DC-DC Regulated Power Supply Module, 1 Output, 10W, Hybrid, ROHS COMPLIANT, BGA-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | MODULE |
| 包装说明 | BGA, BGA20,4X5,100 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | SELF SELECTABLE OUTPUT VOLTAGE |
| 模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE |
| 最大输入电压 | 6 V |
| 最小输入电压 | 2.5 V |
| JESD-30 代码 | R-PBGA-B20 |
| JESD-609代码 | e1 |
| 长度 | 14.7 mm |
| 功能数量 | 1 |
| 输出次数 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 3 A |
| 最大输出电压 | 4.5 V |
| 最小输出电压 | 0.8 V |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装等效代码 | BGA20,4X5,100 |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.2 mm |
| 表面贴装 | YES |
| 技术 | HYBRID |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 2.54 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 最大总功率输出 | 10 W |
| 微调/可调输出 | YES |
| 宽度 | 12.2 mm |
| Base Number Matches | 1 |
| FX5545G008ADJT1E2 | FX5545G008ADJT1 | FX5545G008ADJB5E2 | FX5545G008ADJB5 | FX5545G008ADJT2E2 | FX5545G008ADJB1E2 | FX5545G008ADJB1 | FX5545G008ADJT2 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | DC-DC Regulated Power Supply Module, 1 Output, 10W, Hybrid, ROHS COMPLIANT, BGA-20 | DC-DC Regulated Power Supply Module, 1 Output, 10W, Hybrid, BGA-20 | DC-DC Regulated Power Supply Module, 1 Output, 10W, Hybrid, ROHS COMPLIANT, BGA-20 | DC-DC Regulated Power Supply Module, 1 Output, 10W, Hybrid, BGA-20 | DC-DC Regulated Power Supply Module, 1 Output, 10W, Hybrid, ROHS COMPLIANT, BGA-20 | DC-DC Regulated Power Supply Module, 1 Output, 10W, Hybrid, ROHS COMPLIANT, BGA-20 | DC-DC Regulated Power Supply Module, 1 Output, 10W, Hybrid, BGA-20 | DC-DC Regulated Power Supply Module, 1 Output, 10W, Hybrid, BGA-20 |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 符合 | 符合 | 不符合 | 不符合 |
| 零件包装代码 | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE |
| 包装说明 | BGA, BGA20,4X5,100 | BGA, BGA20,4X5,100 | BGA, BGA20,4X5,100 | BGA, BGA20,4X5,100 | BGA, BGA20,4X5,100 | BGA, BGA20,4X5,100 | BGA, BGA20,4X5,100 | BGA, BGA20,4X5,100 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | SELF SELECTABLE OUTPUT VOLTAGE | SELF SELECTABLE OUTPUT VOLTAGE | SELF SELECTABLE OUTPUT VOLTAGE | SELF SELECTABLE OUTPUT VOLTAGE | SELF SELECTABLE OUTPUT VOLTAGE | SELF SELECTABLE OUTPUT VOLTAGE | SELF SELECTABLE OUTPUT VOLTAGE | SELF SELECTABLE OUTPUT VOLTAGE |
| 模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE |
| 最大输入电压 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 最小输入电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| JESD-30 代码 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 | R-PBGA-B20 |
| JESD-609代码 | e1 | e0 | e1 | e0 | e1 | e1 | e0 | e0 |
| 长度 | 14.7 mm | 14.7 mm | 14.7 mm | 14.7 mm | 14.7 mm | 14.7 mm | 14.7 mm | 14.7 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 最大输出电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 最小输出电压 | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V | 0.8 V |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
| 封装等效代码 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 | BGA20,4X5,100 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm | 3.2 mm |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | TIN LEAD | Tin/Silver/Copper (Sn/Ag/Cu) | TIN LEAD | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) | TIN LEAD | TIN LEAD |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 最大总功率输出 | 10 W | 10 W | 10 W | 10 W | 10 W | 10 W | 10 W | 10 W |
| 微调/可调输出 | YES | YES | YES | YES | YES | YES | YES | YES |
| 宽度 | 12.2 mm | 12.2 mm | 12.2 mm | 12.2 mm | 12.2 mm | 12.2 mm | 12.2 mm | 12.2 mm |
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