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BU-63825G3-140Y

产品描述Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDSO70, 1.90 X 1 INCH, 0.215 INCH HEIGHT, CERAMIC, PACKAGE-70
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小824KB,共49页
制造商Data Device Corporation
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BU-63825G3-140Y概述

Mil-Std-1553 Controller, 2 Channel(s), 0.125MBps, CMOS, CDSO70, 1.90 X 1 INCH, 0.215 INCH HEIGHT, CERAMIC, PACKAGE-70

BU-63825G3-140Y规格参数

参数名称属性值
包装说明1.90 X 1 INCH, 0.215 INCH HEIGHT, CERAMIC, PACKAGE-70
Reach Compliance Codecompliant
其他特性LG-MAX; WD-MAX
地址总线宽度16
边界扫描NO
通信协议MIL-STD-1553A; MIL-STD-1553B; MCAIR; STANAG-3838
数据编码/解码方法BIPH-LEVEL(MANCHESTER)
最大数据传输速率0.125 MBps
外部数据总线宽度16
JESD-30 代码R-CDSO-G70
JESD-609代码e0
长度48.26 mm
低功率模式YES
串行 I/O 数2
端子数量70
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码SOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE
筛选级别MIL-PRF-38534
座面最大高度5.461 mm
最大供电电压5.25 V
最小供电电压4.75 V
标称供电电压5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式GULL WING
端子节距1.27 mm
端子位置DUAL
宽度25.4 mm
uPs/uCs/外围集成电路类型SERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
Base Number Matches1

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BU-63825
SPACE LEVEL MIL-STD-1553
BC/RT/MT
ADVANCED COMMUNICATION ENGINE
(SP’ACE II) TERMINAL
FEATURES
Make sure the next
Card you purchase
has...
®
Direct Replacement for BU-61582
and BU-61583
Radiation Tolerant & Radiation
Hardened Versions
Fully Integrated 1553 Terminal
Flexible Processor Interface
16K x 16 Internal RAM
Automatic BC Retries
Programmable BC Gap Times
BC Frame Auto-Repeat
Intelligent RT Data Buffering
Ceramic Package
DESCRIPTION
The BU-63825(925) is a fully hardware & software compatible, direct
drop-in replacement for the BU-61582(83).
DDC’s BU-63825(925) Space Advanced Communication Engine
(Sp’ACE II) is a radiation hardened version of the BU-61580(81) ACE
terminal. DDC supplies the BU-63825 with enhanced screening for
space and other high reliability applications.
The BU-63825 provides a complete integrated BC/RT/MT interface
between a host processor and a MIL-STD-1553 bus. The
BU-63825(925) provides functional and software compatibility with
the standard BU-61580(81) product and is packaged in the same 1.9
square-inch package footprint.
As an option, DDC can supply the BU-63825 with space level screen-
ing. This entails enhancements in the areas of element evaluation
and screening procedures for active and passive elements, as well as
the manufacturing and screening processes used in producing the
terminals.
The BU-63825 integrates dual transceiver, protocol, memory man-
agement and processor interface logic, and 16K words of RAM in the
choice of 70-pin DIP or flat pack packages. Transceiverless versions
may be used with an external electrical or fiber optic transceiver.
To minimize board space and ‘glue’ logic, the Sp’ACE II terminals
provide flexibility in interfacing to a host processor and internal/exter-
nal RAM.
Multiple Ordering Options;
+5V (Only)
+5V/-15V
+5V/-12V
+5V/Transceiverless
+5V (Only, with Transmit Inhibits)
WARNING: ITAR CONTROLLED PRODUCT
The product(s) referenced on this data sheet or product
brief and certain related technical data is subject to the
U.S. Department of State International Traffic in Arms
Regulations (ITAR) 22 CFR 120-130 and may not be
exported without the appropriate prior authorization from
the Directorate of Defense Trade Controls, United States
Department of State. This datasheet includes only basic
marketing information on the function of the product and
therefore is not considered technical data as defined in
22CFR 120.10.
FOR MORE INFORMATION CONTACT:
Data Device Corporation
105 Wilbur Place
Bohemia, New York 11716
631-567-5600 Fax: 631-567-7358
www.ddc-web.com
Technical Support:
1-800-DDC-5757 ext. 7771
All trademarks are the property of their respective owners.
© 2005 Data Device Corporation
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