Dual-Port SRAM, 8KX9, 18ns, CMOS, PQFP100, TQFP-100
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | LFQFP, |
| 针数 | 100 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 18 ns |
| 其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| JESD-30 代码 | S-PQFP-G100 |
| JESD-609代码 | e3 |
| 长度 | 14 mm |
| 内存密度 | 73728 bit |
| 内存集成电路类型 | DUAL-PORT SRAM |
| 内存宽度 | 9 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 100 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8KX9 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 14 mm |
| Base Number Matches | 1 |
| IDT70V9159L7PFGI8 | IDT70V9159L7PFG8 | IDT70V9169L7PFG8 | IDT70V9169L9PFG8 | IDT70V9159L9PFG8 | IDT70V9159L6PFG8 | |
|---|---|---|---|---|---|---|
| 描述 | Dual-Port SRAM, 8KX9, 18ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 8KX9, 18ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 16KX9, 18ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 16KX9, 20ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 8KX9, 20ns, CMOS, PQFP100, TQFP-100 | Dual-Port SRAM, 8KX9, 15ns, CMOS, PQFP100, TQFP-100 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP |
| 包装说明 | LFQFP, | LFQFP, | LFQFP, | LFQFP, | LFQFP, | LFQFP, |
| 针数 | 100 | 100 | 100 | 100 | 100 | 100 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 18 ns | 18 ns | 18 ns | 20 ns | 20 ns | 15 ns |
| 其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| JESD-30 代码 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 | S-PQFP-G100 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
| 内存密度 | 73728 bit | 73728 bit | 147456 bit | 147456 bit | 73728 bit | 73728 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 100 | 100 | 100 | 100 | 100 | 100 |
| 字数 | 8192 words | 8192 words | 16384 words | 16384 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 16000 | 16000 | 8000 | 8000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 8KX9 | 8KX9 | 16KX9 | 16KX9 | 8KX9 | 8KX9 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN | MATTE TIN | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
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