H
90 V/1.0
Ω
, Hermetically Sealed,
Power MOSFET Optocoupler
Technical Data
HSSR-711X*
5962-9314001
*See matrix for available extensions
Features
• Dual Marked with Device
Part Number and DESC
Standard Military Drawing
• ac/dc Signal & Power
Switching
• Compact Solid-State
Bidirectional Switch
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534
• MIL-PRF-38534 Class H
• Space Level Processing
Available
• Hermetically Sealed 8-Pin
Dual In-Line Package
• Small Size and Weight
• Performance Guaranteed
over -55
°
C to +125
°
C
• Connection A
0.8 A, 1.0
Ω
• Connection B
1.6 A, 0.25
Ω
• 1500 Vdc Withstand Test
Voltage
• High Transient Immunity
• 5 Amp Output Surge Current
Applications
• Military and Space
• High Reliability Systems
• Standard 28 Vdc and 48 Vdc
Load Driver
• Standard 24 Vac Load Driver
• Aircraft Controls
• ac/dc Electromechanical and
Solid State Relay
Replacement
• I/O Modules
• Harsh Industrial
Environments
eight-pin, hermetic, dual-in-line,
ceramic packages. The devices
operate exactly like a solid-state
relay. The products are capable of
operation and storage over the
full military temperature range
and can be purchased as a
standard product (HSSR-7110),
with full MIL-PRF-38534 Class H
testing (HSSR-7111), or from the
DESC Standard Military Drawing
(SMD) 5962-93140.
These devices may be purchased
with a variety of lead bend and
plating options. See Selection
Guide Table for details. Standard
Military Drawing (SMD) parts are
available for each lead style.
Description
The HSSR-7110, HSSR-7111 and
SMD 5962-9314001 are single
channel power MOSFET
optocouplers, constructed in
Functional Diagrams
CONNECTION A
AC/DC CONNECTION
I
O
1 NC
I
F
+ 2
V
F
_ 3
4 NC
8
+
I
F
+
1 NC
2
8
CONNECTION B
DC CONNECTION
I
O
+
V
O
_
TRUTH TABLE
INPUT
H
L
OUTPUT
CLOSED
OPEN
•
•
7
V
O
6
_
5
V
F
•
•
7
6
5
_ 3
4 NC
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component
to prevent damage and/or degradation which may be induced by ESD.
5965-1142E
1-593
HERMETIC/HI-REL
OPTOCOUPLERS
All devices are manufactured and
tested on a MIL-PRF-38534 certi-
fied line and are included in the
DESC Qualified Manufacturers
List, QML-38534 for Hybrid
Microcircuits. Each device
contains an AlGaAs light emitting
diode optically coupled to a
photovoltaic diode stack which
drives two discrete power
MOSFETs. The device operates
as a solid-state replacement for
single-pole, normally open,
(1 Form A) relays used for
general purpose switching of
signals and loads in high
reliability applications.
The devices feature logic level
input control and very low output
on-resistance, making them
suitable for both ac and dc loads.
Connection A, as shown in the
Functional Diagram, allows the
device to switch either ac or dc
loads. Connection B, with the
polarity and pin configuration as
shown, allows the device to
switch dc loads only. The
advantage of Connection B is that
the on-resistance is significantly
reduced, and the output current
capability increases by a factor of
two.
The devices are convenient
replacements for mechanical and
solid state relays where high
component reliability with
standard footprint lead configu-
ration is desirable. Devices may
be purchased with a variety of
lead bend and plating options.
See Selection Guide table for
details. Standard Military
Drawing (SMD) parts are
available for each package and
lead style.
The HSSR-7110, HSSR-7111, and
SMD 5962-93140 are designed to
switch loads on 28 Vdc power
systems. They meet 80 V surge
and
±
600 V spike requirements.
Selection Guide–Package Styles and Lead
Configuration Options
HP Part # and Options
Commercial
MIL-PRF-38534 Class H
Standard Lead Finish
Solder Dipped
Butt Joint/Gold Plate
Gull Wing/Soldered
Crew Cut/Gold Plate
SMD Part #
Prescript for all below
Either Gold or Soldered
Gold Plate
Solder Dipped
Butt Joint/Gold Plate
Butt Joint/Soldered
Gull Wing/Soldered
Crew Cut/Gold Plate
Crew Cut/Soldered
HSSR-7110
HSSR-7111
Gold
Option #200
Option #100
Option #300
Option #600
5962-
9314001HPX
9314001HPC
9314001HPA
9314001HYC
9314001HYA
9314001HXA
9314001HZC
9314001HZA
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
Outline Drawing
8-pin DIP Through Hole
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
1-594
Device Marking
HP LOGO
HP P/N
DESC SMD*
DESC SMD*
PIN ONE/
ESD IDENT
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
50434
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
HP FSCN*
Absolute Maximum Ratings
Storage Temperature Range ........................................ -65°C to +150°C
Operating Ambient Temperature – T
A
.......................... -55°C to +125°C
Junction Temperature – T
J
......................................................... +150°C
Operating Case Temperature – T
C
......................................... +145°C
[1]
Lead Solder Temperature ............................................... 260°C for 10 s
(1.6 mm below seating plane)
Average Input Current – I
F
........................................................... 20 mA
Peak Repetitive Input Current – I
FPK
............................................ 40 mA
(Pulse Width < 100 ms; duty cycle < 50%)
Peak Surge Input Current – I
FPK
surge ....................................... 100 mA
(Pulse Width < 0.2 ms; duty cycle < 0.1%)
Reverse Input Voltage – V
R
............................................................... 5 V
Average Output Current – Figure 2
Connection A – I
O
....................................................................... 0.8 A
Connection B – I
O
...................................................................... 1.6 A
Single Shot Output Current – Figure 3
Connection A – I
OPK
surge (Pulse width < 10 ms) ...................... 5.0 A
Connection B – I
OPK
surge (Pulse width < 10 ms) ................... 10.0 A
Output Voltage
Connection A – V
O
...................................................... -90 V to +90 V
Connection B – V
O
.......................................................... 0 V to +90 V
Average Output Power Dissipation – Figure 4 ....................... 800 mW
[2]
Thermal Resistance
Maximum Output MOSFET Junction to Case –
θ
JC
= 15°C/W
ESD Classification
(MIL-STD-883, Method 3015) .......................................... (∆∆), Class 2
Recommended Operating Conditions
Parameter
Input Current (on)
Input Voltage (off)
Operating Temperature
Symbol
I
F(ON)
V
F(OFF)
T
A
Min.
5
0
-55
Max.
20
0.6
+125
Units
mA
V
°C
1-595
HERMETIC/HI-REL
OPTOCOUPLERS
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option
is available on commercial and hi-rel product.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE DIMENSIONS IN MILLIMETERS (INCHES)
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and
hi-rel product. DESC Drawing part numbers contain provisions for lead finish.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This
option is available on commercial and hi-rel product. This option has solder dipped leads.
300
5.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
5.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
600
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option
is available on commercial and hi-rel product.
3.81 (0.150)
MAX.
0.20 (0.008)
0.33 (0.013)
1.02 (0.040)
TYP.
7.36 (0.290)
7.87 (0.310)
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
Note:
Dimensions in millimeters (inches).
1-596
Electrical Specifications
T
A
=-55°C to +125°C, unless otherwise specified. See note 9.
Group
A, Sub-
group
1, 2, 3
1, 2, 3
Parameter
Output Withstand
Voltage
Output
Connection
On-
A
Resistance
Connection
B
Output Leakage
Current
Input Forward
Voltage
Input Reverse
Breakdown Voltage
Input-Output
Insulation
Turn On Time
Sym.
|V
O(OFF)
|
R
(ON)
Test Conditions
V
F
= 0.6 V, I
O
= 10
µA
I
F
= 10 mA, I
O
= 800 mA,
(pulse duration
≤
30 ms)
I
F
= 10 mA, I
O
= 1.6 A,
(pulse duration
≤
30 ms)
Min. Typ.* Max. Units
90
110
0.40
1.0
V
Ω
Fig.
5
6,7
Notes
3
0.12
10
-4
1.0
5.0
1.24
0.25
10
1.7
µA
V
V
1.0
µA
4, 5
8
9
I
O(OFF)
V
F
V
R
I
I-O
1, 2, 3
1, 2, 3
1, 2, 3
1
V
F
= 0.6 V, V
O
= 90 V,
I
F
= 10 mA
I
R
= 100
µA
RH
≤
45%, t = 5 s,
V
I-O
= 1500 Vdc,
T
A
= 25°C
t
ON
9, 10, 11 I
F
= 10 mA, V
DD
= 28 V,
I
O
= 800 mA
9,10,11 I
F
= 10 mA,
V
DD
= 28 V, I
O
= 800 mA
9
V
PEAK
= 50 V,
C
M
= 1000 pF,
C
L
= 15 pF, R
M
≥
1 MΩ
V
DD
= 5 V,
V
I–O(PEAK)
= 50 V,
R
L
= 20 kΩ, C
L
= 15 pF
1000
1.25
6.0
ms
1,10,
11,12,
13
1,10,
14,15
17
Turn Off Time
Output Transient
Rejection
Input-Output
Transient Rejection
t
OFF
dVo
dt
dVio
dt
0.02
0.25
ms
V/µs
9
500
V/µs
18
*All typical values are at T
A
= 25°C, I
F(ON)
= 10 mA, V
F(OFF)
= 0.6 V unless otherwise specified.
1-597
HERMETIC/HI-REL
OPTOCOUPLERS
PCB设计
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