Load Share Controller 16-CDIP 0 to 70
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | CERAMIC, DIP-16 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 1 week |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-GDIP-T16 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电流 (Isup) | 10 mA |
| 最大供电电压 (Vsup) | 35 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| UC3907J | 5962-9320601MEA | 5962-9320601M2A | UC1907L883B | UC1907L | |
|---|---|---|---|---|---|
| 描述 | Load Share Controller 16-CDIP 0 to 70 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, CDIP16, DIP-16 | 1-CHANNEL POWER SUPPLY SUPPORT CKT, CQCC20, LCC-20 | Load Share Controller 20-LCCC -55 to 125 | Load Share Controller 20-LCCC -55 to 125 |
| 零件包装代码 | DIP | DIP | QLCC | QLCC | QLCC |
| 包装说明 | CERAMIC, DIP-16 | DIP, | QCCN, | QCCN, | QCCN, LCC20,.35SQ |
| 针数 | 16 | 16 | 20 | 20 | 20 |
| Reach Compliance Code | not_compliant | unknown | unknown | unknown | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DIP | QCCN | QCCN | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.03 mm | 2.03 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 35 V | 35 V | 35 V | 35 V | 35 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | YES | YES | YES |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | QUAD |
| 宽度 | 7.62 mm | 7.62 mm | 8.89 mm | 8.89 mm | 8.89 mm |
| Brand Name | Texas Instruments | - | - | Texas Instruments | Texas Instruments |
| 是否无铅 | 含铅 | - | - | 含铅 | 含铅 |
| 厂商名称 | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
| 长度 | - | 19.56 mm | 8.89 mm | 8.89 mm | 8.89 mm |
| 筛选级别 | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 Class B | - |
stm32/stm8
GD32 MCU
嵌入式系统
无线连接
无线连接
Linux开发
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
