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IS61LSSD102418-333B

产品描述Standard SRAM, 1MX18, 1.6ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, BGA-165
产品类别存储    存储   
文件大小136KB,共31页
制造商Integrated Silicon Solution ( ISSI )
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IS61LSSD102418-333B概述

Standard SRAM, 1MX18, 1.6ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, BGA-165

IS61LSSD102418-333B规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码BGA
包装说明13 X 15 MM, 1 MM PITCH, BGA-165
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
最长访问时间1.6 ns
其他特性PIPELINED ARCHITECTURE
JESD-30 代码R-PBGA-B165
JESD-609代码e0
内存密度18874368 bit
内存集成电路类型STANDARD SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量165
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织1MX18
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装形状RECTANGULAR
封装形式GRID ARRAY
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
最大供电电压 (Vsup)1.9 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

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IS61LSSD102418
ISSI
®
Σ
QUAD
18Mb
Σ
2x2B4
FEATURES
• JEDEC standard pinout and package
• Dual Double Data Rate interface
• Echo Clock outputs track data output drivers
• Byte Write controls sampled at data in time
• Burst of 4 Read and Write
ADVANCE INFORMATION
JUNE 2002
DDR SEPARATE I/O SRAM
• Simulatneous Read and Write SigmaQuad™ In-
terface
• Single 1.8 V +150/–100 mV core power supply
• Dedicated output supply voltage (V
DD
q): 1.5 V
or 1.8 V HSTL Interface
• Pipelined read operation
• Fully coherent read and write pipelines
• ZQ mode pin for programmable output drive
strength
• JTAG boundary scan (subset of IEEE standard
1149.1)
• 165 pin (11x15), 1mm pitch, 13mm x 15mm Ball
Grid Array (BGA) package
• Pin compatible with future 36M, 72M and 144M
devices
Bottom View
165-Bump, 13 mm x 15mm BGA
1 mm Bump Pitch, 11 x 15 Bump Array
SIGMARAM FAMILY OVERVIEW
These Separate I/O SigmaQuads are built in compli-
ance with the SigmaRAM pinout standard for Separate
I/O synchronous SRAMs. The first implementations are
18,874,368-bit (18Mb) SRAMs. These are the first in a
family of wide, very low voltage HSTL I/O SRAMs
designed to operate at the speeds needed to implement
economical high performance networking systems.
Separate I/O SigmaRAMs are offered in a number of
configurations. Some emulate and enhance other
synchronous separate I/O SRAMs. A higher perfor-
mance SDR (Single Data Rate) Burst of 2 version is
also offered. The logical defference between
theprotocols employed by these RAMs hinge mainly on
various combinations of address bursting, output data
registering, and write cueing. Like the Common I/O
family of SigmaRAMs, Separate I/O SigmaQuads allow
a user to implement the interface protocol best suited
to the task at hand.
Speed
tKHKH
tKHQV
-333
3.0
1.6
-300
3.3
1.8
-250
4
2.1
-200
5
2.3
ns
ns
Copyright © 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI
assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device
specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
ADVANCE INFORMATION
06/12/02
Rev. 00A
1

IS61LSSD102418-333B相似产品对比

IS61LSSD102418-333B IS61LSSD102418-250B IS61LSSD102418-300B
描述 Standard SRAM, 1MX18, 1.6ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, BGA-165 Standard SRAM, 1MX18, 2.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, BGA-165 Standard SRAM, 1MX18, 1.8ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, BGA-165
是否无铅 含铅 含铅 含铅
是否Rohs认证 不符合 不符合 不符合
零件包装代码 BGA BGA BGA
包装说明 13 X 15 MM, 1 MM PITCH, BGA-165 13 X 15 MM, 1 MM PITCH, BGA-165 13 X 15 MM, 1 MM PITCH, BGA-165
针数 165 165 165
Reach Compliance Code compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 1.6 ns 2.1 ns 1.8 ns
其他特性 PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
JESD-30 代码 R-PBGA-B165 R-PBGA-B165 R-PBGA-B165
JESD-609代码 e0 e0 e0
内存密度 18874368 bit 18874368 bit 18874368 bit
内存集成电路类型 STANDARD SRAM STANDARD SRAM STANDARD SRAM
内存宽度 18 18 18
湿度敏感等级 3 3 3
功能数量 1 1 1
端子数量 165 165 165
字数 1048576 words 1048576 words 1048576 words
字数代码 1000000 1000000 1000000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C
组织 1MX18 1MX18 1MX18
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY
并行/串行 PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
认证状态 Not Qualified Not Qualified Not Qualified
最大供电电压 (Vsup) 1.9 V 1.9 V 1.9 V
最小供电电压 (Vsup) 1.7 V 1.7 V 1.7 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL BALL
端子位置 BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
厂商名称 - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )

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