电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索
 PDF数据手册

5962-8865501SA

产品描述Bus Driver, FCT Series, 1-Func, 8-Bit, Inverted Output, CMOS, CDFP20, CERPACK-20
产品类别逻辑    逻辑   
文件大小189KB,共8页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

5962-8865501SA概述

Bus Driver, FCT Series, 1-Func, 8-Bit, Inverted Output, CMOS, CDFP20, CERPACK-20

5962-8865501SA规格参数

参数名称属性值
零件包装代码DFP
包装说明DFP,
针数20
Reach Compliance Codeunknown
其他特性IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V
系列FCT
JESD-30 代码R-GDFP-F20
JESD-609代码e0
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
位数8
功能数量1
端口数量2
端子数量20
最高工作温度125 °C
最低工作温度-55 °C
输出特性3-STATE
输出极性INVERTED
封装主体材料CERAMIC, GLASS-SEALED
封装代码DFP
封装形状RECTANGULAR
封装形式FLATPACK
传播延迟(tpd)11 ns
认证状态Not Qualified
座面最大高度2.3368 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式FLAT
端子节距1.27 mm
端子位置DUAL
宽度6.9215 mm
Base Number Matches1

5962-8865501SA相似产品对比

5962-8865501SA 5962-8951302SA 5962-8951301SA 5962-8865501RA 5962-8762801SA 5962-8762802SA 5962-8865502RA 5962-88655012A 5962-8865502SA 5962-88655022A
描述 Bus Driver, FCT Series, 1-Func, 8-Bit, Inverted Output, CMOS, CDFP20, CERPACK-20 CPACK-20, Tube CPACK-20, Tube CDIP-20, Tube CPACK-20, Tube CPACK-20, Tube CDIP-20, Tube Bus Driver, FCT Series, 1-Func, 8-Bit, Inverted Output, CMOS, CQCC20, LCC-20 CPACK-20, Tube Bus Driver, FCT Series, 1-Func, 8-Bit, Inverted Output, CMOS, CQCC20, LCC-20
零件包装代码 DFP CPACK CPACK CDIP CPACK CPACK CDIP QLCC CPACK QLCC
包装说明 DFP, DFP, FL20,.3 DFP, FL20,.3 DIP, DFP, FL20,.3 DFP, FL20,.3 DIP, QCCN, CERPACK-20 QCCN,
针数 20 20 20 20 20 20 20 20 20 20
Reach Compliance Code unknown _compli not_compliant not_compliant not_compliant not_compliant not_compliant unknown not_compliant unknown
其他特性 IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V BROADSIDE VERSION OF 374; IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V BROADSIDE VERSION OF 374; IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V IOH = 0.3MA @ VOH = 4.3V; IOL = 0.3MA @ VOL = 0.2V
系列 FCT FCT FCT FCT FCT FCT FCT FCT FCT FCT
JESD-30 代码 R-GDFP-F20 R-GDFP-F20 R-GDFP-F20 R-GDIP-T20 R-GDFP-F20 R-GDFP-F20 R-GDIP-T20 S-CQCC-N20 R-GDFP-F20 S-CQCC-N20
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
位数 8 8 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1 1 1
端口数量 2 2 2 2 2 2 2 2 2 2
端子数量 20 20 20 20 20 20 20 20 20 20
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 INVERTED TRUE TRUE INVERTED TRUE TRUE INVERTED INVERTED INVERTED INVERTED
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
封装代码 DFP DFP DFP DIP DFP DFP DIP QCCN DFP QCCN
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE RECTANGULAR SQUARE
封装形式 FLATPACK FLATPACK FLATPACK IN-LINE FLATPACK FLATPACK IN-LINE CHIP CARRIER FLATPACK CHIP CARRIER
传播延迟(tpd) 11 ns 7.2 ns 11 ns 11 ns 11 ns 7.2 ns 7.2 ns 11 ns 7.2 ns 7.2 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 2.3368 mm 2.3368 mm 2.3368 mm 5.08 mm 2.3368 mm 2.3368 mm 5.08 mm 2.54 mm 2.3368 mm 2.54 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES YES YES NO YES YES NO YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
端子面层 TIN LEAD TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD TIN LEAD TIN LEAD TIN LEAD
端子形式 FLAT FLAT FLAT THROUGH-HOLE FLAT FLAT THROUGH-HOLE NO LEAD FLAT NO LEAD
端子节距 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL QUAD DUAL QUAD
宽度 6.9215 mm 6.9215 mm 6.9215 mm 7.62 mm 6.9215 mm 6.9215 mm 7.62 mm 8.89 mm 6.9215 mm 8.89 mm
Base Number Matches 1 1 1 1 1 1 1 1 1 1
Brand Name - Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology - Integrated Device Technology -
是否无铅 - 含铅 含铅 含铅 含铅 含铅 含铅 - 含铅 -
是否Rohs认证 - 不符合 不符合 不符合 不符合 不符合 不符合 - 不符合 -
制造商包装代码 - CP20 CP20 CD20 CP20 CP20 CD20 - CP20 -
湿度敏感等级 - 1 1 1 1 1 1 - 1 -
峰值回流温度(摄氏度) - 260 260 240 260 260 240 - NOT SPECIFIED -
处于峰值回流温度下的最长时间 - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED -

推荐资源

热门活动更多

热门文章更多

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 国产芯 大学堂 TI培训 Datasheet 电子工程 索引文件: 650  796  956  1014  1599 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved