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AM29SL800DB-150WAC: 产品描述512KX16 FLASH 1.8V PROM, 150ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, FBGA-48; 产品类别存储存储; 文件大小1MB，共49页; 制造商SPANSION; 官网地址http://www.spansion.com/

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AM29SL800DB-150WAC概述

512KX16 FLASH 1.8V PROM, 150ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, FBGA-48

AM29SL800DB-150WAC规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	SPANSION
零件包装代码	BGA
包装说明	TFBGA,
针数	48
Reach Compliance Code	compliant
最长访问时间	150 ns
备用内存宽度	8
JESD-30 代码	R-PBGA-B48
JESD-609代码	e0
长度	8.15 mm
内存密度	8388608 bit
内存集成电路类型	FLASH
内存宽度	16
湿度敏感等级	3
功能数量	1
端子数量	48
字数	524288 words
字数代码	512000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	512KX16
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	240
编程电压	1.8 V
认证状态	Not Qualified
座面最大高度	1.2 mm
最大供电电压 (Vsup)	2.2 V
最小供电电压 (Vsup)	1.65 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	TIN LEAD
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	6.15 mm
Base Number Matches	1

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Am29SL800D

Data Sheet

July 2003

The following document specifies Spansion memory products that are now offered by both Advanced

Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-

inally developed the specification, these products will be offered to customers of both AMD and

Fujitsu.

Continuity of Specifications

There is no change to this datasheet as a result of offering the device as a Spansion product. Any

changes that have been made are the result of normal datasheet improvement and are noted in the

document revision summary, where supported. Future routine revisions will occur when appropriate,

and changes will be noted in a revision summary.

Continuity of Ordering Part Numbers

AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order

these products, please use only the Ordering Part Numbers listed in this document.

For More Information

Please contact your local AMD or Fujitsu sales office for additional information about Spansion

memory solutions.

Publication Number

27546

Revision

Amendment

Issue Date

April 27, 2005

D a t a

S h e e t

Table of Contents

Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 3

Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5

Special Handling Instructions for FBGA Packages .................. 6

Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8

Standard Products .................................................................... 8

Device Bus Operations . . . . . . . . . . . . . . . . . . . . 10

Table 1. Am29SL800D Device Bus Operations ..............................10

Table 6. Write Operation Status ..................................................... 25

Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 26

Figure 7. Maximum Negative Overshoot Waveform Maximum

Negative Overshoot Waveform ...................................................... 26

Figure 8. Maximum Positive Overshoot Waveform........................ 26

Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 26

DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 7. CMOS Compatible ........................................................... 27

Zero Power Flash ................................................................... 28

Figure 9. I

CC1

Current vs. Time (Showing Active and Automatic

Sleep Currents) .............................................................................. 28

Figure 10. Typical I

CC1

vs. Frequency ........................................... 28

Word/Byte Configuration ........................................................ 10

Requirements for Reading Array Data ................................... 10

Writing Commands/Command Sequences ............................ 10

Program and Erase Operation Status .................................... 11

Standby Mode ........................................................................ 11

Automatic Sleep Mode ........................................................... 11

RESET#: Hardware Reset Pin ............................................... 11

Output Disable Mode .............................................................. 12

Table 2. Am29SL800DT Top Boot Block Sector Address Table .....12

Table 3. Am29SL800DB Bottom Boot Block Sector

Address Table .................................................................................13

Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Figure 11. Test Setup..................................................................... 29

Table 8. Test Specifications ........................................................... 29

Table 9. Key to Switching Waveforms ........................................... 29

Figure 12. Input Waveforms and Measurement Levels ................. 29

AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 30

Table 10. Read Operations ............................................................ 30

Figure 13. Read Operations Timings ............................................. 30

Table 11. Hardware Reset (RESET#) ............................................ 31

Figure 14. RESET# Timings .......................................................... 31

Table 12. Word/Byte Configuration (BYTE#) ................................. 32

Figure 15. BYTE# Timings for Read Operations............................ 32

Figure 16. BYTE# Timings for Write Operations............................ 32

Table 13. Erase/Program Operations ............................................ 33

Figure 17. Program Operation Timings.......................................... 34

Figure 18. Chip/Sector Erase Operation Timings .......................... 35

Figure 19. Data# Polling Timings (During Embedded Algorithms). 36

Figure 20. Toggle Bit Timings (During Embedded Algorithms)...... 36

Figure 21. DQ2 vs. DQ6................................................................. 37

Table 14. Temporary Sector Unprotect .......................................... 37

Figure 22. Temporary Sector Unprotect Timing Diagram .............. 37

Figure 23. Sector Protect/Unprotect Timing Diagram .................... 38

Table 15. Alternate CE# Controlled Erase/Program Operations .... 39

Figure 24. Alternate CE# Controlled Write Operation Timings ...... 40

Table 16. Erase and Programming Performance ........................... 40

Table 17. Latchup Characteristics .................................................. 41

Table 18. TSOP Pin Capacitance .................................................. 41

Table 19. Data Retention ............................................................... 41

Autoselect Mode ..................................................................... 14

Table 4. Am29SL800D Autoselect Code (High Voltage Method) ...14

Sector Protection/Unprotection ............................................... 14

Temporary Sector Unprotect .................................................. 14

Figure 1. In-System Sector Protect/Unprotect Algorithms .............. 15

Figure 2. Temporary Sector Unprotect Operation........................... 16

Hardware Data Protection ...................................................... 16

Command Definitions . . . . . . . . . . . . . . . . . . . . . 16

Reading Array Data ................................................................ 16

Reset Command ..................................................................... 16

Autoselect Command Sequence ............................................ 17

Word/Byte Program Command Sequence ............................. 17

Figure 3. Program Operation .......................................................... 18

Chip Erase Command Sequence ........................................... 18

Sector Erase Command Sequence ........................................ 18

Erase Suspend/Erase Resume Commands ........................... 19

Figure 4. Erase Operation............................................................... 20

Table 5. Am29SL800D Command Definitions ................................20

Write Operation Status . . . . . . . . . . . . . . . . . . . . 21

DQ7: Data# Polling ................................................................. 21

Figure 5. Data# Polling Algorithm ................................................... 22

RY/BY#: Ready/Busy# ........................................................... 23

DQ6: Toggle Bit I .................................................................... 23

DQ2: Toggle Bit II ................................................................... 23

Reading Toggle Bits DQ6/DQ2 .............................................. 23

Figure 6. Toggle Bit Algorithm......................................................... 24

DQ5: Exceeded Timing Limits ................................................ 24

DQ3: Sector Erase Timer ....................................................... 24

Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 42

TS 048–48-Pin Standard TSOP ............................................. 42

TSR048–48-Pin Reverse TSOP ............................................. 43

FBA048–48-Ball Fine-Pitch Ball Grid Array (FBGA)

6 x 8 mm package .................................................................. 44

FBC048 – 48-Ball Fine-Pitch Ball Grid Array (FBGA)

8 x 9 mm package .................................................................. 45

VBK 048 - 48 Ball Fine-Pitch Ball Grid Array (FBGA) ............. 46

8.15 x 6.15 mm ....................................................................... 46

Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 47

Am29SL800D

April 27, 2005

AM29SL800DB-150WAC

AM29SL800DB-150WAC概述

AM29SL800DB-150WAC规格参数

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