电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

MB85101JBN

产品描述HIGH FREQUENCY CERAMIC CAPACITORS
文件大小164KB,共6页
制造商Murata(村田)
官网地址https://www.murata.com
下载文档 全文预览

MB85101JBN概述

HIGH FREQUENCY CERAMIC CAPACITORS

文档预览

下载PDF文档
APPLICATION SPECIFIC CAPACITORS
HIGH FREQUENCY CERAMIC CAPACITORS
MA/MB Series
OUTSTANDING CHARACTERISTICS
I
Miniature size
I
Very high Q at high frequencies
I
High RF power capabilities
I
Impervious to environmental conditions
I
Low dissipation factors
I
Excellent retrace capability (not applicable for X7R styles)
I
High temperature stability
I
Low noise
I
Meets Mil-55681 with respect to: Shock, Vibration,
Moisture Resistance, Solderability, Barometric Pressure,
Temperature Cycling, Immersion and Salt Spray
ADDITIONAL FEATURES
I
Packaging options
I
Lot processing data available
MA SERIES
For filtering, coupling and impedance matching in most
RF circuits, the MA Series chips and leaded devices offer
outstanding performance and reliability with the greatest
range of values and configurations. MA Series capacitors
can be supplied with military equivalent screening. Please
consult our factory.
MA Series ceramic fixed capacitors are miniature, high
performance precision components having extremely high Q
and high power capabilities from low frequencies to gigahertz
ranges. These “low loss” multilayer capacitors are extremely
stable with respect to variations in temperature, voltage and
frequency.
MA Series capacitors are designed for miniature
state-of-the-art circuit applications. They are small,
easy to apply and have excellent reliability. Units are
available in ultra-miniature case size 1 (1.4 x 1.4 x 1.4mm)
or miniature case size 2 (2.8 x 2.8 x 2.5mm). Standard
case size 1 units are available as chips. Standard case
size 2 units are available as chips and also in leaded
configurations.
Clean-room manufacturing technology assures product
reliability and automated processing reduces costs and
cycle time. Key stages of the operation are monitored
and controlled with the latest SPC techniques. Flexibility in
design allows the production of non-standard values, while
maintaining consistent quality objectives.
Please contact the factory for availability of special
configurations or high-reliability screening.
PART NUMBERING SYSTEM – CASE SIZE 1 & CASE SIZE 2
M
A
1
8
101
J
A
N
CUBIC
MONOLITHIC
A-STD SERIES
B-ULTRA
HIGH Q
DIMENSIONAL
AND T.C. CODE
1: P90 Case 1
5: COG Case 1
7: X7R Case 1
2: P90 Case 2
6: COG Case 2
8: X7R Case 2
TERMINATION
CODE:
0: Chip
1: Pellet
2: Microstrip
3: Radial Ribbon
4: Radial Wire
5: Axial Ribbon
6: Narrow Axial Ribbon
7: Axial Wire
8: Nickel Interfaced Pellet
9: Nickel Interfaced Chip
CAPACITANCE
TOLERANCES:
CODE:
Expressed
*B: ±0.1pF
in picofarads and
*C: ±0.25pF
identified by a three-digit *D: ±0.5pF
number. First two digits
F : ±1%
represent significant
G: ±2%
figures. Last digit
J : ±5%
specifies the number
K: ±10%
of zeros to follow. For
M: ±20%
values below 10pF,
Z: +80%, –20%
the letter “R” is used
as the decimal point
and the last digit
becomes significant.
A: NO
7” Reel
MARKING
Plastic
B: MARKING
Tape
Cap. Code
& Tol.
Logo if space
permits
Non XR7
styles only
*Available
below 10pf
only
SPECIAL LEAD CONFIGURATION FOR FLEX BOARDS
NOTE:
Targeted for flex circuit boards, the MA22-6 version of the MA22 has an upraised lead configuration. The lead bends
when flexing the board after assembly so that minimal stress is placed on the component.
Type
Style
P90 ± 20 P90 ± 30
COG
X7R
Configuration
W
L
T
Dimensions: mm
L ± 0.38* W ± 0.38* T ± .038
Band
Y
Termination
Silver Ribbon:
W
NE
Raised
Micro-Strip
MA22-6 MB22-6
MA62-6 MA82-6
Y
3.4
2.8
2.8
0.38 ± .25
Length: 6.35 typical
Width: 2.3 ± .13
Thickness: 0.1 ± .05
118
CG01-J
大伙有没有干起LPC812 MAX???
好几个月前入手的,现在才想起来玩玩~ https://mbed.org/media/thumbs/d8/64/d8646dca985fba2be7707817c8aa246d.png 例程都是mbed.org的....= =虽然说mbed的开发好神奇...但还是不习惯...还是 ......
zgbkdlm NXP MCU
堆栈的缓冲区溢出?
堆栈的缓冲区溢出?堆栈的缓冲区什么意思啊,这怎么解决...
l0700830216 微控制器 MCU
三个问题,讨论LunchPad1.5与之前版本的区别
这几天空闲,把搁置了好久的LunchPad拿出来玩。 发现1.5版本的芯片是G2553,而wiki或者MSP430ware提供的LunchPad User's Experience的demo是基于G2231的。在玩得过程中,发现些许问题, ......
newofcortexm3 微控制器 MCU
Three phase current measurements on the TMS320F240
Three phase current measurementsusing a single line resistoron the TMS320F240 TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR ......
安_然 DSP 与 ARM 处理器
测控步进电机控制的资料分享
这是我积累的一些基于simulink的步进电机仿真的资料,对测控方向童鞋会有写帮助,拿出来给大家分享。 ...
MichaelYonng 电子竞赛
晒晒我们的B题
本帖最后由 paulhyde 于 2014-9-15 03:50 编辑 我们自制的80C51f120开发板...... 都是直插件....270个孔....赛前老子打孔就打了一天....做完了小有成就感....用的时候才发现不稳定.....看来以 ......
gaosu0906 电子竞赛

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1417  31  2163  1524  349  50  58  17  48  16 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved