Model 4859B50-50C
Rev. A
Xinger Balun
50Ω to 100Ω Balanced
Description
The 4859B50-50C is a low profile sub-miniature balanced to unbalanced
transformer designed for differential inputs and output locations on next generation
wireless chipsets in an easy to use surface mount package covering 802.11a Uni-
Band II and Uni-Band III and the Japanese ISM band (4.9GHz). The 4859B50-50C
is ideal for high volume manufacturing and is higher performance than traditional
ceramic baluns. The 4859B50-50C has an unbalanced port impedance of 50Ω and
a 100Ω balanced port impedance*. This transformation enables single ended
signals to be applied to differential ports on modern integrated chipsets. The output
ports have equal amplitude (-3dB) with 180 degree phase differential. The 4859B50-
50C is available on tape and reel for pick and place high volume manufacturing.
ELECTRICAL SPECIFICATIONS**
•
•
•
•
•
•
•
Features:
5.15 – 5.35 GHz Narrow Band
4.8 – 5.9 GHz Extended Band
180° Transformer
50 Ohm to 2 x 50 Ohm
Low Insertion Loss
Covers 802.11a Uni-Band II & III
No DC Decoupling Capacitors
Required
Input to Output DC Isolation
Surface Mountable
Tape & Reel
Convenient Package
Frequency
GHz
Unbalanced
Port
Impedance
Ohms
Balanced
Port
Impedance*
Ohms
Return
Loss
dB min
Insertion
Loss
dB max
5.15 – 5.35
4.8 – 5.9
Amplitude
Balance
dB
50
Phase
Balance
Degrees max
100
Power
Handling
Watts
17
16
ΘJC
ºC / Watt
0.5***
0.6***
Operating
Temp.
ºC
•
•
•
•
0 ± 0.5
0 ± 0.6
180 ± 5.0
180 ± 5.0
4
75
-55 to +85
**Specification based on performance of unit properly installed on microstrip printed circuit boards
with 50
Ω
nominal impedance. Specifications subject to change without notice.
* 50
Ω
reference to ground *** Insertion Loss stated at room temperature (0.55 dB Max at +85 ºC)
Outline Drawing
Top View (Near-side)
.120
±.005
[3.05
±0.13
]
2
Side View
Bottom View (Far-side)
3
1
.030
±.003
[0.75
±0.08
]
4X .010
±.004
[0.25
±0.10
]
.120
±.005
[3.05
±0.13
]
.095
±.004
[2.41
±0.10
]
6X .010
±.004
[0.24
±0.10
]
4
5
6
Dimensions are in Inches [Millimeters]
Mechanical Outline
Pin
1
2
3
4
5
6
Designation
Out 1
GND
Out 2
GND
In
GND
6X .030
±.004
[0.76
±0.10
]
Tolerances are Non-Cumulative
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model 4859B50-50C
Rev. A
Typical Performance: 4.5 GHz. to 6.0 GHz.
Pin Configuration:
Balun Pin Configruation
The internal configuration of the Xinger balun is diagramed to
the left; the unbalanced port is DC connected to ground and the
two balanced ports are DC connected and floating. For many
chipset applications there is an opportunity to eliminate two
decoupling capacitors and/or use a single bias point if
applicable. Differential drive is popular in integrated circuit since
it aids stability in the presence of bond wire and pin inductance,
provides some degree of immunity to power supply and ground
noise, and can provide higher output power in the case of some
device limits. The construction of the Xinger balun is bonded
multi-layered stripline made of low loss dielectric material with
plated through vias connecting the internal circuitry to the
external printed circuit board, similar to that of the Xinger
hybrids and directional couplers
.
Pin 1
λ
4
Pin 5
50
ς
Unbalanced Port
λ
4
Balanced Port
Terminals
Pin 3
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model 4859B50-50C
Rev. A
Typical Performance: 5.15 GHz. to 5.35 GHz.
Mounting Configuration:
6X .030
[0.76]
4X .010
[0.25]
6X .022
[0.57]
.095
[2.41]
In order for Xinger surface mount components to work
optimally, there must be a 50Ω transmission line to the
balanced port and 50Ω transmission lines from the
unbalanced ports. If this condition is not satisfied, amplitude
balance, insertion loss and VSWR may not meet published
specifications.
All of the Xinger components are constructed from ceramic
filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal coefficient
o
of expansion (CTE) of 17 ppm/ C
An example of the PCB footprint used in the testing of these
parts is shown to the left.
in specific designs, the
transmission line widths need to be adjusted to the unique
dielectric coefficients and thicknesses as well as varying
pick and place equipment tolerances.
3X .009
[0.22]
Plated thru
holes to
ground
Circuit Pattern
Footprint Pad (s)
Solder Resist
Dimensions are in Inches [Millimeters]
Mounting Footprint
3X 50
ς
Transmission
Line
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model 4859B50-50C
Rev. A
Packaging and Ordering Information
Parts are available in reel and are packaged per EIA 481-2. Parts are oriented in tape and reel as shown below. Minimum order
quantities are 4000 per reel. See Model Numbers below for further ordering information
.
.079 [2.01]
.010
[0.25]
.157
[4.00]
.157
[4.00]
Ø.059
[Ø1.50]
.069
[1.75]
.138
[3.50]
.130
[3.30]
.315
[8.00]
.031
[0.80]
Ø.039
[Ø0.99]
Dimensions are in inches [mm]
.063
[1.61]
Direction of
Part Feed
(Unloading)
ØA
ØC
ØD
QUANTITY/REEL
4000
TABLE 1
REEL DIMENSIONS (inches [mm])
ØA
7.00 [177.8]
B
0.32 [8.0]
ØC
2.0 [50.8]
ØD
0.512 [13.0]
B
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
Model 4859B50-50C
Rev. A
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe
:
(315) 432-8909
(800) 544-2414
+44 2392-232392
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