ADC, Flash Method, 9-Bit, 1 Func, 1 Channel, Parallel, Word Access, CDIP64
| 参数名称 | 属性值 |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最大模拟输入电压 | |
| 最小模拟输入电压 | -2 V |
| 转换器类型 | ADC, FLASH METHOD |
| JESD-30 代码 | R-CDIP-T64 |
| JESD-609代码 | e4 |
| 最大线性误差 (EL) | 0.2% |
| 标称负供电电压 | -5.2 V |
| 模拟输入通道数量 | 1 |
| 位数 | 9 |
| 功能数量 | 1 |
| 端子数量 | 64 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出位码 | BINARY, COMPLEMENTARY BINARY, OFFSET 2\'S COMPLEMENT, COMPLEMENTARY OFFSET 2\'S COMPLEMENT |
| 输出格式 | PARALLEL, WORD |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 采样速率 | 30 MHz |
| 最大压摆率 | 1090 mA |
| 表面贴装 | NO |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 5962-8853201YC | 5962-8853201ZA | 5962-8853201XC | TDC1049J3V | |
|---|---|---|---|---|
| 描述 | ADC, Flash Method, 9-Bit, 1 Func, 1 Channel, Parallel, Word Access, CDIP64 | ADC, Flash Method, 9-Bit, 1 Func, 1 Channel, Parallel, Word Access, CQCC68 | ADC, Flash Method, 9-Bit, 1 Func, 1 Channel, Parallel, Word Access, CDIP64 | A/D Converter, 9-Bit, 1 Func, ECL, CDIP64, |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| 转换器类型 | ADC, FLASH METHOD | ADC, FLASH METHOD | ADC, FLASH METHOD | A/D CONVERTER |
| JESD-30 代码 | R-CDIP-T64 | S-CQCC-N68 | R-CDIP-T64 | R-XDIP-T64 |
| JESD-609代码 | e4 | e0 | e4 | e0 |
| 最大线性误差 (EL) | 0.2% | 0.2% | 0.2% | 0.2% |
| 标称负供电电压 | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
| 位数 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 64 | 68 | 64 | 64 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出位码 | BINARY, COMPLEMENTARY BINARY, OFFSET 2\'S COMPLEMENT, COMPLEMENTARY OFFSET 2\'S COMPLEMENT | BINARY, COMPLEMENTARY BINARY, OFFSET 2\'S COMPLEMENT, COMPLEMENTARY OFFSET 2\'S COMPLEMENT | BINARY, COMPLEMENTARY BINARY, OFFSET 2\'S COMPLEMENT, COMPLEMENTARY OFFSET 2\'S COMPLEMENT | BINARY |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | NO | NO |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | GOLD | TIN LEAD | GOLD | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | QUAD | DUAL | DUAL |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - |
| 最小模拟输入电压 | -2 V | -2 V | -2 V | - |
| 模拟输入通道数量 | 1 | 1 | 1 | - |
| 输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | - |
| 采样速率 | 30 MHz | 30 MHz | 30 MHz | - |
| 最大压摆率 | 1090 mA | 1090 mA | 1090 mA | - |
| Base Number Matches | 1 | 1 | 1 | - |
| 厂商名称 | - | TRW Inc | TRW Inc | TRW Inc |
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