EE PLD, 12ns, 32-Cell, CMOS, PQFP44, TQFP-44
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Lattice(莱迪斯) |
| 零件包装代码 | QFP |
| 包装说明 | TQFP-44 |
| 针数 | 44 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | YES |
| 最大时钟频率 | 83.3 MHz |
| 系统内可编程 | YES |
| JESD-30 代码 | S-PQFP-G44 |
| JESD-609代码 | e0 |
| JTAG BST | NO |
| 长度 | 10 mm |
| 湿度敏感等级 | 3 |
| 专用输入次数 | |
| I/O 线路数量 | 32 |
| 宏单元数 | 32 |
| 端子数量 | 44 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 0 DEDICATED INPUTS, 32 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP44,.47SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | 240 |
| 电源 | 3.3 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 12 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 10 mm |
| Base Number Matches | 1 |
| ISPLSI2032V-100LT44 | ISPLSI2032V-80LJ44 | ISPLSI2032V-60LT44I | ISPLSI2032V-60LJ44I | ISPLSI2032V-60LT44 | ISPLSI2032V-100LJ44 | ISPLSI2032V-60LJ44 | ISPLSI2032V-80LT44 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 12ns, 32-Cell, CMOS, PQFP44, TQFP-44 | EE PLD, 15ns, 32-Cell, CMOS, PQCC44, PLASTIC, LCC-44 | EE PLD, 20ns, 32-Cell, CMOS, PQFP44, TQFP-44 | EE PLD, 20ns, 32-Cell, CMOS, PQCC44, PLASTIC, LCC-44 | EE PLD, 20ns, 32-Cell, CMOS, PQFP44, TQFP-44 | EE PLD, 12ns, 32-Cell, CMOS, PQCC44, PLASTIC, LCC-44 | EE PLD, 20ns, 32-Cell, CMOS, PQCC44, PLASTIC, LCC-44 | EE PLD, 15ns, 32-Cell, CMOS, PQFP44, TQFP-44 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) | Lattice(莱迪斯) |
| 零件包装代码 | QFP | LCC | QFP | LCC | QFP | LCC | LCC | QFP |
| 包装说明 | TQFP-44 | PLASTIC, LCC-44 | TQFP-44 | PLASTIC, LCC-44 | TQFP-44 | PLASTIC, LCC-44 | PLASTIC, LCC-44 | TQFP-44 |
| 针数 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
| Reach Compliance Code | compliant | unknown | unknown | unknown | unknown | compliant | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 83.3 MHz | 64.5 MHz | 51.3 MHz | 51.3 MHz | 51.3 MHz | 83.3 MHz | 51.3 MHz | 64.5 MHz |
| 系统内可编程 | YES | YES | YES | YES | YES | YES | YES | YES |
| JESD-30 代码 | S-PQFP-G44 | S-PQCC-J44 | S-PQFP-G44 | S-PQCC-J44 | S-PQFP-G44 | S-PQCC-J44 | S-PQCC-J44 | S-PQFP-G44 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| JTAG BST | NO | NO | NO | NO | NO | NO | NO | NO |
| 长度 | 10 mm | 16.5862 mm | 10 mm | 16.5862 mm | 10 mm | 16.5862 mm | 16.5862 mm | 10 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| I/O 线路数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 宏单元数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O | 0 DEDICATED INPUTS, 32 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QFP | QCCJ | QFP | QCCJ | QFP | QCCJ | QCCJ | QFP |
| 封装等效代码 | QFP44,.47SQ,32 | LDCC44,.7SQ | QFP44,.47SQ,32 | LDCC44,.7SQ | QFP44,.47SQ,32 | LDCC44,.7SQ | LDCC44,.7SQ | QFP44,.47SQ,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK |
| 峰值回流温度（摄氏度） | 240 | 225 | 240 | 240 | 240 | 225 | 225 | 240 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 12 ns | 15 ns | 20 ns | 20 ns | 20 ns | 12 ns | 20 ns | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | J BEND | GULL WING | J BEND | GULL WING | J BEND | J BEND | GULL WING |
| 端子节距 | 0.8 mm | 1.27 mm | 0.8 mm | 1.27 mm | 0.8 mm | 1.27 mm | 1.27 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 10 mm | 16.5862 mm | 10 mm | 16.5862 mm | 10 mm | 16.5862 mm | 16.5862 mm | 10 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
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