REVISIONS
LTR
A
DESCRIPTION
Change to Military drawing format. Page 8 table I; change group A
subgroup for +V
R
and -V
R
; add end-point electrical limits for +V
RINT
and -V
RINT
. Page 10: Change output offset adjust and temperature
effect for device types 03 and 04 trim circuits.
Add device types 05 and 06. Inactivate case outline X. Add case
outlines C, Y, and 3. Add vendors CAGE 33256 and 34707. Change
drawing CAGE code to 67268. Editorial changes throughout.
Changed to reflect MIL-H-38534 processing. Update document.
Editorial changes throughout.
Changes in accordance with NOR 5962-R212-93.
Changes in accordance with NOR 5962-R045-94.
Changes to table I, note 1.
Corrections to sheet 1, figure 1- case outlines X and Y, and figure 3.
Update drawing boilerplate.
Figure 1, case outline Y, correct the row to row spacing symbol from
L
1
to E
1
.
DATE (YR-MO-DA)
86-12-31
APPROVED
N. A. Hauck
B
89-08-01
W. Heckman
C
D
E
F
G
H
92-12-22
93-08-17
93-11-18
99-01-08
05-01-10
07-01-26
K. A. Cottongim
K. A. Cottongim
K. A. Cottongim
K. A. Cottongim
Raymond Monnin
Joseph Rodenbeck
THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.
CURRENT CAGE CODE 67268
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
H
1
H
2
H
3
H
4
H
5
H
6
H
7
H
8
H
9
H
10
H
11
H
12
PREPARED BY
Donald R. Osborne
CHECKED BY
D. A. Di Cenzo
STANDARD
MICROCIRCUIT
DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
POST OFFICE BOX 3990
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
N. A. Hauck
MICROCIRCUIT, HYBRID, LINEAR,
PRECISION VOLTAGE REFERENCES,
THIN FILM
DRAWING APPROVAL DATE
86-04-28
REVISION LEVEL
H
SIZE
A
SHEET
CAGE CODE
14933
1 OF
12
85030
5962-E045-07
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing describes device requirements for class H hybrid microcircuits to be processed in accordance with
MIL-PRF-38534 and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying
Number (PIN).
1.2 PIN. The PIN shall be as shown in the following example:
85030
⎮
⎮
⎮
Drawing number
01
⎮
⎮
⎮
Device type
(see 1.2.1)
X
⎮
⎮
⎮
Case outline
(see 1.2.2)
X
⎮
⎮
⎮
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01, 02
03, 04
05, 06
Generic number
2700
2702
2701
Circuit function
Precision +10.000-volt reference
Precision
±10.000-volt
reference
Precision -10.000-volt reference
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter
C
X
Y
3
Descriptive designator
GDIP1-T14, CDIP1-T14
See figure 1
See figure 1
CQCC1-N28
Terminals
14
14
14
28
Package style
Dual-in-line
Dual-in-line
Dual-in-line
Square leadless chip-carrier
1.2.3 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage (V
S
):
V
CC
(device types 01, 02, 03, 04).............................................
V
EE
(device types 03, 04, 05, 06) .............................................
Power dissipation (P
D
), T
A
= +25°C:
Device types 01, 02, 05, 06 .....................................................
Device types 03, 04 .................................................................
Storage temperature range .........................................................
Lead temperature (soldering, 10 seconds) ..................................
Short circuit protection (to GND) .................................................
Thermal resistance:
Junction-to-case (θJ
C
):
Case outlines C and 3 ..........................................................
Case outline X......................................................................
Case outline Y......................................................................
Junction-to-ambient (θJ
A
):
Case outline X......................................................................
Case outline Y......................................................................
+20 V dc
-20 V dc
300 mW
450 mW
-65°C to +150°C
+300°C
Continuous
See MIL-STD-1835
7°C/W
8°C/W
30°C/W
25°C/W
1/
Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
85030
SHEET
H
2
DSCC FORM 2234
APR 97
1.4 Recommended operating conditions.
Supply voltage range (V
CC
)..........................................................
Supply voltage (V
EE
) ....................................................................
Output current .............................................................................
Ambient operating temperature range (T
A
)..................................
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device class H shall be in accordance with MIL-
PRF-38534. Compliance with MIL-PRF-38534 may include the performance of all tests herein or as designated in the device
manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may
eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-
38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or
function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
+13.5 V dc to +16.5 V dc
-13.5 V dc to -16.5 V dc
5 mA 1/
-55°C to +125°C
1/
With resistive load to pin 7 (common).
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
85030
SHEET
H
3
DSCC FORM 2234
APR 97
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Trim circuits. The trim circuits shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in method 1015 of MIL-STD-883.
T
A
as specified in accordance with table I of method 1015 of MIL-STD-883.
(2)
b.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
85030
SHEET
H
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/
-55°C
≤
T
A
≤
+125°C
unless otherwise specified
+10.000 V output
Group A
subgroups
Device
type
Min
Selection output error 2/
+V
R
4
5,6
+10.000 V output
4
5,6
+10.000 V output
4
5,6
-V
R
-10.000 V output
4
5,6
-10.000 V output
4
5,6
Interim output error
+V
RINT
+10.000 V output Initial
T
A
= +25°C
End-point
-V
RINT
-10.000 V output
T
A
= +25°C
Initial
End-point
Output adjust range for trim
circuits (see figure 3)
+V
RADJ
-V
RADJ
Quiescent current
I
CC
+10.000 V output, T
A
= +25°C
-10.000 V output, T
A
= +25°C
V
CC
= +15 V, no load
T
A
= +25°C
V
CC
= +15 V,
V
EE
= -15 V, no load
T
A
= +25°C
I
EE
V
CC
= +15 V, no load
V
EE
= -15 V
T
A
= +25°C
V
CC
= +15 V,
V
EE
= -15 V, no load
T
A
= +25°C
See footnotes at end of table.
1
1
1
1
01,02,
03,04
03,04,
05,06
01,02
03,04
1
03,04,
05,06
1
01,02,
03,04
04,06
03,05
03
02,04
01
-5.0
-8.0
-2.5
-5.5
-5.0
-10
+5.0
+10
+2.5
+5.5
-5
-10
+5
+10
-20
+20
Limits
Max
+5.0
+8.0
+2.5
+5.5
+5.0
+10
-5.0
-10
-2.5
-5.5
+5
+10
-5
-10
+20
-20
+14
+17
mV
mV
mA
mA
mV
mV
mV
mV
mV
mV
mV
Unit
1
03,04
-4
mA
1
05,06
-14
mA
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
85030
SHEET
H
5
DSCC FORM 2234
APR 97
DSP 与 ARM 处理器
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