05180
PKFC3.3C*
thru
Only One Name Means ProT
ek’Tion™
PKFC36C*
PACKAGED FLIP CHIP ARRA
Y
APPLICA
TIONS
✔
Cellular Phones
✔
MCM Boards
✔
Wireless Communication Circuits
✔
IR LEDs
✔
SMART & PCMCIA Cards
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
✔
CHIP SCALE PACKAGE 0.050” (1.270mm) x 0.030” (0.762mm)
✔
ESD Protection > 25 kilovolts
✔
Available in Multiple Voltage Types Ranging From 3.3V to 36V
✔
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔
Bidirectional Configuration & Monolithic Structure
✔
Protects 1 Line
✔
RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔
Encapsulated 0502 Chip
✔
Weight 0.73 milligrams (Approximate)
✔
Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed)
✔
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Pure-Tin - Sn, 100: 260-270°C
✔
Flammability Rating UL 94V-0
✔
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔
Device Marking On Reel
PIN CONFIGURA
TION
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PKFC3.3C*
thru
PKFC36C*
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
T
J
T
STG
VALUE
250
-55°C to 150°C
-55°C to 150°C
UNITS
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
7.0
9.8
13.4
19.0
24.0
43.0
64.0
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
µA
75*
10**
10***
1
1
1
1
TYPICAL
CAPACITANCE
V
WM
VOLTS
PKFC3.3C
PKFC05C
PKFC08C
PKFC12C
PKFC15C
PKFC24C
PKFC36C
3.3
5.0
8.0
12.0
15.0
24.0
36.0
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
40.0
@8/20µs
V
C
@ I
PP
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
@0V, 1 MHz
C
pF
150
100
75
50
40
30
25
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2:
*Typical leakage current < 5µA @ 2.8V. **Typical leakage current <500nA @ 3.3V. ***Typical leakage current <200nA @ 5V.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
I
PP
- Peak Pulse Current - % of I
PP
P
PP
- Peak Pulse Current - Watts
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
1,000
250W, 8/20µs Waveform
e
-t
100
t
d
= t I /2
PP
10
0.01
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
0
5
10
15
t - Time - µs
20
25
30
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PKFC3.3C*
thru
PKFC36C*
GRAPHS
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20µs
100
80
% Of Rated Power
60
40
20
Average Power
0
0
25
50
75
100
125
T
L
- Lead Temperature - °C
150
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C
14
12
10
8
6
4
2
0
0
5
10
I
PP
- Peak Pulse Current - Amps
*PA
TENT PENDING
V
C
- Clamping Voltage - Volts
15
20
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PKFC36C*
APPLICA
TION INFORMA
TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-265°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T
P
Ramp-up
Temperature - °C
Ramp-down
T
L
T
SMAX
155°
T
SMIN
140°
T
S
- Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
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PKFC36C*
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
PACKAGE DIMENSIONS
DIM
A
H
C
MILLIMETERS
0.838
1.245
0.762
0.533
0.228
0.533
0.305
0.432
0.432
0.355
INCHES
0.033
0.049
0.030
0.021
0.009
0.021
0.012
0.017
0.017
0.014
D
K
TOP
B
BOTTOM
E
SIDE
A
B
C
D
E
F
G
H
J
K
NOTES
J
F
G
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad : ± 0.003”
(± 0.08mm).
3. Maximum size: 0.052” (1.321mm) by 0.036”
(0.914mm).
4. All dimensions ±0.003” on package outline.
MOUNTING PAD
DIM
A
PAD DIMENSIONS
MILLIMETERS
1.016
0.635
1.473
0.203
0.508
0.343
0.343
INCHES
0.040
0.025
0.058
0.008
0.020
0.0135
0.0135
G
B
A
B
C
E
F
G
J
T
APE & REEL ORIENT TION
A
F
E
C
Package Outline
J
Package Contact Pads
Solder Print Diameter
0.010” - 0.012”
NOTE
1. Top view of tape. Solder PADS face down in tape
package.
TAPE & REEL ORDERING NOMENCLATURE
1.
2.
3.
4.
Surface mount product is taped and reeled in accordance with EIA 481.
8mm Plastic Tape:
7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., PKFC05C-T75-1).
8mm Paper Tape:
7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., PKFC05C-T75-2).
Suffix - LF = Lead-Free, Pure-Tin Plating, i.e.,
PKFC05C-LF-T75-2.
Outline & Dimensions: Rev 1 - 8/03, 06040
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
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