Number
CB1EBG-10S-1.5H-PEJC2
CL No.
689-0034-7
10.1
24±0.03
CONTACT No.1
3.5
9.3
10.5±0.1
8.6±0.1
4±0.1
40.8
24
4±0.1
0.6
P=1.5
13.5
0.9±0.05
P=1.5±0.03
9.3±0.05
C25
sLow-Profile
connector (Card Push insert-Push eject)
Square Window
29.4
26.8
8.3
(5.525)
Memory Stick card outline
3.85
(3.25)
BPCB
mounting pattern
8.1
(13.3)
1.9±0.1
3.6
26.8±0.1
1.9±0.1
23.8
3.2
24±0.03
CONTACT No.1
3.5
9.3
10.5±0.1
8.6±0.1
4±0.1
Part Number
CB1EBH-10S-1.5H-PEJC2
CL No.
689-0035-0
10.1
40.8
24
4±0.1
0.6
P=1.5
13.5
0.9±0.05
P=1.5±0.03
9.3±0.05
BCard
insertion/widthrawal dimensions
All CB1E Series connectors
(1.3)
19.5±0.7
13.3±0.4
Card partially inserted
(Temporary)
Card fully inserted
12±0.4
Card pushed for ejection
19.5±0.7
(6.2)
(7.5)
Card ejected
(Card ejected dimension)
C26
(6.2)
sLow-Profile
- Without Card Ejection
BPCB
mounting pattern
24.7
3.5
.3
Ø1
19.5
Ø1
.3
+0
0 .05
1.05±0.05
4.15±0.05
+0
0 .05
18.7±0.03
6.1±0.05
1.4
5.5
CONTACT No.1
0.6
P=1.5
13.5
24.5
4.15
5.8
6.95
3.55
2±0.1
0.3
1±0.1
P=1.5±0.05
13.5±0.05
5.8±0.05
1±0.1
Part Number
CB1D-10S-1.5H
CL No.
689-0021-5
0.6
±1.2
18.7
4.15
BMemory
Stick card insertion direction
BMemory
Stick fully inserted dimensions
21.45
3.35
32.2
19.5
9.7
47.6
2±0.1
1.45
6.1±0.05
.3
Ø1
Ø
8
1.
1
0.
+ 0
2.65±0.03
C27
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