5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 Fax 401-823-8723 Email advintcorp@aol.com Internet http://www.advintcorp.com
.100" (2.54 mm) Pitch Board to Board Interconnections
NB/LNB - Single Row
Molded Female
DRS - Dual Row
Molded Female
NA - Single Row
Molded Male
DRA - Dual Row
Molded Male
KSS - Single Row
Peel-A-Way
®
Female
DKS - Dual Row
Peel-A-Way
®
Female
NEW PHOTO
Low Profile
Board to Board
KSA - Single Row
Peel-A-Way
®
Male
DKA - Dual Row
Peel-A-Way
®
Male
Features:
!
High reliability method of
interconnecting.
!
Reliable mechanical support.
!
Complete flexibility. If the board to
board spacing you need is not shown
on pages 54 - 55 , consult factory.
Terminals and Contacts:
Terminal: Brass - Copper Alloy 360,
ASTM-B-16
Contact: Beryllium Copper - Copper
Alloy 172, ASTM-B-194
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Body Material:
Molded -
Glass filled thermoplastic
Polyester (P
.B.T.) U.L. Rated 94V-O,
-60
°
C to 140
°
C (-76
°
F to 284
°
F)
High Temp Molded
- High temp. glass
filled thermoplastic, U.L. Rated 94V-O,
-60
°
C to 260
°
C (-76
°
F to 500
°
F)
Peel-A-Way
®
- Polyimide Film - Temp.
range -269
°
C to 400
°
C(-452
°
F to 752
°
F)
Page 52
How To Order
Single and Dual RowFemale
NB
010
-01
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See page 53 for available
terminal types.
Body Type
NB/LNB - Single Row Molded
HNB/HLNB - Single Row High Temp Molded
KSS - Single Row Peel-A-Way
®
DRS - Dual Row Molded
HDRS - Dual Row High Temp Molded
DKS - Dual Row Peel-A-Way
®
Number of Pins
NB/LNB - 3 - 32, KSS - 2 - 100
DRS - 20 - 70, DKS - 4 - 200
How To Order
Single and Dual Row Male
NA
Body Type
NA - Single Row Molded
HNA - Single Row High Temp Molded
KSA - Single Row Peel-A-Way
®
DRA - Dual Row Molded
HDRA - Dual Row High Temp Molded
DKA - Dual Row Peel-A-Way
®
010
-68
T
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See page 53 for available
terminal types.
Number of Pins
NA/HNA - 3 - 32, KSA - 2 - 100
DRA/HDRA - 20 - 70, DKA - 4 - 200
Peel-A-Way® covered by patent rights issued and or pending.
inch/(mm)
Quick turn delivery available on standard terminal types.
.
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 •Fax 401-823-8723 •Email advintcorp@aol.com •Internet http://www.advintcorp.com
®
®
ADVANCED
Board to Board Interconnections
INTERCONNECTIONS
.100" (2.54 mm) Pitch Board to Board Interconnections
Male Terminal Information
Peel-A-Way® Only
.072 Dia.
(1.83)
.125
(3.18)
.070
(2.16)
.030
(.76)
.125
(3.18)
.125
(3.18)
.018 Dia.
(.46) Typ. 2
.018 Dia.
(.46) Typ. 2
Type -79
Peel-A-Way® Only
.072 Dia.
(1.83)
.125
(3.18)
Type -80
Peel-A-Way® Only
.072 Dia.
(1.83)
.125
(3.18)
.085
(2.16)
.125
(3.18)
Type -81
Type -444
.018 Dia.
(.46)
.125
(3.18)
.052
(1.32)
.103
(2.62)
.125
(3.18)
.018 Dia.
(.46)
.018 Dia.
(.46) Typ. 2
Type -68
.018 Dia.
(.46)
.125
(3.18)
.100
(2.54)
Type -43
.018 Dia.
(.46)
.125
(3.18)
Type -399
.018 Dia.
(.46)
.125
(3.18)
Type -185
.018 Dia.
(.46)
.125
(3.18)
.210
(5.33)
.335
(8.51)
.100
(2.54)
.100
(2.54)
.379
(9.63)
.100
(2.54)
.500
(12.70)
Board to Board
.125
(3.18)
.018 Dia.
(.46)
.018 Dia.
(.46)
.125
(3.18)
.018 Dia.
(.46)
.125
(3.18)
.018 Dia.
(.46)
.125
(3.18)
Type -42
.018 Dia.
(.46)
.125
(3.18)
Type -398
.018 Dia.
(.46)
.125
(3.18)
Type -403
.018 Dia.
(.46)
.125
(3.18)
Type -71
.018 Dia.
(.46)
.125
(3.18)
.585
(14.86)
.100
(2.54)
.100
(2.54)
.679
(17.25)
.100
(2.54)
.750
(19.06)
.100
(2.54)
.835
(21.21)
.018 Dia.
(.46)
.125
(3.18)
.018 Dia.
(.46)
.125
(3.18)
.018 Dia.
(.46)
.125
(3.18)
.018 Dia.
(.46)
.125
(3.18)
Female Terminal Information
Peel-A-Way® Only
.058 Dia.
(1.47)
Type -210
Peel-A-Way® Only
.058 Dia.
(1.47)
Type -85
Type -299*
.050(1.27) Molded Insulator Thickness
.072 Dia.
(1.83)
Type -49*
.072 Dia.
(1.83)
.015
(.38)
.083
(2.11)
.155
(3.94)
.031
(.79)
.095
(2.41)
.155
(3.94)
.082
(2.08)
.095
(2.41)
.028 Dia.
(.71)
.034 Dia.
(.86)
.038 Dia.
(.97)
.025 Dia.
(.64)
Type -04*
.072 Dia.
(1.83)
Type -51*
.072 Dia.
(1.83)
Type -01
Molded Body Only
.072 Dia.
(1.83)
Peel-A-Way® Only
.072 Dia.
(1.83)
Type -33
.120
(3.05)
.130
(3.30)
.165
(4.19)
.165
(4.19)
.110
(2.79)
.028 Dia.
(.71)
.020 Dia.
(.51)
.110
(2.79)
.125
(3.18)
.020 Dia.
(.51)
.125
(3.18)
.020 Dia.
(.51)
inch/(mm)
* These terminal types are available in either molded or Peel-A-Way®.
Peel-A-Way® covered by patent rights issued and or pending.
在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
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