Hermetically Sealed, Low I
F
,
Wide V
CC
, High Gain
Optocouplers
Technical Data
6N140A*
HCPL-675X
83024
HCPL-570X
HCPL-177K
5962-89810
HCPL-573X
HCPL-673X
5962-89785
5962-98002
*See matrix for available extensions.
Features
• Dual Marked with Device
Part Number and DSCC
Drawing Number
• Manufactured and Tested on
a MIL-PRF-38534 Certified
Line
• QML-38534, Class H and K
• Five Hermetically Sealed
Package Configurations
• Performance Guaranteed,
Over -55
°
C to +125
°
C
• Low Input Current
Requirement: 0.5 mA
• High Current Transfer
Ratio: 1500% Typical @
I
F
= 0.5 mA
• Low Output Saturation
Voltage: 0.11 V Typical
• 1500 Vdc Withstand Test
Voltage
• High Radiation Immunity
• 6N138/9, HCPL-2730/31
Function Compatibility
• Reliability Data
• Isolated Input Line Receiver
• EIA RS-232-C Line Receiver
• Voltage Level Shifting
• Isolated Input Line Receiver
• Isolated Output Line Driver
• Logic Ground Isolation
• Harsh Industrial Environments
• Current Loop Receiver
• System Test Equipment
Isolation
• Process Control
Input/Output Isolation
both lower saturation voltage and
higher signaling speed than
possible with conventional photo-
Darlington optocouplers. The
shallow depth and small junctions
offered by the IC process
provides better radiation
immunity than conventional
photo transistor optocouplers.
The supply voltage can be
operated as low as 2.0 V without
adversely affecting the
parametric performance.
Description
These units are single, dual, and
quad channel, hermetically sealed
optocouplers. The products are
capable of operation and storage
over the full military temperature
range and can be purchased as
either standard product or with
full MIL-PRF-38534 Class Level
H or K testing or from the appro-
priate DSCC Drawing. All devices
are manufactured and tested on a
MIL-PRF-38534 certified line and
are included in the DSCC Quali-
fied Manufacturers List QML-
38534 for Hybrid Microcircuits.
Each channel contains a GaAsP
light emitting diode which is
optically coupled to an integrated
high gain photon detector. The
high gain output stage features
an open collector output providing
Truth Table
(Positive Logic)
Input
On (H)
Off (L)
Output
L
H
Functional Diagram
Multiple Channel Devices
Available
1
V
CC
8
Applications
•
•
•
•
Military and Space
High Reliability Systems
Telephone Ring Detection
Microprocessor System
Interface
• Transportation, Medical, and
Life Critical Systems
2
3
4
V
OUT
7
6
5
GND
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
These devices have a 300%
minimum CTR at an input current
of only 0.5 mA making them ideal
for use in low input current
applications such as MOS, CMOS,
low power logic interfaces or line
receivers. Compatibility with high
voltage CMOS logic systems is
assured by specifying I
CCH
and
I
OH
at 18 Volts.
Upon special request, the follow-
ing device selections can be
made: CTR minimum of up to
600% at 0.5 mA, and lower
output leakage current levels to
100
µA.
Package styles for these parts are
8 and 16 pin DIP through hole
(case outlines P and E respec-
tively), 16 pin DIP flat pack (case
outline F), and leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options. See Selection Guide
table for details. Standard
Military Drawing (SMD) parts are
available for each package and
lead style.
Because the same electrical die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are similar for all parts
except as noted. Additionally, the
same package assembly processes
and materials are used in all
devices. These similarities justify
the use of a common data base
for die related reliability and
certain limited radiation test
results.
Selection Guide-Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
HP Part # & Options
Commercial
MIL-PRF-38534 Class H
MIL-PRF-38534 Class K
Standard Lead Finish
Solder Dipped
Butt Cut/Gold Plate
Gull Wing/Soldered
Crew Cut/Gold Plate
Class H SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
Crew Cut/Gold Plate
Crew Cut/Soldered
Class K SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
Crew Cut/Gold Plate
Crew Cut/Soldered
*JEDEC registered part.
16 pin DIP
Through Hole
4
V
CC
, GND
6N140A*
6N140A/883B
HCPL-177K
Gold Plate
Option #200
Option #100
Option #300
Option #600
None
8302401EX
8302401EC
8302401EA
8302401YC
8302401YA
8302401XA
8302401ZC
8302401ZA
5962-
9800201KEX
9800201KEC
9800201KEA
9800201KYC
9800201KYA
9800201KXA
9800201KZC
9800201KZA
8 pin DIP
Through Hole
1
None
HCPL-5700
HCPL-5701
HCPL-570K
Gold Plate
Option #200
Option #100
Option #300
Option #600
5962-
8981001PX
8981001PC
8981001PA
8981001YC
8981001YA
8981001XA
Available
Available
5962-
8981002KPX
8981002KPC
8981002KPA
8981002KYC
8981002KYA
8981002KXA
Available
Available
8 pin DIP
Through Hole
2
V
CC
, GND
HCPL-5730
HCPL-5731
HCPL-573K
Gold Plate
Option #200
Option #100
Option #300
Option #600
5962-
8978501PX
8978501PC
8978501PA
8978501YC
8978501YA
8978501ZA
Available
Available
5962-
8978503KPX
8978503KPC
8978503KPA
8978503KYC
8978503KYA
8978503KZA
Available
Available
16 pin
Flat Pack
Unformed Leads
4
V
CC
, GND
HCPL-6750
HCPL-6751
HCPL-675K
Gold Plate
20 Pad
LCCC
Surface Mount
2
None
HCPL-6730
HCPL-6731
HCPL-673K
Solder Pads
None
8302401FX
8302401FC
5962-
89785022X
89785022A
5962-
9800201KFX
9800201KFC
5962-
8978504K2X
8978504K2A
3
Functional Diagrams
16 pin DIP
Through Hole
4 Channels
1
8 pin DIP
Through Hole
1 Channel
V
CC
8
8 pin DIP
Through Hole
2 Channels
1
V
CC
V
O1
V
O2
8
16 pin Flat Pack
Unformed Leads
4 Channels
20 Pad LCCC
Surface Mount
2 Channels
15
V
CC2
1
16
2
1
16
19
20
V
O2
GND
2
V
O1
GND
1
V
CC1
13
12
7
V
OUT
6
5
2
3
4
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
3
2
3
4
7
6
5
2
3
4
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
2
14
13
10
14
4
3
13
GND
GND
7
12
8
5
12
5
6
7
8
11
10
9
6
7
8
11
10
9
Note: All DIP and flat pack devices have common V
CC
and ground. LCCC (leadless ceramic chip carrier) package has isolated channels
with separate V
CC
and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 4 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Leaded Device Marking
HP LOGO
HP P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
HP QYYWWZ
XXXXXX
XXXXXXX
XXX USA
50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
HP FSCN*
Leadless Device Marking
HP P/N
PIN ONE/
ESD IDENT
HP QYYWWZ
XXXXXX
XXXX
XXXXXX
USA 50434
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DSCC SMD*
DSCC SMD*
HP FSCN*
•
•
*QUALIFIED PARTS ONLY
*QUALIFIED PARTS ONLY
4
Outline Drawings
(continued)
16 Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
1.27 (0.050)
REF.
11.13 (0.438)
10.72 (0.422)
0.46 (0.018)
0.36 (0.014)
8.13 (0.320)
MAX.
2.85 (0.112)
MAX.
0.88 (0.0345)
MIN.
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
9.02 (0.355)
8.76 (0.345)
0.31 (0.012)
0.23 (0.009)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
0.64
(0.025)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
5
Hermetic Optocoupler Options
Option
100
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel
product in 8 and 16 pin DIP. DSCC Drawing part numbers contain provisions for lead finish. All leadless
chip carrier devices are delivered with solder dipped terminals as a standard feature.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This
option has solder dipped leads.
4.57 (0.180)
MAX.
300
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5° MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
600
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). Contact
factory for the availability of this option on DSCC part types.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.25 (0.049)
7.36 (0.290)
7.87 (0.310)
3.81 (0.150)
MAX.
0.51 (0.020)
MIN.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.02 (0.040)
TYP.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
