(for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
This catalog has only typical specifications. Therefore, you are requested to approve our product specifications or to transact the approval sheet for product specificaions before ordering.
C02E10.pdf 04.1.20
Chip Monolithic
Ceramic Capacitors
Murata
Manufacturing Co., Ltd.
Cat.No.C02E-10
Please read rating and
!CAUTION
(for storage and operating, rating, soldering and mounting, handling) in this catalog to prevent smoking and/or burning, etc.
!Note
•Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this PDFcatalog to prevent smoking and/or burning, etc.
•This catalog has only typical specifications. Therefore, there is no space for detailed specifications. Therefore, or to transact theour product specification orspecificaions approval sheet for product specification before ordering.
This catalog has only typical specifications because you are requested to approve our product specifications please approve approval sheet for product transact the before ordering.
C02E10.pdf 04.1.20
CONTENTS
Part Numbering
Selection Guide
1
2
3
4
for Flow/Reflow Soldering GRM15/18/21/31 Series
for Reflow Soldering GRM32/43/55 Series
Ultra-small GRM03 Series
Thin Type (Flow/Reflow)
2
6
7
15
18
20
22
27
32
37
39
42
48
51
56
61
69
79
81
85
91
97
104
109
113
117
121
122
123
GRM Series Specifications and Test Methods
5
6
Thin Layer Large-capacitance Type
Low-dissipation Type
GRM Series Data
7
8
9
10
11
12
13
Microchips
Capacitor Arrays
for Ultrasonic Sensors
Low ESL
High Frequency for Flow/Reflow Soldering
High-Q & High Power Type
High Frequency Type
ERF/ERH/ERA/ERD Series Data
Package
!
Caution
Notice
Reference Data
14
15
16
17
18
19
20
Medium-voltage Low Dissipation Factor
Medium-voltage High-Capacitance for General-Use
Only for Information Devices/Tip & Ring
AC250V(r.m.s.) Type
Safety Standard Recognized Type GC (UL, IEC60384-14 Class X1/Y2)
Safety Standard Recognized Type GD (IEC60384-14 Class Y3)
Safety Standard Recognized Type GF (IEC60384-14 Class Y2)
Please read rating and
!CAUTION
(for storage and operating, rating, soldering and mounting, handling) in this catalog to prevent smoking and/or burning, etc.
!Note
•Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this PDFcatalog to prevent smoking and/or burning, etc.
•This catalog has only typical specifications. Therefore, there is no space for detailed specifications. Therefore, or to transact theour product specification orspecificaions approval sheet for product specification before ordering.
This catalog has only typical specifications because you are requested to approve our product specifications please approve approval sheet for product transact the before ordering.
C02E10.pdf 04.1.20
1
2
21
Safety Standard Recognized Type GB (IEC60384-14 Class X2)
124
125
129
132
135
141
145
GA3 Series Specifications and Test Methods
GRM/GR4/GA2/GA3 Series Data
Package
!
Caution
Notice
ISO 9000 Certifications
3
4
5
6
7
Please refer to "Specifications and Test Methods" at the end of each chapter of
5
–
17
.
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Recycled Paper
Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
•Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
•This catalog has only typical specifications. Therefore,thereareno space for detailed specifications. Therefore, please approve our productsheet for product specificaions approval sheet for product specifications before ordering.
This catalog has only typical specifications because you is requested to approve our product specifications or to transact the approval specifications or transact the before ordering.
C02E10.pdf 04.1.20
o
Part Numbering
Chip Monolithic Ceramic Capacitors
(Part Number)
qProduct
ID
wSeries
Product ID
GR
Code
M
4
F
H
A
D
GQ
GM
GN
LL
GJ
M
A
M
L
M
6
GA
GC
2
3
P
M
Series
Tin Plated Layer
Only for Information Devices / Tip & Ring
High Frequency and
high Power Type
High Frequency and High Power Type
(Ribbon Terminal)
High Frequency Type
High Frequency Type
(Ribbon Terminal)
High Frequency for
Flow/Reflow Soldering
Monolithic Microchip
Capacitor Array
Low ESL Wide Width Type
High Frequency Low Loss Type
Tin Plated Type
High Frequency Low Loss Type
for AC250V (r.m.s.)
Safety Standard Recognized Type
Automotive Soldering Electrode
Automotive Tin Plated Layer
GR
q
M
w
18
e
8
B1 1H
y
102
u
K
i
A01 K
o
!0
rDimension
(T)
Code
2
3
4
5
6
7
8
9
A
B
C
D
E
F
M
N
R
S
Q
X
Dimension (T)
2-elements (Array Type)
0.3 mm
4-elements (Array Type)
0.5 mm
0.6 mm
0.7 mm
0.8 mm
0.85 mm
1.0 mm
1.25 mm
1.6 mm
2.0 mm
2.5 mm
3.2 mm
1.15 mm
1.35 mm
1.8 mm
2.8 mm
1.5 mm
Depends on individual standards.
r t
ER
With the array type GNM series, "Dimension(T)" indicates the number of
elements.
eDimension
(LgW)
Code
03
05
08
11
15
18
1D
1X
21
22
31
32
3X
42
43
52
55
Dimension (LgW)
0.6g0.3 mm
0.5g0.5 mm
0.8g0.8 mm
1.25g1.0 mm
1.0g0.5 mm
1.6g0.8 mm
1.4g1.4 mm
Depends on individual standards.
2.0g1.25 mm
2.8g2.8 mm
3.2g1.6 mm
3.2g2.5 mm
4.5g2.0 mm
4.5g3.2 mm
5.7g2.8 mm
5.7g5.0 mm
0805
1111
1206
1210
1808
1812
2211
2220
Continued on the following page.
EIA
0201
0202
0303
0504
0402
0603
Depends on individual standards.
2
Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
!Note
•Please read rating and
!CAUTION
(for storage, operating, rating, soldering, mounting and handling) in this PDF catalog to prevent smoking and/or burning, etc.
•This catalog has only typical specifications. Therefore,thereareno space for detailed specifications. Therefore, please approve our productsheet for product specificaions approval sheet for product specifications before ordering.
This catalog has only typical specifications because you is requested to approve our product specifications or to transact the approval specifications or transact the before ordering.
这是一份协作蓝图，旨在通过 Arm 的汽车创新生态系统，应对集成复杂性并打造可扩展解决方案。 未来出行的变革不仅在颠覆汽车行业，更在不断加剧汽车的复杂性。由人工智能 (AI) 驱动的驾驶体验、车云互联能力与云原生开发，正在重塑汽车的设计、制造与体验。 汽车中先进软件与 AI 能力的快速集成和持续部署，为日益复杂的系统带来了诸多挑战：如何确保无缝集成、实时性能、功能安全与网络安全？此外，协...[详细]
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