电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

HLMT-QH00-NP022

产品描述Single Color LED, Reddish Orange, Untinted Nondiffused, T-3/4, 1.78mm, PLASTIC PACKAGE-2
产品类别光电子/LED    光电   
文件大小71KB,共9页
制造商Broadcom(博通)
下载文档 详细参数 全文预览

HLMT-QH00-NP022概述

Single Color LED, Reddish Orange, Untinted Nondiffused, T-3/4, 1.78mm, PLASTIC PACKAGE-2

HLMT-QH00-NP022规格参数

参数名称属性值
厂商名称Broadcom(博通)
包装说明PLASTIC PACKAGE-2
Reach Compliance Codecompliant
颜色REDDISH ORANGE
配置SINGLE
最大正向电流0.05 A
透镜类型UNTINTED NONDIFFUSED
标称发光强度52.5 mcd
安装特点SURFACE MOUNT
功能数量1
端子数量2
最高工作温度100 °C
最低工作温度-40 °C
光电设备类型SINGLE COLOR LED
总高度2.92 mm
包装方法BULK
峰值波长615 nm
形状ROUND
尺寸1.78 mm
表面贴装YES
T代码T-3/4
视角15 deg
Base Number Matches1

文档预览

下载PDF文档
HLMA-Qx00, HLMA-Px00 HLMT-Px00 and HLMT-Qx00
Subminiature High Performance AlInGaP LED Lamps
Data Sheet
SunPower Series
HLMA-PF00, HLMA-PG00, HLMA-PH00, HLMA-PL00, HLMA-QF00, HLMA-QG00, HLMA-QH00,
HLMA-QL00, HLMT-PG00, HLMT-PH00, HLMT-PL00, HLMT-QG00, HLMT-QH00, HLMT-QL00
Description
Flat Top Package
The HLMX-PXXX flat top lamps use an untinted, nondif-
fused, truncated lens to provide a wide radiation pattern
that is necessary for use in backlighting applications. The
flat top lamps are also ideal for use as emitters in light
pipe applications.
Features
Subminiature flat top package
Ideal for backlighting and light piping applications
Subminiature dome package
Nondiffused dome for high brightness
Wide range of drive currents
Colors: 590 nm Amber, 605 nm Orange, 615 nm Red-
dish-Orange, 622/626 nm Red, and 635 nm Red
Ideal for space limited applications
Axial leads
Available with lead configurations for surface mount
and through hole PC board mounting
Dome Packages
The HLMX-QXXX dome lamps use an untinted, nondif-
fused lens to provide a high luminous intensity within a
narrow radiation pattern.
Lead Configurations
All of these devices are made by encapsulating LED chips
on axial lead frames to form molded epoxy submini-
ature lamp packages. A variety of package configuration
options is available. These include special surface mount
lead configurations, gull wing, yoke lead, or Z-bend. Right
angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm
(0.200 inch) center spacing are available for through hole
mounting. For more information refer to Standard SMT
and Through Hole Lead Bend Options for Subminiature
LED Lamps data sheet.
Technology
These subminiature solid state lamps utilize one of the
two newly developed aluminum indium gallium phos-
phide (AlInGaP) LED technologies. The HLMT-Devices
are especially effective in very bright ambient lighting
conditions. The colors 590 nm amber, 605 nm orange,
615 nm reddish-orange, 622/626 nm red, and 635 nm red
are available with viewing angles of 15° for the domed
devices and 125° for the flat top devices.
关于连接的一个问题,谁做过,进来看看?(WinCE)
很简单的情况,我使用PB4.2编了一个OS,然后在VMWare6.0上做了一个Dos系统,然后做了bootdisk启动盘!然后想通过PB直接把NK.BIN下载到VMWare上.我本机IP是192.168.0.197,vmnet1设成了192.168.0.116, ......
wenf 嵌入式系统
在PCB上怎样设计“数字地和模拟地”?
方法一:按电路功能分割接地面分割是指利用物理上的分割来减少不同类型线之间的耦合,尤其是通过电源线和地线的耦合。按电路功能分割地线例如图5.7.18所示,利用分割技术将4个不同类型电路的接 ......
欣之 电子竞赛
怎样嵌套三段式状态机
我在书上看到推荐使用三段式状态机。另外状态机的嵌套也是经常用到的。请问怎样实现三段式状态机的嵌套?...
349568117 FPGA/CPLD
定时器问题
PIC 16F887 的三个定时器同时开启,怎么设优先级?编译后老出错,只开一个就没问题,两个就出错,编译不成功...
雨籽 Microchip MCU
PCB制作工艺流程
PCB制作与PCB打样收费标准双面锡板/沉金板制作流程:开料------钻孔-----沉铜----线路---图电----蚀刻-----阻焊---字符----喷锡(或者是沉金)-锣边—v割(有些板不需要)-----飞测----真空包装 双 ......
fsyjpcb PCB设计
基于PIC24FJ64的智能光伏汇流采集装置设计及应用
摘要:介绍一种基于16位单片机PIC24FJ64为主控芯片应用于智能型光伏汇流箱的多回路光伏汇流采集装置AGF-M16的设计原理,以及该产品主要技术指标与应用。 关键字:PIC24FJ64芯片;智能光 ......
acrel008 电源技术

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1720  2550  2899  1808  2112  38  46  20  35  43 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved