AC SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20
| 参数名称 | 属性值 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL20,.3 |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.1.A |
| 控制类型 | ENABLE LOW |
| 系列 | AC |
| JESD-30 代码 | R-CDFP-F20 |
| JESD-609代码 | e4 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I(ol) | 0.012 A |
| 位数 | 4 |
| 功能数量 | 2 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装等效代码 | FL20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 10 ns |
| 传播延迟(tpd) | 9 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535V;38534K;883S |
| 座面最大高度 | 2.92 mm |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 总剂量 | 300k Rad(Si) V |
| 宽度 | 6.92 mm |
| Base Number Matches | 1 |

| 5962F9854101VXC | 5962F9854101VRC | ACS244KMSR-02 | ACS244HMSR-02 | ACS244DMSR-02 | |
|---|---|---|---|---|---|
| 描述 | AC SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 | AC SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP20 | AC SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDFP20, CERAMIC, DFP-20 | AC SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, UUC22 | AC SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP20 |
| 零件包装代码 | DFP | DIP | DFP | DIE | DIP |
| 包装说明 | DFP, FL20,.3 | DIP-20 | DFP, FL20,.3 | DIE, | DIP, DIP20,.3 |
| 针数 | 20 | 20 | 20 | 22 | 20 |
| Reach Compliance Code | unknown | unknown | compliant | compliant | compliant |
| 系列 | AC | AC | AC | AC | AC |
| JESD-30 代码 | R-CDFP-F20 | R-CDIP-T20 | R-CDFP-F20 | S-XUUC-N22 | R-CDIP-T20 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 22 | 20 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP | DIP | DFP | DIE | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | UNCASED CHIP | IN-LINE |
| 传播延迟(tpd) | 9 ns | 9 ns | 9 ns | 9 ns | 9 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | DUAL | UPPER | DUAL |
| 控制类型 | ENABLE LOW | ENABLE LOW | ENABLE LOW | - | ENABLE LOW |
| JESD-609代码 | e4 | e4 | e3 | - | - |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | - | 50 pF |
| 最大I(ol) | 0.012 A | 0.012 A | 0.012 A | - | 0.012 A |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | - | -55 °C |
| 封装等效代码 | FL20,.3 | DIP20,.3 | FL20,.3 | - | DIP20,.3 |
| 电源 | 5 V | 5 V | 5 V | - | 5 V |
| Prop。Delay @ Nom-Sup | 10 ns | 10 ns | 10 ns | - | 10 ns |
| 筛选级别 | 38535V;38534K;883S | 38535V;38534K;883S | 38535V;38534K;883S | - | 38535V;38534K;883S |
| 座面最大高度 | 2.92 mm | 5.08 mm | 2.92 mm | - | 5.08 mm |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | - | 5 V |
| 温度等级 | MILITARY | MILITARY | MILITARY | - | MILITARY |
| 端子面层 | GOLD | GOLD | Matte Tin (Sn) | - | - |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | - | 2.54 mm |
| 总剂量 | 300k Rad(Si) V | 300k Rad(Si) V | 300k Rad(Si) V | - | 300k Rad(Si) V |
| 宽度 | 6.92 mm | 7.62 mm | 6.92 mm | - | 7.62 mm |
| 厂商名称 | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 是否Rohs认证 | - | - | 符合 | 不符合 | 不符合 |
| 峰值回流温度(摄氏度) | - | - | NOT APPLICABLE | NOT SPECIFIED | NOT SPECIFIED |
| 处于峰值回流温度下的最长时间 | - | - | NOT APPLICABLE | NOT SPECIFIED | NOT SPECIFIED |
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