EEPROM, 8KX8, 90ns, Parallel, CMOS, PDIP28, LEAD FREE AND HALOGEN FREE, PLASTIC, DIP-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP28,.6 |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 90 ns |
| 命令用户界面 | NO |
| 数据轮询 | YES |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDIP-T28 |
| JESD-609代码 | e3 |
| 长度 | 36.695 mm |
| 内存密度 | 65536 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 8192 words |
| 字数代码 | 8000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP28,.6 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 页面大小 | 32 words |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 5 V |
| 编程电压 | 5 V |
| 认证状态 | Not Qualified |
| 就绪/忙碌 | YES |
| 座面最大高度 | 5.08 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.03 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 切换位 | YES |
| 宽度 | 15.24 mm |
| 最长写入周期时间 (tWC) | 5 ms |
| Base Number Matches | 1 |

| CAT28C65BLI-90 | CAT28C65BXI-90 | CAT28C65BWI-90 | CAT28C65BLI-12 | CAT28C65BGI-90 | CAT28C65BH13I-12 | CAT28C65BGI-12 | CAT28C65BXI-12 | CAT28C65BH13I-90 | CAT28C65BWI-12 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 8KX8, 90ns, Parallel, CMOS, PDIP28, LEAD FREE AND HALOGEN FREE, PLASTIC, DIP-28 | EEPROM, 8KX8, 90ns, Parallel, CMOS, PDSO28, LEAD FREE AND HALOGEN FREE, SOIC-28 | EEPROM, 8KX8, 90ns, Parallel, CMOS, PDSO28, LEAD FREE AND HALOGEN FREE, SOIC-28 | EEPROM, 8KX8, 120ns, Parallel, CMOS, PDIP28, LEAD FREE AND HALOGEN FREE, PLASTIC, DIP-28 | EEPROM, 8KX8, 90ns, Parallel, CMOS, PQCC32, LEAD FREE AND HALOGEN FREE, PLASTIC, LCC-32 | EEPROM, 8KX8, 120ns, Parallel, CMOS, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | EEPROM, 8KX8, 120ns, Parallel, CMOS, PQCC32, LEAD FREE AND HALOGEN FREE, PLASTIC, LCC-32 | EEPROM, 8KX8, 120ns, Parallel, CMOS, PDSO28, LEAD FREE AND HALOGEN FREE, SOIC-28 | EEPROM, 8KX8, 90ns, Parallel, CMOS, PDSO28, 8 X 13.40 MM, LEAD FREE AND HALOGEN FREE, TSOP-28 | EEPROM, 8KX8, 120ns, Parallel, CMOS, PDSO28, LEAD FREE AND HALOGEN FREE, SOIC-28 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | DIP | SOIC | SOIC | DIP | QFJ | TSOP | QFJ | SOIC | TSOP | SOIC |
| 包装说明 | DIP, DIP28,.6 | LEAD FREE AND HALOGEN FREE, SOIC-28 | SOP, SOP28,.4 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | TSOP1, TSSOP28,.53,22 | LEAD FREE AND HALOGEN FREE, PLASTIC, LCC-32 | SOP, SOP28,.45 | TSOP1, TSSOP28,.53,22 | SOP, SOP28,.4 |
| 针数 | 28 | 28 | 28 | 28 | 32 | 28 | 32 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 90 ns | 90 ns | 90 ns | 120 ns | 90 ns | 120 ns | 120 ns | 120 ns | 90 ns | 120 ns |
| 命令用户界面 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDIP-T28 | R-PDSO-G28 | R-PDSO-G28 | R-PDIP-T28 | R-PQCC-J32 | R-PDSO-G28 | R-PQCC-J32 | R-PDSO-G28 | R-PDSO-G28 | R-PDSO-G28 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 36.695 mm | 17.9 mm | 17.9 mm | 36.695 mm | 13.965 mm | 11.8 mm | 13.965 mm | 17.9 mm | 11.8 mm | 17.9 mm |
| 内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 32 | 28 | 32 | 28 | 28 | 28 |
| 字数 | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words | 8192 words |
| 字数代码 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 | 8KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | DIP | QCCJ | TSOP1 | QCCJ | SOP | TSOP1 | SOP |
| 封装等效代码 | DIP28,.6 | SOP28,.45 | SOP28,.4 | DIP28,.6 | LDCC32,.5X.6 | TSSOP28,.53,22 | LDCC32,.5X.6 | SOP28,.45 | TSSOP28,.53,22 | SOP28,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 页面大小 | 32 words | 32 words | 32 words | 32 words | 32 words | 32 words | 32 words | 32 words | 32 words | 32 words |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 就绪/忙碌 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 座面最大高度 | 5.08 mm | 2.65 mm | 2.65 mm | 5.08 mm | 3.55 mm | 1.2 mm | 3.55 mm | 2.65 mm | 1.2 mm | 2.65 mm |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | MATTE TIN | MATTE TIN | Matte Tin (Sn) | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN | MATTE TIN |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | J BEND | GULL WING | J BEND | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 | 40 |
| 切换位 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 宽度 | 15.24 mm | 7.5 mm | 7.5 mm | 15.24 mm | 11.425 mm | 8 mm | 11.425 mm | 7.5 mm | 8 mm | 7.5 mm |
| 最长写入周期时间 (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 湿度敏感等级 | - | 1 | 1 | - | 3 | 2 | 3 | 1 | 2 | 1 |
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