IC,COUNTER,UP,DECADE,AC-CMOS,DIP,16PIN,CERAMIC
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| 计数方向 | UP |
| JESD-30 代码 | R-XDIP-T16 |
| 负载电容（CL） | 50 pF |
| 负载/预设输入 | YES |
| 逻辑集成电路类型 | DECADE COUNTER |
| 最大I（ol） | 0.024 A |
| 工作模式 | SYNCHRONOUS |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 3.3/5 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 54AC160DM | 54AC160FM | 54AC162LM | 54AC162FM | 54AC162DM | 54AC160LM | |
|---|---|---|---|---|---|---|
| 描述 | IC,COUNTER,UP,DECADE,AC-CMOS,DIP,16PIN,CERAMIC | IC,COUNTER,UP,DECADE,AC-CMOS,FP,16PIN,CERAMIC | IC,COUNTER,UP,DECADE,AC-CMOS,LLCC,20PIN,CERAMIC | IC,COUNTER,UP,DECADE,AC-CMOS,FP,16PIN,CERAMIC | IC,COUNTER,UP,DECADE,AC-CMOS,DIP,16PIN,CERAMIC | IC,COUNTER,UP,DECADE,AC-CMOS,LLCC,20PIN,CERAMIC |
| 包装说明 | DIP, DIP16,.3 | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DFP, FL16,.3 | DIP, DIP16,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 计数方向 | UP | UP | UP | UP | UP | UP |
| JESD-30 代码 | R-XDIP-T16 | R-XDFP-F16 | S-XQCC-N20 | R-XDFP-F16 | R-XDIP-T16 | S-XQCC-N20 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 负载/预设输入 | YES | YES | YES | YES | YES | YES |
| 逻辑集成电路类型 | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER |
| 最大I（ol） | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 20 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DFP | QCCN | DFP | DIP | QCCN |
| 封装等效代码 | DIP16,.3 | FL16,.3 | LCC20,.35SQ | FL16,.3 | DIP16,.3 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | FLATPACK | CHIP CARRIER | FLATPACK | IN-LINE | CHIP CARRIER |
| 电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | NO LEAD | FLAT | THROUGH-HOLE | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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