Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PDIP64
| 参数名称 | 属性值 |
| 厂商名称 | SANYO |
| 包装说明 | SDIP, SDIP64,.75 |
| Reach Compliance Code | unknown |
| 位大小 | 8 |
| JESD-30 代码 | R-PDIP-T64 |
| 端子数量 | 64 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | -30 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SDIP |
| 封装等效代码 | SDIP64,.75 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, SHRINK PITCH |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 512 |
| ROM(单词) | 28672 |
| ROM可编程性 | MROM |
| 速度 | 12 MHz |
| 最大压摆率 | 20 mA |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.78 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| LC866028B(64DIP) | LC866024B(64DIP) | LC866032B(64DIP) | LC866032B(64QFP) | LC866028B(64QFP) | LC866024B(64QFP) | |
|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PDIP64 | Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PDIP64 | Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PDIP64 | Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PQFP64 | Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PQFP64 | Microcontroller, 8-Bit, MROM, 12MHz, CMOS, PQFP64 |
| 厂商名称 | SANYO | SANYO | SANYO | SANYO | SANYO | SANYO |
| 包装说明 | SDIP, SDIP64,.75 | SDIP, SDIP64,.75 | SDIP, SDIP64,.75 | QFP, QFP64,.66SQ,32 | QFP, QFP64,.66SQ,32 | QFP, QFP64,.66SQ,32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-PDIP-T64 | R-PDIP-T64 | R-PDIP-T64 | S-PQFP-G64 | S-PQFP-G64 | S-PQFP-G64 |
| 端子数量 | 64 | 64 | 64 | 64 | 64 | 64 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C | -30 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SDIP | SDIP | SDIP | QFP | QFP | QFP |
| 封装等效代码 | SDIP64,.75 | SDIP64,.75 | SDIP64,.75 | QFP64,.66SQ,32 | QFP64,.66SQ,32 | QFP64,.66SQ,32 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE |
| 封装形式 | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | FLATPACK | FLATPACK | FLATPACK |
| 电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM(字节) | 512 | 512 | 512 | 512 | 512 | 512 |
| ROM(单词) | 28672 | 24576 | 32768 | 32768 | 28672 | 24576 |
| ROM可编程性 | MROM | MROM | MROM | MROM | MROM | MROM |
| 速度 | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
| 最大压摆率 | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
| 表面贴装 | NO | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.78 mm | 1.78 mm | 1.78 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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