0.6 A BUF OR INV BASED PRPHL DRVR, PDSO5
| 参数名称 | 属性值 |
| Brand Name | Fairchild Semiconduc |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Fairchild |
| 零件包装代码 | SOT-23 |
| 包装说明 | LSSOP, TSOP5/6,.11,37 |
| 针数 | 5 |
| 制造商包装代码 | 5LD, SOT23, JEDEC MO-178, 1.6MM |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| Samacsys Descripti | ON Semiconductor FPF2104 Intelligent Power Switch, MOSFET Load Switch, 800mA, 1.8 → 5.5V, 667mW 5-Pin, SOT-23 |
| 内置保护 | TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE |
| 驱动器位数 | 1 |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDSO-G5 |
| JESD-609代码 | e4 |
| 长度 | 2.9 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 5 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出电流流向 | SOURCE |
| 最大输出电流 | 200 A |
| 标称输出峰值电流 | 0.6 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LSSOP |
| 封装等效代码 | TSOP5/6,.11,37 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 1.8/5.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.4 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 1.8 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1.6 mm |
| FPF2104 | FPF2106 | FPF2107 | |
|---|---|---|---|
| 描述 | 0.6 A BUF OR INV BASED PRPHL DRVR, PDSO5 | 0.6 A BUF OR INV BASED PRPHL DRVR, PDSO5 | 0.6 A BUF OR INV BASED PRPHL DRVR, PDSO5 |
| Brand Name | Fairchild Semiconduc | Fairchild Semiconduc | Fairchild Semiconduc |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 |
| 厂商名称 | Fairchild | Fairchild | Fairchild |
| 零件包装代码 | SOT-23 | SOT-23 | SOT-23 |
| 包装说明 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 | LSSOP, TSOP5/6,.11,37 |
| 针数 | 5 | 5 | 5 |
| 制造商包装代码 | 5LD, SOT23, JEDEC MO-178, 1.6MM | 5LD, SOT23, JEDEC MO-178, 1.6MM | 5LD, SOT23, JEDEC MO-178, 1.6MM |
| Reach Compliance Code | compli | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 内置保护 | TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE | TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE | TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE |
| 驱动器位数 | 1 | 1 | 1 |
| 接口集成电路类型 | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | BUFFER OR INVERTER BASED PERIPHERAL DRIVER |
| JESD-30 代码 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
| JESD-609代码 | e4 | e4 | e4 |
| 长度 | 2.9 mm | 2.9 mm | 2.9 mm |
| 湿度敏感等级 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 5 | 5 | 5 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C |
| 输出电流流向 | SOURCE | SOURCE | SOURCE |
| 最大输出电流 | 200 A | 200 A | 200 A |
| 标称输出峰值电流 | 0.6 A | 0.6 A | 0.6 A |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LSSOP | LSSOP | LSSOP |
| 封装等效代码 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 |
| 电源 | 1.8/5.5 V | 1.8/5.5 V | 1.8/5.5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 1.8 V | 1.8 V | 1.8 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.95 mm | 0.95 mm | 0.95 mm |
| 端子位置 | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 1.6 mm | 1.6 mm | 1.6 mm |
| Samacsys Descripti | ON Semiconductor FPF2104 Intelligent Power Switch, MOSFET Load Switch, 800mA, 1.8 → 5.5V, 667mW 5-Pin, SOT-23 | ON Semiconductor FPF2106 Intelligent Power Switch, MOSFET Load Switch, 800mA, 1.8 → 5.5V, 667mW 5-Pin, SOT-23 | - |
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