PARA LIGHT ELECTRONICS CO., LTD.
4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan,
Tel: 886-2-2225-3733
Fax: 886-2-2225-4800
http://www.para.com.tw
E-mail: para@para.com.tw
DATA SHEET
PART NO. :
C-542E G/W
REV :
A/0
CUSTOMER’S APPROVAL : _______________
DRAWING NO. : DS-19-09-0046
DCC : ___________
Page : 1
DATE : 2009-12-09
0.53 ALPHA-NUMERIC DISPLAY
C-542E G/W
PACKAGE DIMENSIONS
REV:A / 0
NOTES : 1. All dimensions are in millimeters. (inches)
2. Tolerance is
±
0.25(0.010") unless otherwise specified.
RAWING NO. : DS-19-09-0046
DATE : 2009-12-09
Page : 2
0.53 ALPHA-NUMERIC DISPLAY
C-542E G/W
FEATURES
13.6mm (0.53 inch ) DIGIT HEIGHT
COMMON CATHODE
I.C. COMPATIBLE
LOW POWER CONSUMPTION
Pb FREE PRODUCTS
ROHS COMPLIANCE
GRAY FACE,WHITE SEGMENTS
Raw Material : GaAsP/GaP
ABSOLUTE MAXIMUM RATING : ( Ta = 25°C )
SYMBOL
P
D
V
R
I
AF
I
PF
－
Topr
Tstg
PARAMETER
Power Dissipation Per Segment
Reverse Voltage Per Segment
Continuous Forward Current Per Segment
Peak Forward Current Per Segment
(1/10 Duty Cycle,0.1ms Pulse Width)
Derating Linear From 25°C Per Segment
Operating Temperature Range
Storage Temperature Range
HI.EFFI RED
75
5
20
100
0.33
UNIT
mW
V
mA
mA
mA/°C
REV:A / 0
－40°C
to 85°C
－40°C
to 85°C
ELECTRO-OPTICAL CHARACTERISTICS : ( Ta = 25°C )
SYMBOL
V
F
I
R
λ
P
λ
D
∆
λ
I
V
PARAMETER
Forward Voltage , Per Segment
Reverse Current , Per Segment
Peak Emission Wavelength
Dominant Wavelength
Spectral Line Half－Width
Luminous Intensity Per Segment
E
0.8-1.11
F
1.12-1.62
TEST CONDITION MIN.
I
F
= 20mA
V
R
= 5V
I
F
= 20mA
I
F
= 20mA
I
F
= 20mA
I
F
= 10mA
G
1.63-2.26
H
2.27-3.14
0.8
632
622
35
2.0
I
3.15-4.14
TYP. MAX. UNIT
2.1
2.8
100
V
µA
nm
nm
nm
mcd
J
4.15-5.07
BIN CODE ( I
F
= 10mA )
BIN
CODE
I
V
(mcd)
DRAWING NO. : DS-19-09-0046
DATE : 2009-12-09
Page : 3
0.53 ALPHA-NUMERIC DISPLAY
C-542E G/W
REV:A / 0
DRAWING NO. : DS-19-09-0046
DATE : 2009-12-09
Page : 4
0.53 ALPHA-NUMERIC DISPLAY
C-542E G/W
SOLDERING
METHOD
SOLDERING CONDITIONS
REMARK
Solder no closer than 2mm from
the base of the package
Using soldering flux,” RESIN
FLUX” is recommended.
REV:A / 0
DIP
SOLDERING
Bath temperature: 260 max
Immersion time: within 5 sec
During soldering, take care not to
Soldering iron: 30W or smaller
press the tip of iron against the
SOLDERING
Temperature at tip of iron: 360
℃
or lower
PIN.
IRON
Soldering time: within 3 sec.
(To prevent heat from being
transferred directly to the PIN.)
1) When soldering the PIN of Display in a jig that the package is fixed with a panel (See fIg.1), be
careful not to stress the PIN with iron tip. When soldering Display in a condition that the package
is fixed with a panel, be careful not to cling and stress the surface of Display on the panel to avoid
damaging the Display.
Fig.1
Regarding solution in the tinning oven for product-tinning, compound sub-solution made of tin &
copper and silver is proposed with the temperature of Celsius 260. The proportion of the
alloyed solution is tin 95.5: copper 3.5: silver 0.5 by percentage. The time of tinning is constantly
3 seconds.
DRAWING NO. : DS-19-09-0046
DATE : 2009-12-09
Page : 5
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