DA
SH
Micro i
®
Low Profile Chip Inductors
NU
MB
ER
*
-100M
-150M
-220M
-330K
-390K
-470K
-560K
-680K
-820K
-101K
-121K
-151K
-181K
-221K
-271K
-331K
-391K
-471K
-561K
-681K
-821K
-102K
-122K
-152K
-182K
-222K
-272K
-332K
-392K
-472K
-562K
-682K
-822K
-103K
Series
3090R
3090
Physical Parameters
Inches
A
0.050 Max.
B
0.100±0.010
C
0.100±0.010
D
0.050 Min.
E
0.015 Min. (Typ)
F
0.020 Max. (Typ)
Millimeters
1.27 Max.
2.54±.254
2.54±.254
1.27 Min.
0.38 Min. (Typ)
0.51 Max. (Typ)
0.010
0.015
0.022
0.033
0.039
0.047
0.056
0.068
0.082
0.10
0.12
0.15
0.18
0.22
0.27
0.33
0.39
0.47
0.56
0.68
0.82
1.00
1.20
1.50
1.80
2.20
2.70
3.30
3.90
4.70
5.60
6.80
8.20
10.0
IN
DU
CT
AN
CE
(µ
TO
H)
LE
RA
NC
E
Q
MI
NI
MU
M
TE
ST
FR
EQ
UE
SR
NC
F
MI
Y
(M
NI
MU
Hz
DC
)
M
(M
MA RES
Hz
)
XI IST
MU A
NC
CU
M
RR (OH E
MA E
MS
X. NT
(m RA )
A) TI
NG
SERIES 3090 IRON CORE
± 20%
± 20%
± 20%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
± 10%
42
42
40
40
40
38
35
30
25
32
32
32
32
34
34
34
34
34
34
30
28
24
24
24
24
25
25
25
25
24
22
22
22
20
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
50.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
25.0
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
1000
1000
1000
900
900
900
800
700
650
510
410
370
330
300
250
220
200
180
160
140
120
100
95
90
85
80
70
65
60
55
53
50
45
40
0.095
0.115
0.140
0.185
0.100
0.110
0.135
0.16
0.19
0.08
0.10
0.12
0.14
0.16
0.20
0.25
0.30
0.36
0.45
0.50
0.60
0.70
1.10
1.20
1.25
1.30
1.50
1.90
2.30
3.00
3.50
4.00
4.50
5.00
890
810
765
640
870
830
750
690
630
970
870
795
765
690
615
550
500
460
410
390
355
330
265
250
245
240
225
200
180
160
145
135
130
120
RF INDUCTORS
Current Rating at 90°C Ambient
35°C Rise
Operating Temperature Range
–55°C to +125°C
Maximum Power Dissipation at 90°C
0.105 W
Core Material
Powdered iron core for improved
temperature stability.
Mechanical Configuration
Units are epoxy
encapsulated. Contact area for reflow soldering are
gold plated per MIL-G-45204 Type 1 Grade A.
Internal connections are thermal compression
bonded.
Termination Finish Options
Standard: Gold over Nickel.
For Tin/Lead over Nickel: Add suffix “S” to part
number and allow an additional .010 inch for
maximum height. For RoHS, order 3090R - XXXKS.
Packaging
Tape & reel (8mm): 7" reel, 2000 pieces
max.; 13" reel, 8000 pieces max.
MIL-PRF-83446 (Reference)
for testing methods
only.
Made in the U.S.A.
Optional Tolerances:
J = 5% H = 3% G = 2% F = 1%
*Complete part # must include series # PLUS the dash #
For further surface finish information,
refer to TECHNICAL section of this catalog.
Notes 1)
Designed specifically for reflow soldering and other
high temperature processes with metalized edges to exhibit
solder fillet.
2)
Self Resonant Frequency (SRF) values 250 MHz
and above are calculated and for reference only.
www
.
delevan
.
com
E-mail: apisales@delevan.com
7/2004
PAGE
270 Quaker Rd., East Aurora NY 14052 • Phone 716-652-3600 • Fax 716-652-4814
7
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
