UV PLD, 25ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44
| 参数名称 | 属性值 |
| 零件包装代码 | LCC |
| 包装说明 | QCCJ, |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最大时钟频率 | 31 MHz |
| JESD-30 代码 | S-CQCC-J44 |
| 长度 | 16.5862 mm |
| 专用输入次数 | 13 |
| I/O 线路数量 | 24 |
| 端子数量 | 44 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 13 DEDICATED INPUTS, 24 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 可编程逻辑类型 | UV PLD |
| 传播延迟 | 25 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 4.57 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 16.5862 mm |
| Base Number Matches | 1 |

| 5962-9154506MYX | 5962-9154505MXX | 5962-9154506MXX | 232F-391-HTW | 5962-9154504MYX | 5962-9154507MQA | 5962-9154505MYX | 5962-9154506MQA | 5962-9154504MXX | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | UV PLD, 25ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | UV PLD, 20ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | UV PLD, 25ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | Fixed Resistor, Wire Wound, 3W, 390ohm, 60V, 3% +/-Tol, 20ppm/Cel, | UV PLD, 15ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | UV PLD, 30ns, 24-Cell, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 | UV PLD, 20ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 | UV PLD, 25ns, 24-Cell, CMOS, CDIP40, 0.600 INCH, WINDOWED, CERDIP-40 | UV PLD, 15ns, CMOS, CQCC44, WINDOWED, CERAMIC, LCC-44 |
| Reach Compliance Code | unknown | unknown | unknown | compliant | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | EAR99 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 端子数量 | 44 | 44 | 44 | 2 | 44 | 40 | 44 | 40 | 44 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 350 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装形状 | SQUARE | SQUARE | SQUARE | CYLINDRICAL PACKAGE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | Axial | CHIP CARRIER | IN-LINE, WINDOW | CHIP CARRIER | IN-LINE, WINDOW | CHIP CARRIER |
| 技术 | CMOS | CMOS | CMOS | WIRE WOUND | CMOS | CMOS | CMOS | CMOS | CMOS |
| 零件包装代码 | LCC | LCC | LCC | - | LCC | DIP | LCC | DIP | LCC |
| 包装说明 | QCCJ, | QCCN, | QCCN, | - | QCCJ, | WDIP, DIP40,.6 | QCCJ, | WDIP, DIP40,.6 | QCCN, |
| 针数 | 44 | 44 | 44 | - | 44 | 40 | 44 | 40 | 44 |
| 最大时钟频率 | 31 MHz | 40 MHz | 31 MHz | - | 52 MHz | 26 MHz | 40 MHz | 31 MHz | 52 MHz |
| JESD-30 代码 | S-CQCC-J44 | S-CQCC-N44 | S-CQCC-N44 | - | S-CQCC-J44 | R-GDIP-T40 | S-CQCC-J44 | R-GDIP-T40 | S-CQCC-N44 |
| 长度 | 16.5862 mm | 16.51 mm | 16.51 mm | - | 16.5862 mm | 52.45 mm | 16.5862 mm | 52.45 mm | 16.51 mm |
| 专用输入次数 | 13 | 13 | 13 | - | 13 | 13 | 13 | 13 | 13 |
| I/O 线路数量 | 24 | 24 | 24 | - | 24 | 24 | 24 | 24 | 24 |
| 组织 | 13 DEDICATED INPUTS, 24 I/O | 13 DEDICATED INPUTS, 24 I/O | 13 DEDICATED INPUTS, 24 I/O | - | 13 DEDICATED INPUTS, 24 I/O | 13 DEDICATED INPUTS, 24 I/O | 13 DEDICATED INPUTS, 24 I/O | 13 DEDICATED INPUTS, 24 I/O | 13 DEDICATED INPUTS, 24 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | - | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ | QCCN | QCCN | - | QCCJ | WDIP | QCCJ | WDIP | QCCN |
| 可编程逻辑类型 | UV PLD | UV PLD | UV PLD | - | UV PLD | UV PLD | UV PLD | UV PLD | UV PLD |
| 传播延迟 | 25 ns | 20 ns | 25 ns | - | 15 ns | 30 ns | 20 ns | 25 ns | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 4.57 mm | 3.05 mm | 3.05 mm | - | 4.57 mm | 5.72 mm | 4.57 mm | 5.72 mm | 3.05 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | - | YES | NO | YES | NO | YES |
| 温度等级 | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | J BEND | NO LEAD | NO LEAD | - | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | QUAD | QUAD | - | QUAD | DUAL | QUAD | DUAL | QUAD |
| 宽度 | 16.5862 mm | 16.51 mm | 16.51 mm | - | 16.5862 mm | 15.24 mm | 16.5862 mm | 15.24 mm | 16.51 mm |
| Base Number Matches | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 厂商名称 | - | Atmel (Microchip) | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
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