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AM27LV020B-300PC: 产品描述OTP ROM, 256KX8, 300ns, CMOS, PDIP32, PLASTIC, DIP-32; 产品类别存储存储; 文件大小412KB，共18页; 制造商AMD(超微); 官网地址http://www.amd.com

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AM27LV020B-300PC概述

OTP ROM, 256KX8, 300ns, CMOS, PDIP32, PLASTIC, DIP-32

AM27LV020B-300PC规格参数

参数名称	属性值
厂商名称	AMD(超微)
零件包装代码	DIP
包装说明	DIP,
针数	32
Reach Compliance Code	unknown
ECCN代码	EAR99
最长访问时间	300 ns
JESD-30 代码	R-PDIP-T32
长度	42.164 mm
内存密度	2097152 bit
内存集成电路类型	OTP ROM
内存宽度	8
功能数量	1
端子数量	32
字数	262144 words
字数代码	256000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	256KX8
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
并行/串行	PARALLEL
认证状态	Not Qualified
座面最大高度	5.715 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	2.7 V
标称供电电压 (Vsup)	3.3 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
宽度	15.24 mm
Base Number Matches	1

AM27LV020B-300PC相似产品对比

	AM27LV020B-300PC	AM27LV020-150PI	AM27LV020-250PI	AM27LV020B-200PI	AM27LV020-200PI	AM27LV020B-250PC	AM27LV020B-200PC	AM27LV020-150PC	AM27LV020-300PI	AM27LV020B-300PI
描述	OTP ROM, 256KX8, 300ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 250ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 250ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 200ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 300ns, CMOS, PDIP32, PLASTIC, DIP-32	OTP ROM, 256KX8, 300ns, CMOS, PDIP32, PLASTIC, DIP-32
零件包装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
包装说明	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,	DIP,
针数	32	32	32	32	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow	unknow	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	300 ns	150 ns	250 ns	200 ns	200 ns	250 ns	200 ns	150 ns	300 ns	300 ns
JESD-30 代码	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32
长度	42.164 mm	42.164 mm	42.164 mm	42.164 mm	42.164 mm	42.164 mm	42.164 mm	42.164 mm	42.164 mm	42.164 mm
内存密度	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bi	2097152 bi	2097152 bi
内存集成电路类型	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM	OTP ROM
内存宽度	8	8	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	32	32	32	32	32	32	32	32	32	32
字数	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
字数代码	256000	256000	256000	256000	256000	256000	256000	256000	256000	256000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	85 °C	85 °C	85 °C	85 °C	70 °C	70 °C	70 °C	85 °C	85 °C
最低工作温度	-	-40 °C	-40 °C	-40 °C	-40 °C	-	-	-	-40 °C	-40 °C
组织	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8	256KX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.715 mm	5.715 mm	5.715 mm	5.715 mm	5.715 mm	5.715 mm	5.715 mm	5.715 mm	5.715 mm	5.715 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	2.7 V	3 V	3 V	2.7 V	3 V	2.7 V	2.7 V	3 V	3 V	2.7 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
端子形式	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子节距	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
宽度	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm	15.24 mm
厂商名称	AMD(超微)	AMD(超微)	-	-	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)	AMD(超微)

AM27LV020B-300PC

AM27LV020B-300PC概述

AM27LV020B-300PC规格参数

AM27LV020B-300PC相似产品对比

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