Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20
参数名称 | 属性值 |
包装说明 | , |
Reach Compliance Code | unknown |
计数方向 | BIDIRECTIONAL |
系列 | HCT |
JESD-30 代码 | R-CDIP-T20 |
JESD-609代码 | e4 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | PARALLEL IN PARALLEL OUT |
位数 | 8 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
传播延迟(tpd) | 34 ns |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | GOLD |
端子形式 | THROUGH-HOLE |
端子位置 | DUAL |
总剂量 | 100k Rad(Si) V |
触发器类型 | POSITIVE EDGE |
Base Number Matches | 1 |
5962R9574601VRC | 5962R9574601V9A | 5962R9574601VXC | HCTS299HMSR | HCTS299KMSR | HCTS299DMSR | HCTS299D/SAMPLE | |
---|---|---|---|---|---|---|---|
描述 | Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20 | Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS | Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDFP20, CERAMIC, DFP-20 | Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS | Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDFP20 | Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20 | Parallel In Parallel Out, HCT Series, 8-Bit, Bidirectional, True Output, CMOS, CDIP20 |
包装说明 | , | DIE, | , | DIE, | DFP, FL20,.3 | DIP, DIP20,.3 | , |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
计数方向 | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
系列 | HCT | HCT | HCT | HCT | HCT | HCT | HCT |
JESD-30 代码 | R-CDIP-T20 | X-XUUC-N20 | R-CDFP-F20 | X-XUUC-N20 | R-CDFP-F20 | R-CDIP-T20 | R-CDIP-T20 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT | PARALLEL IN PARALLEL OUT |
位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR | UNSPECIFIED | RECTANGULAR | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | UNCASED CHIP | FLATPACK | UNCASED CHIP | FLATPACK | IN-LINE | IN-LINE |
传播延迟(tpd) | 34 ns | 34 ns | 34 ns | 34 ns | 34 ns | 34 ns | 34 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | YES | YES | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | THROUGH-HOLE | NO LEAD | FLAT | NO LEAD | FLAT | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | UPPER | DUAL | UPPER | DUAL | DUAL | DUAL |
触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
JESD-609代码 | e4 | e0 | e4 | - | e0 | e0 | - |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | - |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | - |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
端子面层 | GOLD | TIN LEAD | GOLD | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
Base Number Matches | 1 | 1 | 1 | 1 | - | - | - |
封装代码 | - | DIE | - | DIE | DFP | DIP | - |
厂商名称 | - | - | Harris | - | Harris | Harris | Harris |
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