Cal-Chip
Electronics, Incorporated
RN S
ERIES
Thin Film Chip Resistors
F
EATURES
• Surface Mount Devices (SMD)
• Precision Tolerances of ±0.5% to ±0.1%
• Temperature Coefficients of ±50ppm/°C and ±25ppm°C
• Precision Performance
• Space Saving Construction
P
ERFORMANCE
C
HARACTERISTICS
(Tested per Mil-STD-202)
Electrical (Operating Temperature Range -55°C to +155°C)
Dimensions in mm
TYPE
Packaging Size
Power Rating
(
Watts)
Max.Working
Voltage
Max. Overload
Voltage
Resistance Temp.
Coefficient
Resistance
Range
Tolerance
1
RN10
RN12
0805
1206
1/8 @ 70°C
1/8@ 70°C
150V
150V
300V
300V
±50ppm/°C
±25ppm/°C
±50ppm/°C
±25ppm/°C
D = ±0.5%
10Ohm - 787K
100Ohm - 100K C=±0.25%, B=±0.1%
10Ohm - 787K
D = ±0.5%
49.9Ohm - 1M C=±0.25%, B=±0.1%
E
NVIRONMENTAL
Moisture Resistance, Thermal Shock
Load Life
Load Life in Moisture
Resistance to Soldering Heat
Solderability
Terminal Strength
Dielectric Withstanding Voltage
Short Time Overload
Insulation Resistance
Specification
±(0.25%+0.05Ω)
±(0.5%+0.05Ω)
±(0.5%+0.05Ω)
±(0.25%+0.05Ω)
min. 95% coverage
±(0.2%+0.05Ω)
±(0.25%+0.05Ω)
±(0.25%+0.05Ω)
1,000 meg minimum
Typical
≤0.1%
≤0.2%
≤0.25%
≤0.05%
≥95%
≤0.05%
≤0.05%
≤0.05%
≥1,000
meg
Test Method
JIS C 5202 7.4
JIS C 5202 7.10
JIS C 5202 7.9
JIS C 5202 6.4, 260±5°C, 10 sec.
JIS C 5202 6.5
EIAJ RC-2609A 6.6
Test Voltage: 10@ 150VAC, RN12 @ 300VAC
EIAJ RC-2609A 6.5
JIS C 5202 7.4
EIAJ RC-2609A 6.36
M
ATERIALS
Feature
Substrate
Resistive Film
Coating
Terminations
Material
Alumina Porcelain
Nickel-Chromium Film
Boro-Silicated Acid Lead Glass
100% matte Tin (Electrical Plated) over
Nickel (Electrical Plated) over
AG-PD (Silver-Palladium [Glaze Printed])
Remarks (Reference Only)
Purity 96% min.
20 Microns Thick
20 Microns Thick
3/5 Microns Thick
3/8 Microns Thick
8 Microns Thick
Dimensions in mm
Glass Coat
Resistive Film
Substrate
Terminations
Feature
L - Body Length
W - Body Width
H - Body Height
a - Top Termination
b - Bottom Termination
RN10
.078±.008 (2.00±0.20)
.049±.008 (1.25±0.20)
.018±.004 (0.45±0.10)
.016±.008 (0.40±0.20)
.012±.008/-.004 (0.30+0.20/-0.10)
RN12
.122±.004 (3.10±0.10)
.061±.004 (1.55±0.10)
.021+.004/-.002 (0.55+0.10/-0.05)
.018±.008 (0.45±0.20)
.012+.008/-.004 (0.30+0.20/-0.10)
Ordering Information
Example:
RN
Thin Film
10
B
0805 1/10 watt .1% 1k
1001
CT
Packaging (Tape & Reel)
Notes:
1. Embossed taping available on RN12 only.
Wattage
B = .1%
C = .25%
D = .50%
Resistance
Tolerance
*Note
49
Cal-Chip
Electronics, Incorporated
RN S
ERIES
Thin Film Chip Resistors
F
EATURES
• Surface Mount Devices (SMD)
• Precision Tolerances of ±0.5% to ±0.1%
• Temperature Coefficients of ±50ppm/°C and ±25ppm°C
• Precision Performance
• Space Saving Construction
P
ERFORMANCE
C
HARACTERISTICS
(Tested per Mil-STD-202)
Electrical (Operating Temperature Range -55°C to +155°C)
TYPE
RN04
RN06
Packaging Size
0402
0603
Power Rating
(Watts)
1/16 @ 70°C
1/10 @ 70°C
Max. Working
Voltage
50V
75V
Max. Overload
Voltage
100V
150V
Resistance Temp.
Coefficient
±50ppm/°C
±25ppm/°C
±50ppm/°C
±25ppm/°C
Resistance
Range
10Ω - 97.6K
100Ω - 100K
10Ω - 97.6K
49.9Ω - 360K
Dimensions in mm
Tolerance
1
D = ±0.5%
C=±0.25%, B=±0.1%
D = ±0.5%
C=±0.25%, B=±0.1%
E
NVIRONMENTAL
Moisture Resistance, Thermal Shock
Load Life
Load Life in Moisture
Resistance to Soldering Heat
Solderability
Terminal Strength
Dielectric Withstanding Voltage
Short Time Overload
Insulation Resistance
Specification
±(0.25%+0.05Ω)
±(0.5%+0.05Ω)
±(0.5%+0.05Ω)
±(0.25%+0.05Ω)
min. 95% coverage
±(0.2%+0.05Ω)
±(0.25%+0.05Ω)
±(0.25%+0.05Ω)
1,000 meg minimum
Typical
≤0.1%
≤0.2%
≤0.25%
≤0.05%
≥95%
≤0.05%
≤0.05%
≤0.05%
≥1,000
meg
Test Method
JIS C 5202 7.4
JIS C 5202 7.10
JIS C 5202 7.9
JIS C 5202 6.4, 260±5°C, 10 sec.
JIS C 5202 6.5
EIAJ RC-2609A 6.6
Test Voltage: 10@ 150VAC, RN12 @ 300VAC
EIAJ RC-2609A 6.5
JIS C 5202 7.4
EIAJ RC-2609A 6.36
M
ATERIALS
Feature
Substrate
Resistive Film
Coating
Terminations
Material
Alumina Porcelain
Nickel-Chromium Film
Boro-Silicated Acid Lead Glass
100% matte Tin (Electrical Plated) over
Nickel (Electrical Plated) over
AG-PD (Silver-Palladium [Glaze Printed])
Remarks (Reference Only)
Purity 96% min.
20 Microns Thick
20 Microns Thick
3/8 Microns Thick
3/5 Microns Thick
8 Microns Thick
Dimensions in mm
Glass Coat
Resistive Film
Substrate
Terminations
Feature
L - Body Length
W - Body Width
H - Body Height
a - Top Termination
b - Bottom Termination
RN04
1.00±0.05
0.50±0.05
0.35±0.05
0.20±0.10
0.20±0.10
RN06
1.60±0.20
0.80±0.20
0.40+-0.10
0.30±0.20
0.30+-0.20
Ordering Information
Example:
RN
Thin Film
10
B
0805 1/10 watt .1% 1k
1001
CT
Packaging (Tape & Reel)
Notes:
1. Embossed taping available on RN12 only.
Wattage
B = .1%
C = .25%
D = .50%
Resistance
Tolerance
*Note
49
FPGA/CPLD
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