Bi-Directional FIFO, 8KX36, 10ns, Synchronous, CMOS, PQFP128, GREEN, TQFP-128
参数名称 | 属性值 |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | QFP |
包装说明 | GREEN, TQFP-128 |
针数 | 128 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
最长访问时间 | 10 ns |
其他特性 | MAIL BOX BYPASS REGISTER |
最大时钟频率 (fCLK) | 66.7 MHz |
周期时间 | 15 ns |
JESD-30 代码 | R-PQFP-G128 |
JESD-609代码 | e3 |
长度 | 20 mm |
内存密度 | 294912 bit |
内存集成电路类型 | BI-DIRECTIONAL FIFO |
内存宽度 | 36 |
湿度敏感等级 | 3 |
功能数量 | 1 |
端子数量 | 128 |
字数 | 8192 words |
字数代码 | 8000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 8KX36 |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFQFP |
封装等效代码 | QFP128,.63X.87,20 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 260 |
电源 | 3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大待机电流 | 0.005 A |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 3 V |
标称供电电压 (Vsup) | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 30 |
宽度 | 14 mm |
Base Number Matches | 1 |
72V3674L15PFG | 72V3654L15PFG | 72V3674L10PFG | 72V3664L15PFG | 72V3654L10PFG | |
---|---|---|---|---|---|
描述 | Bi-Directional FIFO, 8KX36, 10ns, Synchronous, CMOS, PQFP128, GREEN, TQFP-128 | Bi-Directional FIFO, 2KX36, 10ns, Synchronous, CMOS, PQFP128, GREEN, TQFP-128 | Bi-Directional FIFO, 8KX36, 6.5ns, Synchronous, CMOS, PQFP128, GREEN, TQFP-128 | Bi-Directional FIFO, 4KX36, 10ns, Synchronous, CMOS, PQFP128, GREEN, TQFP-128 | Bi-Directional FIFO, 2KX36, 6.5ns, Synchronous, CMOS, PQFP128, GREEN, TQFP-128 |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
零件包装代码 | QFP | QFP | QFP | QFP | QFP |
包装说明 | GREEN, TQFP-128 | GREEN, TQFP-128 | GREEN, TQFP-128 | LFQFP, QFP128,.63X.87,20 | GREEN, TQFP-128 |
针数 | 128 | 128 | 128 | 128 | 128 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 10 ns | 10 ns | 6.5 ns | 10 ns | 6.5 ns |
其他特性 | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER | MAIL BOX BYPASS REGISTER |
最大时钟频率 (fCLK) | 66.7 MHz | 66.7 MHz | 100 MHz | 66.7 MHz | 100 MHz |
周期时间 | 15 ns | 15 ns | 10 ns | 15 ns | 10 ns |
JESD-30 代码 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 | R-PQFP-G128 |
JESD-609代码 | e3 | e3 | e3 | e3 | e3 |
长度 | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
内存密度 | 294912 bit | 73728 bit | 294912 bit | 147456 bit | 73728 bit |
内存集成电路类型 | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO | BI-DIRECTIONAL FIFO |
内存宽度 | 36 | 36 | 36 | 36 | 36 |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 128 | 128 | 128 | 128 | 128 |
字数 | 8192 words | 2048 words | 8192 words | 4096 words | 2048 words |
字数代码 | 8000 | 2000 | 8000 | 4000 | 2000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 8KX36 | 2KX36 | 8KX36 | 4KX36 | 2KX36 |
可输出 | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP |
封装等效代码 | QFP128,.63X.87,20 | QFP128,.63X.87,20 | QFP128,.63X.87,20 | QFP128,.63X.87,20 | QFP128,.63X.87,20 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm | 1.6 mm |
最大待机电流 | 0.005 A | 0.005 A | 0.005 A | 0.005 A | 0.005 A |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.45 V | 3.6 V | 3.45 V |
最小供电电压 (Vsup) | 3 V | 3 V | 3.15 V | 3 V | 3.15 V |
标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
宽度 | 14 mm | 14 mm | 14 mm | 14 mm | 14 mm |
Base Number Matches | 1 | 1 | 1 | 1 | - |
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