电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索
 PDF数据手册

5962R9574601VRC

产品描述Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20
产品类别逻辑    逻辑   
文件大小266KB,共12页
制造商Harris
官网地址http://www.harris.com/
下载文档 详细参数 选型对比 全文预览

5962R9574601VRC概述

Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20

5962R9574601VRC规格参数

参数名称属性值
包装说明,
Reach Compliance Codeunknown
计数方向BIDIRECTIONAL
系列HCT
JESD-30 代码R-CDIP-T20
JESD-609代码e4
负载电容(CL)50 pF
逻辑集成电路类型PARALLEL IN PARALLEL OUT
位数8
功能数量1
端子数量20
最高工作温度125 °C
最低工作温度-55 °C
输出特性3-STATE
输出极性TRUE
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状RECTANGULAR
封装形式IN-LINE
传播延迟(tpd)34 ns
认证状态Not Qualified
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层GOLD
端子形式THROUGH-HOLE
端子位置DUAL
总剂量100k Rad(Si) V
触发器类型POSITIVE EDGE
Base Number Matches1

5962R9574601VRC相似产品对比

5962R9574601VRC 5962R9574601V9A 5962R9574601VXC HCTS299HMSR HCTS299KMSR HCTS299DMSR HCTS299D/SAMPLE
描述 Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20 Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDFP20, CERAMIC, DFP-20 Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDFP20 Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20 Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20
包装说明 , DIE, , DIE, DFP, FL20,.3 DIP, DIP20,.3 ,
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
计数方向 BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
系列 HCT HCT HCT HCT HCT HCT HCT
JESD-30 代码 R-CDIP-T20 X-XUUC-N20 R-CDFP-F20 X-XUUC-N20 R-CDFP-F20 R-CDIP-T20 R-CDIP-T20
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 PARALLEL IN PARALLEL OUT PARALLEL IN PARALLEL OUT PARALLEL IN PARALLEL OUT PARALLEL IN PARALLEL OUT PARALLEL IN PARALLEL OUT PARALLEL IN PARALLEL OUT PARALLEL IN PARALLEL OUT
位数 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1
端子数量 20 20 20 20 20 20 20
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 CERAMIC, METAL-SEALED COFIRED UNSPECIFIED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形状 RECTANGULAR UNSPECIFIED RECTANGULAR UNSPECIFIED RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE UNCASED CHIP FLATPACK UNCASED CHIP FLATPACK IN-LINE IN-LINE
传播延迟(tpd) 34 ns 34 ns 34 ns 34 ns 34 ns 34 ns 34 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES YES YES YES NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
端子形式 THROUGH-HOLE NO LEAD FLAT NO LEAD FLAT THROUGH-HOLE THROUGH-HOLE
端子位置 DUAL UPPER DUAL UPPER DUAL DUAL DUAL
触发器类型 POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
JESD-609代码 e4 e0 e4 - e0 e0 -
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C -
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY -
端子面层 GOLD TIN LEAD GOLD - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Base Number Matches 1 1 1 1 - - -
封装代码 - DIE - DIE DFP DIP -
厂商名称 - - Harris - Harris Harris Harris

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 国产芯 大学堂 TI培训 Datasheet 电子工程 索引文件: 72  171  223  665  691 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved