LS SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDIP16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| Reach Compliance Code | not_compliant |
| 系列 | LS |
| JESD-30 代码 | R-GDIP-T16 |
| 长度 | 19.56 mm |
| 负载电容（CL） | 5 pF |
| 逻辑集成电路类型 | MULTIPLEXER |
| 功能数量 | 1 |
| 输入次数 | 8 |
| 输出次数 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 最大电源电流（ICC） | 10 mA |
| 传播延迟（tpd） | 45 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| SN74LS251J | SN54LS251W | SN54251W | SN54251J | SN74S251D | SN74S251FN | |
|---|---|---|---|---|---|---|
| 描述 | LS SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDIP16 | LS SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16 | TTL/H/L SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, CDFP16, CERAMIC, FP-16 | Data Selectors/Multiplexers With 3-State Outputs 16-CDIP -55 to 125 | 8-Line To 1-Line Data Selectors/Multiplexers With 3-State Outputs 16-SOIC 0 to 70 | S SERIES, 8 LINE TO 1 LINE MULTIPLEXER, COMPLEMENTARY OUTPUT, PQCC20 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| Reach Compliance Code | not_compliant | unknown | unknown | not_compliant | not_compliant | not_compliant |
| 系列 | LS | LS | TTL/H/L | TTL/H/L | S | S |
| JESD-30 代码 | R-GDIP-T16 | R-CDFP-F16 | R-CDFP-F16 | R-GDIP-T16 | R-PDSO-G16 | S-PQCC-J20 |
| 长度 | 19.56 mm | 10.2 mm | 10.2 mm | 19.56 mm | 9.9 mm | 8.9662 mm |
| 负载电容（CL） | 5 pF | 5 pF | 50 pF | 50 pF | 15 pF | 15 pF |
| 逻辑集成电路类型 | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 20 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DFP | DFP | DIP | SOP | QCCJ |
| 封装等效代码 | DIP16,.3 | FL16,.3 | FL16,.3 | DIP16,.3 | SOP16,.25 | LDCC20,.4SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | FLATPACK | FLATPACK | IN-LINE | SMALL OUTLINE | CHIP CARRIER |
| 传播延迟（tpd） | 45 ns | 45 ns | 45 ns | 45 ns | 19.5 ns | 19.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 2.03 mm | 2.03 mm | 5.08 mm | 1.75 mm | 4.57 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.5 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.5 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | GULL WING | J BEND |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| 宽度 | 7.62 mm | 6.73 mm | 6.73 mm | 7.62 mm | 3.9 mm | 8.9662 mm |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | - | - | 5 V | 5 V |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 零件包装代码 | - | DFP | DFP | DIP | SOIC | - |
| 包装说明 | - | DFP, FL16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | QCCJ, LDCC20,.4SQ |
| 针数 | - | 16 | 16 | 16 | 16 | - |
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