Agilent HLMB-K305-F00xx /
HLMB-K505-F00xx
3mm Auto Insertable LED Lamps
Technical Data Sheet
Features
• 3mm Auto Insertable Package
• Tinted and Non-diffused Lens
• Lead-Free Leadframe
Package Dimension
Description
The product is capable of
withstanding automatic
insertion and wave soldering
processes.
Designed with a thick epoxy
flange and soft leadframe
material, it is ideal for clinch
and cut operations. The
product is suitable for lead-
free application.
Notes:
1. All dimensions are in millimeters (inches).
2. Epoxy Meniscus may extend about 1mm (0.040”) down the leads.
Absolute Maximum Rating (T
A
=25°C)
Parameter
Peak Forward Current
DC Current
Reverse Voltage (I
R
=100µA)
Operating Temperature
Storage Temperature
Wave Solder Temperature
[1.6mm (0.060 in.) from body]
HLMB-K305 (Yellow)
60
20
5
−20
to +85
−30
to +85
260°C for 5 seconds
HLMB-K505 (Green)
90
30
Units
mA
mA
V
°C
°C
Optical and Electrical Characteristics at T
A
=25°C
Symbol
Iv
λ
PEAK
λ
d
∆λ
½
2θ ½
θ
J-PIN
τ
s
C
V
F
I
R
Note:
1. The dominant wavelength is derived from the CIE chromaticity diagram and represents the single wavelength, which defines the color of the devices.
Description
Luminous Intensity
Peak Wavelength
Dominant Wavelength
Part Number
HLMB-K305
HLMB-K505
HLMB-K305
HLMB-K505
HLMB-K305
HLMB-K505
Minimum Typical
9.2
10.6
35
46
583
565
585
571
36
28
40
290
90
500
15
18
2.0
2.1
Maximum Units
mcd
nm
nm
nm
degree
°C/W
ns
pF
2.6
2.7
100
V
µA
Conditions
I
F
=10mA
Measurement at Peak
Spectral Line Halfwidth HLMB-K305
HLMB-K505
Viewing Angle
Thermal Resistance
Speed of Respond
Capacitance
Forward Voltage
Reverse Current
All
All
HLMB-K305
HLMB-K505
HLMB-K305
HLMB-K505
HLMB-K305
HLMB-K505
All
I
F
=10mA
Vf=0, f=1MHz
I
F
=10mA
V
R
= 5V
2
Figure 1. Forward Current vs. Forward Voltage
Figure 2. Relative Luminous Intensity vs. DC Forward Current
Figure 3. Ambient Temperature vs. Maximum DC Forward Current
Figure 4. Radiation Pattern
Figure 5. Wavelength vs. Relative Intensity
3
Taping Specifications
Figure 6. Taping Specifications
Recommended Assembly Condition
A single- sided phenolic printed
circuit board (PCB) is preferred.
Double- sided PCB and other
materials may cause greater
lead stress. Recommended
through- hole diameter is 0.93 to
1.03mm. Lead length below the
PCB should be 1.5 to 2.0mm,
and the clinching angle (angle
between the lead and PCB)
should be 30
±
10 degrees.
If SMT devices and an adhesive
are used on the same PCB as
these lamps, the adhesive
should be cured before the
lamps are auto- inserted. If
curing must be done after lamp
insertion, the cure temperature
and time should not exceed
140°C, 100 seconds. This is the
temperature of the surface
normal to the IR source.
Solder Condition:
Preheat: Temperature ramp rate
of 2 to 4°C per second. Do not
exceed 150°C delta temperature
between preheat and solder
temperatures. The maximum
time at preheat should not
exceed 30 seconds.
Solder: 245°C
±
5°C, 3 seconds
(1.6mm below seating plane).
Dimension
H
F
W
W0
W1
W2
P
P0
P1
φD0
∆h1
∆h
T
Option CA (mm)
18.0
±1.0
2.5 +0.8/-0.2
18.0 +1.0/-0.5
15.0
±0.3
9.0 +0.75/-0.5
0~2.0
12.7
±1.3
12.7
±1.3
3.81
±0.5
4.0
±0.2
0.00
±1.0
0.00
±1.0
1.2
±0.2
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
Data subject to change.
Copyright 2003 Agilent Technologies, Inc.
18 December, 2003
5989-0242EN
嵌入式系统
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