Dual Bus Driver/Receiver with 4-to-1 Output Multiplexers
参数名称 | 属性值 |
厂商名称 | Motorola ( NXP ) |
零件包装代码 | QLCC |
包装说明 | QCCJ, LDCC20,.4SQ |
针数 | 20 |
Reach Compliance Code | unknow |
其他特性 | 25 OHM LINE DRIVE CAPABILITY; 4:1 OUTPUT MULTIPLEXERS |
系列 | 10H |
JESD-30 代码 | S-PQCC-J20 |
JESD-609代码 | e0 |
长度 | 8.9662 mm |
逻辑集成电路类型 | BUS TRANSCEIVER |
位数 | 1 |
功能数量 | 2 |
输入次数 | 4 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 75 °C |
最低工作温度 | |
输出特性 | OPEN-EMITTER WITH CUT-OFF |
输出极性 | TRUE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC20,.4SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | -5.2 V |
最大电源电流(ICC) | 115 mA |
Prop。Delay @ Nom-Su | 4.5 ns |
传播延迟(tpd) | 3.2 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
表面贴装 | YES |
技术 | ECL |
温度等级 | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 8.9662 mm |
MC10H332FN | MC10H332P | MC10H332L | |
---|---|---|---|
描述 | Dual Bus Driver/Receiver with 4-to-1 Output Multiplexers | Dual Bus Driver/Receiver with 4-to-1 Output Multiplexers | Dual Bus Driver/Receiver with 4-to-1 Output Multiplexers |
厂商名称 | Motorola ( NXP ) | Motorola ( NXP ) | Motorola ( NXP ) |
零件包装代码 | QLCC | DIP | DIP |
包装说明 | QCCJ, LDCC20,.4SQ | DIP, DIP20,.3 | DIP, DIP20,.3 |
针数 | 20 | 20 | 20 |
Reach Compliance Code | unknow | unknow | unknow |
其他特性 | 25 OHM LINE DRIVE CAPABILITY; 4:1 OUTPUT MULTIPLEXERS | 25 OHM LINE DRIVE CAPABILITY; 4:1 OUTPUT MULTIPLEXERS | 25 OHM LINE DRIVE CAPABILITY; 4:1 OUTPUT MULTIPLEXERS |
系列 | 10H | 10H | 10H |
JESD-30 代码 | S-PQCC-J20 | R-PDIP-T20 | R-CDIP-T20 |
JESD-609代码 | e0 | e0 | e0 |
长度 | 8.9662 mm | 26.415 mm | 24.515 mm |
逻辑集成电路类型 | BUS TRANSCEIVER | BUS TRANSCEIVER | BUS TRANSCEIVER |
位数 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 |
输入次数 | 4 | 4 | 4 |
端口数量 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 |
最高工作温度 | 75 °C | 75 °C | 75 °C |
输出特性 | OPEN-EMITTER WITH CUT-OFF | OPEN-EMITTER WITH CUT-OFF | OPEN-EMITTER WITH CUT-OFF |
输出极性 | TRUE | TRUE | TRUE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCJ | DIP | DIP |
封装等效代码 | LDCC20,.4SQ | DIP20,.3 | DIP20,.3 |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER | IN-LINE | IN-LINE |
电源 | -5.2 V | -5.2 V | -5.2 V |
最大电源电流(ICC) | 115 mA | 115 mA | 115 mA |
Prop。Delay @ Nom-Su | 4.5 ns | 4.5 ns | 4.5 ns |
传播延迟(tpd) | 3.2 ns | 3.2 ns | 3.2 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 4.57 mm | 5.08 mm |
表面贴装 | YES | NO | NO |
技术 | ECL | ECL | ECL |
温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | J BEND | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | QUAD | DUAL | DUAL |
宽度 | 8.9662 mm | 7.62 mm | 7.62 mm |
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