MAX6100EUR
Rev. A
RELIABILITY REPORT
FOR
MAX6100EUR
PLASTIC ENCAPSULATED DEVICES
February 14, 2003
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX6100 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Ma nufacturing Information
III. .......Packaging Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX6100 is a low-cost, low-dropout (LDO), micropower voltage references. This three-terminal reference has an
output voltage option of 1.8V. It features a proprietary curvature-correction circuit and laser-trimmed, thin-film
resistors that result in a low temperature coefficient of 75ppm/°C (max) and an initial accuracy of ±0.4% (max). This
device is specified over the extended temperature range (-40°C to +85°C).
This series-mode voltage reference draws only 90µA of supply current and can source 5mA and sink 2mA of load
current. Unlike conventional shunt-mode (two-terminal) references that waste supply current and require an external
resistor, this device offers a supply current that is virtually independent of the supply voltage (with only a 4µA/V
variation with supply voltage) and does not require an external resistor. Additionally, this internally compensated
device does not require an external compensation capacitor and is stable with load capacitance. Eliminating the
external compensation capacitor saves valuable board area in space-critical applications. Low dropout voltage and
supply-independent, ultra-low supply current makes this device ideal for battery-operated, high-performance, low-
voltage systems.
The MAX6100 is available in a tiny 3-pin SOT23 packages.
B. Absolute Maximum Ratings
Item
(Voltages Referenced to GND)
IN
OUT
Output Short-Circuit to GND or IN (VIN < 6V)
Output Short-Circuit to GND or IN (VIN = 6V)
Operating Temperature Range
Storage Temperature Range
Lead Temperature (soldering, 10s)
Continuous Power Dissipation (TA = +70°C)
3-Pin SOT23
Derates above +70°C
3-Pin SOT23
Rating
-0.3V to +13.5V
-0.3V to (VIN + 0.3V)
Continuous
60s
-40°C to +85°C
-65°C to +150°C
+300°C
320mW
4.0mW/°C
II. Manufacturing Information
A. Description/Function: Low-Cost, Micropower, Low-Dropout, High-Output-Current, SOT23 Voltage References
B. Process:
C. Number of Device Transistors:
D. Fabrication Location:
E. Assembly Location:
F. Date of Initial Production:
III. Packaging Information
A. Package Type:
B. Lead Frame:
C. Lead Finish:
D. Die Attach:
E. Bondwire:
F. Mold Material:
G. Assembly Diagram:
H. Flammability Rating:
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112:
3-Pin SOT23
Copper or Alloy 42
Solder Plate
Silver-filled Epoxy
Gold (1.0 mil dia.)
Epoxy with silica filler
# 05-0901-0179
Class UL94-V0
B12 (Standard 1.2 micron silicon gate CMOS)
117
California or Oregon, USA
Malaysia or Thailand
March, 2001
Level 1
IV. Die Information
A. Dimensions:
B. Passivation:
C. Interconnect:
D. Backside Metallization:
E. Minimum Metal Width:
F. Minimum Metal Spacing:
G. Bondpad Dimensions:
H. Isolation Dielectric:
I. Die Separation Method:
44 x 31mils
Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
Aluminum/Si (Si = 1%)
None
1.2 microns (as drawn)
1.2 microns (as drawn)
5 mil. Sq.
SiO
2
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
Jim Pedicord (Manager, Reliability Operations)
Bryan Preeshl (Executive Director)
Kenneth Huening (Vice President)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
B. Outgoing Inspection Level:
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in
Table 1.
Using these results, the Failure
Rate (λ) is calculated as follows:
λ
=
1
=
MTTF
1.83
(Chi square value for MTTF upper limit)
192 x 4389 x 160 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ
= 6.79 x 10
-9
λ
= 6.79 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-5630) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The RF24-7 die type has been found to have all pins able to withstand a transient pulse of
±1500V,
per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of
±250mA.
Table 1
Reliability Evaluation Test Results
MAX6100EUR
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
SAMPLE
SIZE
NUMBER OF
FAILURES
PACKAGE
Static Life Test
(Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing
(Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
160
0
DC Parameters
& functionality
SOT
77
0
85/85
DC Parameters
& functionality
77
0
Mechanical Stress
(Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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