AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 包装说明 | QCCN, |
| Reach Compliance Code | unknown |
| 系列 | AC |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 位数 | 6 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 传播延迟(tpd) | 10 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.905 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 8.89 mm |
| 最小 fmax | 90 MHz |
| Base Number Matches | 1 |
| 5962-87626012X | 74ACT174SJQR | 5962-8762601EX | 5962-8762601FX | 74AC174SJQR | |
|---|---|---|---|---|---|
| 描述 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, EIAJ, SOIC-16 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP16, CERAMIC, DIP-16 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP16, CERAMIC, FP-16 | AC SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDSO16, EIAJ, SOIC-16 |
| 包装说明 | QCCN, | SOP, | DIP, | DFP, | SOP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
| 系列 | AC | - | AC | AC | AC |
| JESD-30 代码 | S-CQCC-N20 | - | R-GDIP-T16 | R-GDFP-F16 | R-PDSO-G16 |
| 长度 | 8.89 mm | - | 19.43 mm | 9.6645 mm | 10.11 mm |
| 逻辑集成电路类型 | D FLIP-FLOP | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 6 | - | 6 | 6 | 6 |
| 功能数量 | 1 | - | 1 | 1 | 1 |
| 端子数量 | 20 | - | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | - | -55 °C | -55 °C | -40 °C |
| 输出极性 | TRUE | - | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | QCCN | - | DIP | DFP | SOP |
| 封装形状 | SQUARE | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | - | IN-LINE | FLATPACK | SMALL OUTLINE |
| 传播延迟(tpd) | 10 ns | - | 10 ns | 10 ns | 9 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.905 mm | - | 5.08 mm | 2.032 mm | 2.108 mm |
| 最大供电电压 (Vsup) | 6 V | - | 6 V | 6 V | 6 V |
| 最小供电电压 (Vsup) | 2 V | - | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V |
| 表面贴装 | YES | - | NO | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | - | MILITARY | MILITARY | INDUSTRIAL |
| 端子形式 | NO LEAD | - | THROUGH-HOLE | FLAT | GULL WING |
| 端子节距 | 1.27 mm | - | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | - | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 8.89 mm | - | 7.62 mm | 6.604 mm | 5.3 mm |
| 最小 fmax | 90 MHz | - | 90 MHz | 90 MHz | 100 MHz |
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